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Divya Verma, Ajay Kaushik / International Journal of Engineering Research and Applications
                 (IJERA)             ISSN: 2248-9622      www.ijera.com
                   Vol. 2, Issue 5, September- October 2012, pp.391-394

 Analysis of RF MEMS Capacitive Switch based on a Fixed-Fixed
                      Beam Structure
                                Divya Verma*, Ajay Kaushik**
                 *,**MMEC, Maharishi Markandeshwar University, Mullana, Haryana(India),

ABSTRACT
         RF MEMS has evolved over the past              adjustment of a separate RF device or component,
decade and it has emerged as a potential                such as variable capacitors, switches, and
technology for wireless, mobile and satellite           filters.There has been great research effort on Radio
communication and defence applications. RF              Frequency Micro-Electro- Mechanical Systems (RF
MEMS provides an opportunity to revolutionize           MEMS) switches because they have many
the wireless communication. This paper                  advantages over p-i-n diode or field effect transistor
describes the Performance of low loss Fixed-            (FET) switches [5]. RF MEMS switches show
Fixed RF MEMS capacitive switch . The RF                attractive electrical performance characteristics that
MEMS capacitive Fixed-Fixed switch exhibit              are critically needed in the next generation RF
lower losses, better reliability, and good              switches with high isolation, very low insertion loss,
performance at higher frequencies. RF MEMS              wide bandwidth operation and excellent linearity [6,
switches can       be classified based on their         7 and 8]. This makes it ideal to enable a plethora of
actuation mechanisms into categories such as            wireless appliances operating in the home/ground,
electrostatic, electromagnetic and thermal. Most        mobile, and space spheres such as handsets, base
of the RF-MEMS switches reported to date have           stations, and satellites.
used electrostatic actuation , which normally
requires high actuation voltages. In this paper a       The main existing challenge in use of RF MEMS
fixed-fixed RF MEMS capacitive switch is                switches is high value of actuation voltage. As the
designed to achieve low actuation voltage and to        high actuation voltage requires high voltage drive
analyse their performance parameters.                   circuits which degrades life time and induces
                                                        malfunction by charge trapping problem. So, in this
Keywords: Capacitive, electrostatic actuation, pull-    paper we have focused in the reduction of actuation
in voltage, RF MEMS switch.                             voltage by studying the various parameters which
                                                        effect the actuation voltage. In this paper proposed
  I.     INTRODUCTION                                   RF MEMS capacitive switch based on fixed-fixed
          Wireless communication has made an            beam structure which shows an improvement in
explosive growth of emerging consumer markets, as       characteristics at higher frequencies. Here, we
well as in military applications of RF, microwave,      propose a switch which uses fixed-fixed shape beam
and millimetre-wave circuits and systems. These         and its parameters are analyzed. It has wide
include wireless personal communication systems,        potential with multiband support for different
wireless     local    area     networks,    satellite   applications like K and Ka band which is to be sight
communications, automotive electronics, etc. In         for different satellite communication. It is also
these systems, the RF switch is one of the essential    supposed to support next generation mobile terminal
components to handle RF signals [1,2]. RF MEMS          applications.
is an emerging technology that promises the
potential of revolutionizing RF and microwave           II.     RF MEMS SWITCH
system implementation for the next generation of                  Switch is the basic element that connect
telecommunication applications [3]. Its low power,      or disconnect the electrical connection. There are
better RF performance, large tuning range, and          two basic switches used in RF to millimeter-wave
integration capability are the key characteristics      circuit design: the shunt switch and the series
enabling system implementation with potential           switch. The series MEMS switch is excellent for
improvements in size, cost, and increased               RF-40 GHz applications with a typical isolation of
functionality.                                          50 dB at 1 GHz, and 30 dB at 10 GHz [9]. The shunt
                                                        design is excellent at 10-100 GHz applications, with
The term RF MEMS refers to the design and               a typical isolation of 17 dB at 10 GHz and 35-40 dB
fabrication of MEMS for RF integratedcircuits. It       at 30-40 GHz for a capacitance of 4 pF . From a
should not be interpreted as the traditional MEMS       mechanical point of view, MEMS switches can be a
devices operating at RF frequencies [4].MEMS            thin metal cantilever, air bridge, or diaphragm, from
devices in RF MEMS are used for actuation or            RF circuit configuration point of view, it can be
                                                        series connected or parallel connected with an RF



