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Eur. Phys. J. Appl. Phys. (2013) 64: 20302
DOI: 10.1051/epjap/2013130445
THE EUROPEAN
PHYSICAL JOURNAL
APPLIED PHYSICS
Regular Article
AlN thin films deposited by DC reactive magnetron sputtering:
effect of oxygen on film growth
Javier Garc´ıa Molleja1,2,a
, Bernardo Jos´e G´omez2
, Julio Ferr´on3
, Eric Gautron1
, Juan B¨urgi2
, Bassam Abdallah1,4
,
Mohamed Abdou Djouadi1
, Jorge Feugeas2
, and Pierre-Yves Jouan1
1
Institut des Mat´eriaux Jean Rouxel (IMN – Universit´e de Nantes, UMR CNRS 6502), 2 rue de la Houssini`ere, BP 322298,
44322 Nantes Cedex 3, France
2
Instituto de F´ısica Rosario (CONICET-UNR), 27 de Febrero 210 bis, S2000EZP, Rosario, Argentina
3
Instituto de Desarrollo Tecnol´ogico para la Industria Qu´ımica (INTEC-UNL), G¨uemes 3450, S3000GLN, Santa Fe, Argentina
4
Physics Department, Atomic Energy Commission of Syria (AECS), 17th Nissan street, Kafar Soh, BP 6091, Damascus, Syria
Received: 26 September 2013 / Accepted: 3 October 2013
Published online: 15 November 2013 – c EDP Sciences 2013
Abstract. Aluminum nitride is a ceramic compound with many technological applications in many fields,
for example optics, electronics and resonators. Contaminants play a crucial role in the AlN performance.
This paper focuses mainly in the effect of oxygen when AlN, with O impurities in its structure, is grown
on oxidized layers. In this study, AlN thin films have been deposited at room temperature and low residual
vacuum on SiO2/Si (1 0 0) substrates. AlN films were grown by DC reactive magnetron sputtering (alu-
minum target) and atmosphere composed by an argon/nitrogen mixture. Working pressure was 3 mTorr.
Film characterization was performed by AES, XRD, SEM, EDS, FTIR, HRTEM, SAED and band-bending
method. Our results show that oxidized interlayer imposes compressive stresses to AlN layer, developing
a polycrystalline deposition. Indeed, when film thickness is over 900 nm, influence of oxidized interlayer
diminishes and crystallographic orientation changes to the (0 0 0 2) one, i.e., columnar structure, and stress
relief is induced (there is a transition from compressive to tensile stress). Also, we propose a growth scenario
to explain this behaviour.
1 Introduction
Aluminum nitride (AlN) is a material particularly inter-
esting when it is used as thin film coating. This III-V
compound has various technological and industrial ap-
plications such as: optics [1], mechanics [2] or electron-
ics [3,4]. In the field of electronics there is a particular
interest because of AlN has a semiconductor behaviour
when is doped, but it has excellent dielectric properties
when doping is avoided [5]. Moreover, AlN is a piezoelec-
tric material with a high sound speed [6]. Aluminum ni-
tride, with a density of 3.3 g/cm3
, is one of the best mate-
rials generating vibrations at very high frequencies. This
is the reason for the good surface acoustic waves (SAW)
propagation in AlN thin films, and their adaptation for
the construction of bulk acoustic wave resonator (FBAR)
devices, high-pass filters and pressure gauges [7–9] with
them.
Among published works dedicated to synthesis of AlN
thin films, several physical methods such as pulse laser
deposition (PLD) [10] and more recently high-power im-
pulse magnetron sputtering (HiPIMS) [11,12] have been
a
e-mail: javier.garcia-molleja@cnrs-imn.fr
used. In this study, the “classical” PVD (plasma vapour
deposition) technique, based on the use of a magnetron de-
vice [13–15], was selected since well-crystallised films can
be synthesized with this technique at low temperatures
with high deposition rates. Indeed, PVD is also compati-
ble with typical industrial processes used to the date.
However, the problem of oxygen addition in the struc-
ture, is still a matter of interest. For example, oxygen
plays a crucial role concerning to the electrical and optical
properties [16]. Moreover, interface oxides induce residual
stresses to the film deposited over them. Thus, it could
be interesting to know how O affects the columnar de-
velopment in AlN films and the evolution of the related
residual stresses. These questions are important in the in-
dustrial community, due to the poor vacuum control in
the huge coating reactors employed and the cost to obtain
ultra-clean substrates.
In this paper, we have studied how residual oxygen has
an effect to growth process in AlN films deposited over ox-
idized substrates. Besides, we have analysed the relation-
ship between residual stress development and crystallo-
graphic orientation [17]. Finally, a growth scenario which
attempts to describe the growing process under this con-
ditions is proposed.
