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Improving Performance of MEMS Designs
    Using Dynamic Characterization




Advancing Measurements by Light • www.polytec.com   1
Polytec Introduction




Eric Lawrence
MEMS Business Development
Manager




Advancing Measurements by Light • www.polytec.com   2
Contents
Introduction to Laser Vibrometry

•Polytec Micro System Analyzer (MSA-500)

•Application: MEMS Comb Drive

•Application: MEMS mmirror

•Application: MEMS / NEMS Cantilever

•Application: Wafer Level Testing Pressure Sensor

•New Ultra High Frequency Vibrometer
Optical Measurement Solutions


Laser Doppler Vibrometers
For non-contact vibration
measurements


Laser Surface Velocimeters
For surface speed and length
measurements


White Light Interferometers
For surface topography
measurements



Advancing Measurements by Light • www.polytec.com
Tools for Vibration Analysis
Polytec Scanning Vibrometer
Data Storage        Fast, accurate
                    visualization and
                    analysis of structural
                    vibration

                                MEMS                         Automotive




                                         Health Monitoring
        Aerospace
                               Micro Electro Mechanical
                               Structures (MEMS)
Challenges and Requirements for MEMS Testing
 Diverse tools available to measure wide range physical properties
 (shape, dimension, film thickness, time response, stress, roughness,
 stiction, resonant frequency, environmental response…)
 High spatial resolution, accuracy and precision required
 Fast response times often require high speed measurement
 techniques
 Spatial complexity (mm – nm) of MEMS challenging for conventional
 techniques
 Wide range of performance criteria among different devices
 Handling and environmental requirements
 Fast measurement speed is critical for high volume production testing
 Reliable techniques that allow scientists and engineers to effectively
 communicate physical properties
Motivation
Why optical measurement of MEMS dynamics?

  MEMS usually involve active moving elements for sensing and
  actuation

  Electrical test can prove if a device is working or not, but……

  Electrical testing can’t determine exact behavior of device

  Need highly sensitive, non-invasive , real-time measurement
 Laser Doppler Vibrometry
Laser Doppler Vibrometry


          Measurement Beam
                 f0


              f0 ± fD                Bragg cell
            Reflected Beam                                 He-Ne Laser
                                                          <1mw (633nm)

   x(t)
   v(t)                             f0 + 40 MHz

            Photo-detector



                      Frequency Modulated
                             signal
                          40 MHz ± fD
                                            Δ fD = 2V/λ
Laser Doppler Vibrometry

 Signal Demodulation

                        FM Doppler signal      Controller
Photo-detector system



                              Voltage ~
                              Velocity




                                AM electrical signal    FFT Spectrum

                               Voltage ~
                               Displacement
Scanning Laser Doppler Vibrometer




  The interferometer is coupled via a fiber into the microscope (MSA)

  A scanning mirrors allows to scan the whole surface point by point
Scanning Laser Doppler Vibrometer

                              Vibration Time Signal




                              sequential measurement at all
                              points. Excitation for all points




         Vibration Spectrum
Advantages of Laser Doppler Vibrometer

• Real Time Measurement: Fast signal-based measurements from
  broadband excitation, can measure transient response

• High Resolution: Displacement resolution down to picometer

• High lateral resolution: Laser spot focused down to 700 nm

• High frequency bandwidth: DC to 24 MHz (1.2 GHz)

• High accuracy: Doppler technique highly accurate and linear

• Can do difficult measurements on range of materials, under
   required environmental conditions, i.e. thru glass into a vacuum
   chamber,  calibration independent of these factors

• Probe Station Integration: Integrates with commercially available
   probe stations for wafer level testing
Advancing Measurements by Light • www.polytec.com
In-plane: Strobe Video Microscopy

Additional Strobe Video Microscopy
Capability for in-plane motion



In-Plane motion of MEMS

    Comb drives

    Gyroscopes

    Accelerometers


Automatically acquires strobe image sets


Pattern Matching to measure displacement


Software tools for analyzing response
Topography: White Light Interferometry


Additional Topography Measurement Capability



Topographical Measurement of:

  Step-Height

  Shape (Curvature, Flatness)

  Roughness

  Form Parameters (Dimensions,

   Angle, Radius)
MSA-500 Micro System Analyzer


                           Combines powerful tools for precise 3D
                           analysis of structural vibration and
                           surface topography:



 •Scanning Laser Vibrometry for fast measurement
 and 3D visualization of out-of-plane deflection
 shapes.