                                                                                              391 | P a g e
Divya Verma, Ajay Kaushik / International Journal of Engineering Research and Applications
                 (IJERA)             ISSN: 2248-9622      www.ijera.com
                   Vol. 2, Issue 5, September- October 2012, pp.391-394

transmission line [4,10]. The contact condition can        membrane. At (2/3g0), the increase in the
be capacitive (metal–insulator–metal) or resistive         electrostatic force is greater than the increase in the
(metal-to-metal),    polar    ceramics     such      as    restoring force, resulting in the beam position
(Ba,Sr)TiO3 - BST and designed to open the line or         becoming unstable and collapse of the beam to the
shunt it to ground upon actuation of the MEMS              down-state position. The pull-down (also called
switch. Each type of switch has certain advantages         pull-in) voltage is found to be
in performance or manufacturability. Main
                                                                                       8𝑘
mechanical operations of RF MEMS switches                              2𝑔 𝑜                   𝑔𝑜 3
depends mainly on spring constant of material used         𝑉𝑝 𝑉 = 𝑉         =       27𝜖0 𝑊. 𝑤
                                                                        3
i.e. k. We always require to have less k i.e. less stiff
material because the deflection of beam depends on
                                                                                     8𝑘
spring constant k and we need more deflection with                                         𝑔𝑜 3
given force for an given RF MEMS Switch. In this                                =   27𝜖0 𝐴                     (2)
paper we have used Fixed-Fixed type beam shape
with holes to lower the k value [10].
                                                           where V is the voltage applied between the beam
Calculation for spring constant for Fixed-Fixed            and electrode, A= Ww is the electrode area, g0 is the
shaped beam is given below.                                zero-bias bridge height, ∈0 is the permittivity of air.

Fixed-Fixed flexure                                        As shown in Eq. (2), the pull down voltage depends
            𝑡 3                                            on the spring constant of beam structure, and, beam
 𝑘 = 4𝐸𝑤                                       (1)
            𝑙                                              gap g0 and electrode area A [12]. There are two
Where k is a spring constant, E is a Young’s               approaches to reduce the actuation voltage: A first
modulus, l is the length of the beam, t is the             approach in lowering the actuation voltage is to
thickness of the beam. In many MEMS switches,              increase the actuation area. Increasing the area is not
small diameter holes (3–8 mm) are defined in the           a practical solution because the compactness is the
beam to reduce the squeeze film damping and                prevailing issue and adoption of MEMS technology
increase the switching speed of the MEMS switch.           is to achieve the miniaturization. The second
The hole area can be up to 60% of the total surface        alternative, which offers the maximum design
area of the MEMS structure. The holes also result in       flexibility for a low-to-moderate actuation voltage,
a lower mass of the beam, which in turn yields a           is to lower the switch spring constant, hence,
higher mechanical resonant frequency[10].                  designing a compliant switch. To reduce the
                                                           actuation voltage, the key is beam structure of low
                                                           spring constant k.


                                                                         III.       RESULTS

                                                            A.      RF MEMS Design and Analysis
                                                                    Figure 2 shows the voltage and charge
                                                            values on conductor calculated and measured for
                                                            fixed-fixed based RF MEMS switch. Since
                                                            Coventorware software        could synthesize the
                                                            multiply factors, such as electrostatic-forces, pull-
                                                            down voltages, Young’s modulus, and other
Figure1: Fixed-Fixed beam based RF-MEMS switch              vector values could are obtained. Figure 3 shows
                                                            capacitance matrix which shows self-capacitance
1)       Electrostatic Actuation:                           terms (located on the diagonal of the capacitive
         When the voltage is applied between a              matrix) should be positive and mutual-capacitance
fixed-fixed beam and the pull down electrode, an            terms (off-diagonal elements) should be negative
electrostatic force is induced on the beam. The             according to the ConventorWare’s convention. A
electrostatic force applied to the beam is found by         Capacitance Matrix dialog that deviates from this
considering the power delivered to a time-dependent         rule is an indication that the mesh needs to be
capacitance. This electrostatic force is approximated       refined. Figure 4 shows pull-in voltage ranges for
as being distributed evenly across the beam section         fixed-fixed beam based RF MEMS switch. The
above the electrode. As this electrostatic force is         graph in figure 5 shows charge produced on a
applied to the beam, the beam membrane starts to            beam with different values of voltages of a
deflect downward, decreasing the gap g and                  capacitive MEMS switch.
increasing the electrostatic pressure on the



                                                                                                     392 | P a g e
Divya Verma, Ajay Kaushik / International Journal of Engineering Research and Applications
                  (IJERA)             ISSN: 2248-9622      www.ijera.com
                    Vol. 2, Issue 5, September- October 2012, pp.391-394

                                                      applied to many other devices, including tunable
                                                      filters, other antenna geometries, signal splitters or
                                                      military applications.