20302-p1

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AlN thin films deposited by DC reactive magnetron sputtering: effect of oxygen on film growth

  • 1. Eur. Phys. J. Appl. Phys. (2013) 64: 20302 DOI: 10.1051/epjap/2013130445 THE EUROPEAN PHYSICAL JOURNAL APPLIED PHYSICS Regular Article AlN thin films deposited by DC reactive magnetron sputtering: effect of oxygen on film growth Javier Garc´ıa Molleja1,2,a , Bernardo Jos´e G´omez2 , Julio Ferr´on3 , Eric Gautron1 , Juan B¨urgi2 , Bassam Abdallah1,4 , Mohamed Abdou Djouadi1 , Jorge Feugeas2 , and Pierre-Yves Jouan1 1 Institut des Mat´eriaux Jean Rouxel (IMN – Universit´e de Nantes, UMR CNRS 6502), 2 rue de la Houssini`ere, BP 322298, 44322 Nantes Cedex 3, France 2 Instituto de F´ısica Rosario (CONICET-UNR), 27 de Febrero 210 bis, S2000EZP, Rosario, Argentina 3 Instituto de Desarrollo Tecnol´ogico para la Industria Qu´ımica (INTEC-UNL), G¨uemes 3450, S3000GLN, Santa Fe, Argentina 4 Physics Department, Atomic Energy Commission of Syria (AECS), 17th Nissan street, Kafar Soh, BP 6091, Damascus, Syria Received: 26 September 2013 / Accepted: 3 October 2013 Published online: 15 November 2013 – c EDP Sciences 2013 Abstract. Aluminum nitride is a ceramic compound with many technological applications in many fields, for example optics, electronics and resonators. Contaminants play a crucial role in the AlN performance. This paper focuses mainly in the effect of oxygen when AlN, with O impurities in its structure, is grown on oxidized layers. In this study, AlN thin films have been deposited at room temperature and low residual vacuum on SiO2/Si (1 0 0) substrates. AlN films were grown by DC reactive magnetron sputtering (alu- minum target) and atmosphere composed by an argon/nitrogen mixture. Working pressure was 3 mTorr. Film characterization was performed by AES, XRD, SEM, EDS, FTIR, HRTEM, SAED and band-bending method. Our results show that oxidized interlayer imposes compressive stresses to AlN layer, developing a polycrystalline deposition. Indeed, when film thickness is over 900 nm, influence of oxidized interlayer diminishes and crystallographic orientation changes to the (0 0 0 2) one, i.e., columnar structure, and stress relief is induced (there is a transition from compressive to tensile stress). Also, we propose a growth scenario to explain this behaviour. 1 Introduction Aluminum nitride (AlN) is a material particularly inter- esting when it is used as thin film coating. This III-V compound has various technological and industrial ap- plications such as: optics [1], mechanics [2] or electron- ics [3,4]. In the field of electronics there is a particular interest because of AlN has a semiconductor behaviour when is doped, but it has excellent dielectric properties when doping is avoided [5]. Moreover, AlN is a piezoelec- tric material with a high sound speed [6]. Aluminum ni- tride, with a density of 3.3 g/cm3 , is one of the best mate- rials generating vibrations at very high frequencies. This is the reason for the good surface acoustic waves (SAW) propagation in AlN thin films, and their adaptation for the construction of bulk acoustic wave resonator (FBAR) devices, high-pass filters and pressure gauges [7–9] with them. Among published works dedicated to synthesis of AlN thin films, several physical methods such as pulse laser deposition (PLD) [10] and more recently high-power im- pulse magnetron sputtering (HiPIMS) [11,12] have been a e-mail: javier.garcia-molleja@cnrs-imn.fr used. In this study, the “classical” PVD (plasma vapour deposition) technique, based on the use of a magnetron de- vice [13–15], was selected since well-crystallised films can be synthesized with this technique at low temperatures with high deposition rates. Indeed, PVD is also compati- ble with typical industrial processes used to the date. However, the problem of oxygen addition in the struc- ture, is still a matter of interest. For example, oxygen plays a crucial role concerning to the electrical and optical properties [16]. Moreover, interface oxides induce residual stresses to the film deposited over them. Thus, it could be interesting to know how O affects the columnar de- velopment in AlN films and the evolution of the related residual stresses. These questions are important in the in- dustrial community, due to the poor vacuum control in the huge coating reactors employed and the cost to obtain ultra-clean substrates. In this paper, we have studied how residual oxygen has an effect to growth process in AlN films deposited over ox- idized substrates. Besides, we have analysed the relation- ship between residual stress development and crystallo- graphic orientation [17]. Finally, a growth scenario which attempts to describe the growing process under this con- ditions is proposed. 20302-p1