 •Strobe Video Microscopy for capturing and
 analyzing in-plane motion.

 •White Light Interferometry for mapping surface
 topography.
Applications



Advancing Measurements by Light • www.polytec.com
Example: Comb Drive Resonator

 In-plane actuator
 driven by electrostatic
 pulling force

         1 nh 2
       F ε V
         2 g
 Restoring force from
 bifold springs
                            Substituting for Keff and Meff:
  Natural Frequency
                                                  E w3 (1 2 )
  given by:                d                        rL3A eff

   0          K eff
                M eff
                           Where E is Young’s Modulus of Elasticity, w is
                           spring width, r is the density, L is the spring
                           length and Aeff is the effective area of comb drive.
Example: Comb Drive Resonator




Setup:
  Measurements were performed with MSA system at our lab in
  Tustin, CA
  Device + Fixture placed under microscope and positioned into place
  Relatively easy setup for placing chip and locating P6 Comb Drive to
  be measured
  Vibration Isolated Table to minimize background motion
  Device driven from built-in waveform generator and amplifier
Example: Comb Drive Resonator
Frequency Response:
   Set up a grid of approximately
   700 measurement points
   80 Volt Burst Chirp Excitation
   to 2 MHz, 25600 Lines FFT
   Measurement time each spot
   12.8 ms (chirp response)
   Frequency Response Function
   measured for each point
   Automatically Scan
   measurement for all points




    F1 =.0138 MHz


          0.407 MHz    0.527 MHz       0.929 MHz    1.345 MHz
                0.453 MHz                                            1.614 MHz
    0.344 MHz                                1.169 MHz   1.493 MHz
                           0.590 MHz
Example: Comb Drive Resonator



                 1610 KHz




13.8 KHz




                                 Operational
                                 Deflection shapes
                                  Resonance
  526 KHz                        displayed for each
                                  frequency peaks
                                 frequency graphical
                                  selected by
                                 corresponds to a
                                  interface tool
                                 unique mode
Example: Comb Drive Resonator




  Fundamental rigid body resonance at 13.8 KHz
Dynamic Response of Mirror Array
  Courtesy Rick Oden, Texas Instruments



   •Settling time dynamics of whole
   mirror (3D image of time
   sequence)scanning vibrometry




    •Because the heart of the projector
    system is the DMD mirror array – a    Hinge
    thorough understanding of the         Axis
    dynamic motion of the mirrors is
    critical to gauge performance of
    current as well as future
                                            Tilt Motion Direction
    technology directions…
Example: Texas Instruments mdisplay

             • Hermetically sealed Micro-opto-electro-
             mechanical system(MOEMS)…
             • Massive array of 16mm (older) or 12.7mm
             mirrors are
               used as light deflectors (modulators)…
             • Arrays up to 2.2 million mirrors are currently in
             production…
             • Each mirror has a hidden hinge over which
             it twists upon…
             • Tilts of the pixels are ±10 or ±12 degrees…

                Yoke/Beam                              Hinge Post
                                              Mirror   (support)

                  Hinge



                                                          Spring Tips
                  Drive                                        23
                  Electronics and Interconnects…
Example: Texas Instruments mdisplay


                           • System focuses laser spot through
                           microscope objective onto surface of
                           interest…

                           • Reflected laser spot is sent to the
                           interferometer to compare against for
                           Doppler frequency shift…

                           • For this optical set-up, the minimum
                           beam waist for the laser signal is
                           approximately 1mm.




            Hinge Axis
            (pivot axis)
Example: Texas Instruments mdisplay

Hinge Axis
(pivot axis)
                   • As mirror transitions from one state to
                   another(‘-’ to ‘+’ for example), the MSA
                   system can acquire a time domain response of
                   this point on the mirror…
Example: Texas Instruments mdisplay

Hinge Axis
(pivot axis)      • As we all know – three points are
                  necessary to determine a plane. Similarly,
                  to build up a time development of the
                  mirror – several points must be inspected
                  over the mirror to render reliable
                  data…
Example: Texas Instruments mdisplay



Hinge
Axis

                          •  There are three primary directions
  Tilt Motion Direction
                          of motion that characterize these
                          micro-mirrors…

                          • With these three base motions in
                          mind, MatLab is used as a processing
                          and graphical user interface (GUI)
  Roll Motion Direction
                          to obtain the time developed
                          dynamics of the mirrors…




  Sag Motion Direction                                            27
Example: Texas Instruments mdisplay




• The base motion directions above are shown for a single
mirror. Ability is implemented to acquire and process data on
several mirrors to provide dynamics where we can compare
results mirror-to-mirror…
                                                                28
Example: Texas Instruments mdisplay



• Image above (left)
shows one of the
processing/visualization
windows within
MatLab.

• In this case, a (3x3)
array of mirrors are
shown with their
corresponding tilt, roll
and sag axis time
developed dynamics in
the right side of figure.


                                      29
Example: Cantilever


Model for Modal Response of Cantilever based on
mechancial parameters

      Properties

       Length X      0.225 mm

          Width    3.5e-002 mm

      Thickness     4.e-003 mm

        Material        Si

        Volume     3.15e-005 mm³

          Mass     7.308e-011 kg

         Nodes         988

      Elements         900
Example: Cantilever
  Base Excitation:
                                                                Cantilever + Substrate
  Piezo used to provide external
  

  base excitation, transmitted
  directly to cantilever

  Excited from built-in waveform
                                                                              Piezo
  generator                                                                    Actuator

  Picma Piezo from Physik Instrumente
Part #      Dimensions   Max.           Blocking   Resonant
            AxBxL        displacement   force [N @ frequency
            [mm]         [µm @ 120 V]   120 V]     [kHz] ±20%

 P-883.10     3x3x9      8 ±20%         290         135




      More info at: http://www.physikinstrumente.com
Example: Cantilever
Frequency Response:
   Swept sine            Measurement laser spot directed at
   measurement to        the end of the cantilever
   2000 KHz
   Measurement time
   each spot 12.8
   milliseconds (chirp
   response)
   Frequency Response
   Function measured
   for each point
Example: Cantilever
1st Bending Mode:    Discrepancy: -29%
Experimental Data:          Model:
Example: Cantilever
2nd Bending Mode:    Discrepancy: -23%
Experimental Data:          Model:
Example: Cantilever
Torsion Mode:        Discrepancy: -49%
Experimental Data:          Model:
Example: Cantilever Array




Measurement on poly3 400 um
cantilever showing resonance at
18.45 KHz and damping factor
0.10 (squeeze film damping)
Example: Wafer level testing

PARTEST: Testing Methods for Determination of Production Relevant
Parametersin MEMS on Wafer Level




           http://www.memunity.org/par-test.htm
Example: Wafer level testing
Electrostatic Electrodes
     Elctrostatic Excitation   •   No mechanical contact to wafer
                               •   Force applied to conductors,
                                   semiconductors and dielectric
                                   materials
                               •   Realized –3 dB frequency bandwith
                                   300 kHz
                               •   Integrated distance measurement
                               •   Wafer level test possible
                               •   Electrodes transparent (ITO)

          Micropositioner                       Probe „card“
Example: Wafer level testing

 •   Pressure sensors with quadratic membrane  regular dies
     have the 2nd/3rd mode at the same frequency values
                          -4
                   x 10
               4

               3
     v [m/s]




               2

               1

               0
                   0           200   400             600   800   1000
                                           f [kHz]
Example: Wafer level testing
Example: Wafer level testing

        mean( EIE) = 0.08µm
        std( EIE)  = 0.04µm

                                                      0.25
Wafer map with
Classification                                        0.2




                                                             EIE [µm]
                                                      0.15



                                                      0.1



                                                      0.05


               Peak error
               max. EIE



Red spots show bad dies       EIE: Estimated Identification Error
UHF-120 Ultra High Frequency Vibrometer




                                   42
Ultra High Frequency Vibrometer

Technical Specifications UHF-120
Ultra High Frequency Vibrometer
Example: SAW Filter Measurement
Ultra High Frequency Vibrometer
Example: SAW Filter 262 MHz
Conclusion
•   Polytec MSA unique, all-in-one optical
measurement solution for 3D vibration
measurement plus topography
measurement

•   Real-time, broadband measurement
with frequency response in milliseconds

•   Highly Sensitive measurement with
resolution down to picometer level

•   Well supported by engineers
knowledgeable with MEMS applications
and necessary requirements for testing


     Advancing Measurements by Light • www.polytec.com

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Improving Performance of Mems Using Dynamic Characterizaton

  • 1. Improving Performance of MEMS Designs Using Dynamic Characterization Advancing Measurements by Light • www.polytec.com 1
  • 2. Polytec Introduction Eric Lawrence MEMS Business Development Manager Advancing Measurements by Light • www.polytec.com 2
  • 3. Contents Introduction to Laser Vibrometry •Polytec Micro System Analyzer (MSA-500) •Application: MEMS Comb Drive •Application: MEMS mmirror •Application: MEMS / NEMS Cantilever •Application: Wafer Level Testing Pressure Sensor •New Ultra High Frequency Vibrometer
  • 4. Optical Measurement Solutions Laser Doppler Vibrometers For non-contact vibration measurements Laser Surface Velocimeters For surface speed and length measurements White Light Interferometers For surface topography measurements Advancing Measurements by Light • www.polytec.com
  • 5. Tools for Vibration Analysis Polytec Scanning Vibrometer Data Storage Fast, accurate visualization and analysis of structural vibration MEMS Automotive Health Monitoring Aerospace Micro Electro Mechanical Structures (MEMS)
  • 6. Challenges and Requirements for MEMS Testing Diverse tools available to measure wide range physical properties (shape, dimension, film thickness, time response, stress, roughness, stiction, resonant frequency, environmental response…) High spatial resolution, accuracy and precision required Fast response times often require high speed measurement techniques Spatial complexity (mm – nm) of MEMS challenging for conventional techniques Wide range of performance criteria among different devices Handling and environmental requirements Fast measurement speed is critical for high volume production testing Reliable techniques that allow scientists and engineers to effectively communicate physical properties
  • 7. Motivation Why optical measurement of MEMS dynamics? MEMS usually involve active moving elements for sensing and actuation Electrical test can prove if a device is working or not, but…… Electrical testing can’t determine exact behavior of device Need highly sensitive, non-invasive , real-time measurement  Laser Doppler Vibrometry
  • 8. Laser Doppler Vibrometry Measurement Beam f0 f0 ± fD Bragg cell Reflected Beam He-Ne Laser <1mw (633nm) x(t) v(t) f0 + 40 MHz Photo-detector Frequency Modulated signal 40 MHz ± fD Δ fD = 2V/λ
  • 9. Laser Doppler Vibrometry Signal Demodulation FM Doppler signal Controller Photo-detector system Voltage ~ Velocity AM electrical signal FFT Spectrum Voltage ~ Displacement
  • 10. Scanning Laser Doppler Vibrometer The interferometer is coupled via a fiber into the microscope (MSA) A scanning mirrors allows to scan the whole surface point by point
  • 11. Scanning Laser Doppler Vibrometer Vibration Time Signal sequential measurement at all points. Excitation for all points Vibration Spectrum
  • 12. Advantages of Laser Doppler Vibrometer • Real Time Measurement: Fast signal-based measurements from broadband excitation, can measure transient response • High Resolution: Displacement resolution down to picometer • High lateral resolution: Laser spot focused down to 700 nm • High frequency bandwidth: DC to 24 MHz (1.2 GHz) • High accuracy: Doppler technique highly accurate and linear • Can do difficult measurements on range of materials, under required environmental conditions, i.e. thru glass into a vacuum chamber,  calibration independent of these factors • Probe Station Integration: Integrates with commercially available probe stations for wafer level testing Advancing Measurements by Light • www.polytec.com
  • 13. In-plane: Strobe Video Microscopy Additional Strobe Video Microscopy Capability for in-plane motion In-Plane motion of MEMS Comb drives Gyroscopes Accelerometers Automatically acquires strobe image sets Pattern Matching to measure displacement Software tools for analyzing response
  • 14. Topography: White Light Interferometry Additional Topography Measurement Capability Topographical Measurement of: Step-Height Shape (Curvature, Flatness) Roughness Form Parameters (Dimensions, Angle, Radius)
  • 15. MSA-500 Micro System Analyzer Combines powerful tools for precise 3D analysis of structural vibration and surface topography: •Scanning Laser Vibrometry for fast measurement and 3D visualization of out-of-plane deflection shapes. •Strobe Video Microscopy for capturing and analyzing in-plane motion. •White Light Interferometry for mapping surface topography.
  • 16. Applications Advancing Measurements by Light • www.polytec.com
  • 17. Example: Comb Drive Resonator In-plane actuator driven by electrostatic pulling force 1 nh 2 F ε V 2 g Restoring force from bifold springs Substituting for Keff and Meff: Natural Frequency E w3 (1 2 ) given by: d  rL3A eff 0  K eff M eff Where E is Young’s Modulus of Elasticity, w is spring width, r is the density, L is the spring length and Aeff is the effective area of comb drive.
  • 18. Example: Comb Drive Resonator Setup: Measurements were performed with MSA system at our lab in Tustin, CA Device + Fixture placed under microscope and positioned into place Relatively easy setup for placing chip and locating P6 Comb Drive to be measured Vibration Isolated Table to minimize background motion Device driven from built-in waveform generator and amplifier
  • 19. Example: Comb Drive Resonator Frequency Response: Set up a grid of approximately 700 measurement points 80 Volt Burst Chirp Excitation to 2 MHz, 25600 Lines FFT Measurement time each spot 12.8 ms (chirp response) Frequency Response Function measured for each point Automatically Scan measurement for all points F1 =.0138 MHz 0.407 MHz 0.527 MHz 0.929 MHz 1.345 MHz 0.453 MHz 1.614 MHz 0.344 MHz 1.169 MHz 1.493 MHz 0.590 MHz
  • 20. Example: Comb Drive Resonator 1610 KHz 13.8 KHz Operational Deflection shapes Resonance 526 KHz displayed for each frequency peaks frequency graphical selected by corresponds to a interface tool unique mode
  • 21. Example: Comb Drive Resonator Fundamental rigid body resonance at 13.8 KHz
  • 22. Dynamic Response of Mirror Array Courtesy Rick Oden, Texas Instruments •Settling time dynamics of whole mirror (3D image of time sequence)scanning vibrometry •Because the heart of the projector system is the DMD mirror array – a Hinge thorough understanding of the Axis dynamic motion of the mirrors is critical to gauge performance of current as well as future Tilt Motion Direction technology directions…
  • 23. Example: Texas Instruments mdisplay • Hermetically sealed Micro-opto-electro- mechanical system(MOEMS)… • Massive array of 16mm (older) or 12.7mm mirrors are used as light deflectors (modulators)… • Arrays up to 2.2 million mirrors are currently in production… • Each mirror has a hidden hinge over which it twists upon… • Tilts of the pixels are ±10 or ±12 degrees… Yoke/Beam Hinge Post Mirror (support) Hinge Spring Tips Drive 23 Electronics and Interconnects…
  • 24. Example: Texas Instruments mdisplay • System focuses laser spot through microscope objective onto surface of interest… • Reflected laser spot is sent to the interferometer to compare against for Doppler frequency shift… • For this optical set-up, the minimum beam waist for the laser signal is approximately 1mm. Hinge Axis (pivot axis)
  • 25. Example: Texas Instruments mdisplay Hinge Axis (pivot axis) • As mirror transitions from one state to another(‘-’ to ‘+’ for example), the MSA system can acquire a time domain response of this point on the mirror…
  • 26. Example: Texas Instruments mdisplay Hinge Axis (pivot axis) • As we all know – three points are necessary to determine a plane. Similarly, to build up a time development of the mirror – several points must be inspected over the mirror to render reliable data…
  • 27. Example: Texas Instruments mdisplay Hinge Axis • There are three primary directions Tilt Motion Direction of motion that characterize these micro-mirrors… • With these three base motions in mind, MatLab is used as a processing and graphical user interface (GUI) Roll Motion Direction to obtain the time developed dynamics of the mirrors… Sag Motion Direction 27
  • 28. Example: Texas Instruments mdisplay • The base motion directions above are shown for a single mirror. Ability is implemented to acquire and process data on several mirrors to provide dynamics where we can compare results mirror-to-mirror… 28
  • 29. Example: Texas Instruments mdisplay • Image above (left) shows one of the processing/visualization windows within MatLab. • In this case, a (3x3) array of mirrors are shown with their corresponding tilt, roll and sag axis time developed dynamics in the right side of figure. 29
  • 30. Example: Cantilever Model for Modal Response of Cantilever based on mechancial parameters Properties Length X 0.225 mm Width 3.5e-002 mm Thickness 4.e-003 mm Material Si Volume 3.15e-005 mm³ Mass 7.308e-011 kg Nodes 988 Elements 900
  • 31. Example: Cantilever Base Excitation: Cantilever + Substrate Piezo used to provide external  base excitation, transmitted directly to cantilever Excited from built-in waveform  Piezo generator Actuator Picma Piezo from Physik Instrumente Part # Dimensions Max. Blocking Resonant AxBxL displacement force [N @ frequency [mm] [µm @ 120 V] 120 V] [kHz] ±20% P-883.10 3x3x9 8 ±20% 290 135 More info at: http://www.physikinstrumente.com
  • 32. Example: Cantilever Frequency Response: Swept sine Measurement laser spot directed at measurement to the end of the cantilever 2000 KHz Measurement time each spot 12.8 milliseconds (chirp response) Frequency Response Function measured for each point
  • 33. Example: Cantilever 1st Bending Mode: Discrepancy: -29% Experimental Data: Model:
  • 34. Example: Cantilever 2nd Bending Mode: Discrepancy: -23% Experimental Data: Model:
  • 35. Example: Cantilever Torsion Mode: Discrepancy: -49% Experimental Data: Model:
  • 36. Example: Cantilever Array Measurement on poly3 400 um cantilever showing resonance at 18.45 KHz and damping factor 0.10 (squeeze film damping)
  • 37. Example: Wafer level testing PARTEST: Testing Methods for Determination of Production Relevant Parametersin MEMS on Wafer Level http://www.memunity.org/par-test.htm
  • 38. Example: Wafer level testing Electrostatic Electrodes Elctrostatic Excitation • No mechanical contact to wafer • Force applied to conductors, semiconductors and dielectric materials • Realized –3 dB frequency bandwith 300 kHz • Integrated distance measurement • Wafer level test possible • Electrodes transparent (ITO) Micropositioner Probe „card“
  • 39. Example: Wafer level testing • Pressure sensors with quadratic membrane  regular dies have the 2nd/3rd mode at the same frequency values -4 x 10 4 3 v [m/s] 2 1 0 0 200 400 600 800 1000 f [kHz]
  • 41. Example: Wafer level testing mean( EIE) = 0.08µm std( EIE) = 0.04µm 0.25 Wafer map with Classification 0.2 EIE [µm] 0.15 0.1 0.05 Peak error max. EIE Red spots show bad dies EIE: Estimated Identification Error
  • 42. UHF-120 Ultra High Frequency Vibrometer 42
  • 43. Ultra High Frequency Vibrometer Technical Specifications UHF-120
  • 44. Ultra High Frequency Vibrometer Example: SAW Filter Measurement
  • 45. Ultra High Frequency Vibrometer Example: SAW Filter 262 MHz
  • 46. Conclusion • Polytec MSA unique, all-in-one optical measurement solution for 3D vibration measurement plus topography measurement • Real-time, broadband measurement with frequency response in milliseconds • Highly Sensitive measurement with resolution down to picometer level • Well supported by engineers knowledgeable with MEMS applications and necessary requirements for testing Advancing Measurements by Light • www.polytec.com