                                                           REFERENCES
                                                      1. Il-Joo Cho, Taeksang Song, Sang-Hyun Baek,
                                                         and Euisik Yoon, “Low-Voltage and Low-Power
Figure 2: Voltage and Charge values for capacitive       RF MEMS Series and Shunt Switches Actuated
MEMS switch                                              by Combination of Electromagnetic and
                                                         Electrostatic Forces”, IEEE Transactions On
                                                         Microwave Theory And Techniques, Vol. 53,
                                                         No. 7, July 2005.

                                                      2. H. A. C. Tilmans, W. D. Raedt, and E. Beyne,
                                                         “MEMS for wireless communications,” J.
                                                         Micromech. Microeng., vol. 13, pp. 139–163,
                                                         Jun. 2003.
Figure 3: Capacitance matrix for capacitive MEMS
switch                                                3. Hung-Pin Chang, Jiangyuan Qian, Bedri A.
                                                         Cetiner, F. De Flaviis, Mark Bachman, and G. P.
                                                         Li, “Low Cost RF MEMS Switches Fabricated
                                                         on Microwave Laminate Printed Circuit
                                                         Boards.” Department of Electrical and Computer
                                                         Engineering, University of California at Irvine,
                                                         USA.

 Figure 4: Pull-in voltage for capacitive MEMS        4. Vijay K. Varadan, K. J. Vinoy, K. A. Jose, “ RF
 switch                                                  MEMS and Their Applications” John Wiley &
                                                         Sons, Inc., 2003.

                                                      5. Mingxin Song, Jinghua Yin, Xunjun He, Yue
                                                         Wang, “Design and Analysis of a Novel Low
                                                         Actuation Voltage of Capacitive RF MEMS
                                                         Switches”, Proceedings of the 3rd IEEE Int.
                                                         Conf. on Nano/Micro Engineered and Molecular
                                                         Systems January 6-9, 2008, Sanya, China.

                                                      6. Reines I. C., Goldsmith C. L., Nordquist C. D.,
                                                         Dyck C. W., Kraus G. M., Plut T. A., Finnegan
                                                         P. S., Austin F. and Sullivan C. T. A low loss RF
                                                         MEMS Ku-band integrated switched filter bank
                                                         [J]. IEEE Microwave & Wireless Components
                                                         Letters, vol.15, No.2 (2005), pp.74-76.

                                                      7.     Goldsmith C, Lin T H, Powers B.
                                                           Micromechanical Membrane Switches for
 Figure 5: Voltage versus        Charge graph for
                                                           Microwave Applications [C]. In: IEEE MTT-S
 capacitive MEMS switch.
                                                           Int. Microwave Symp. Dig, 1995, pp. 91-96.
 IV.     CONCLUSIONS                                  8. C. L. Dai, H. J. Peng, M. C. Liu, C. C. Wu and
         In this paper, fixed-fixed based RF MEMS
                                                         L.J. Yang. Design and Fabrication of RF MEMS
 switch is designed and simulated for a multiple-
                                                         Switch by the CMOS Process [J]. Tamkang
 frequency antenna We have designed a fixed-fixed
                                                         Journal of Science and Engineering, Vol. 8, No 3
 beam switch with pull-in voltage ranges from
                                                         (2005), pp. 197- 202.
 3.18V to 3.5V with beam gap 1µm having a good
 RF characteristics with a lower actuation voltage.
                                                      9. Jeremy B. Muldavin, Gabriel M. Rebeiz, “High-
 As by using MEMS switches, the losses are kept to
                                                         Isolation Inductively-Tuned X-Band MEMS
 a minimum which is very important factor to obtain
                                                         Shunt Switches” , 2000 IEEE MTT-S Digest.
 high reconfigurability .This technology can be



                                                                                            393 | P a g e
Divya Verma, Ajay Kaushik / International Journal of Engineering Research and Applications
                 (IJERA)             ISSN: 2248-9622      www.ijera.com
                   Vol. 2, Issue 5, September- October 2012, pp.391-394

10.   G. M. Rebeiz, RF MEMS Theory, design,
      and technology, New Jersey: John Wiley &
      Sons, Inc., 2003.

11.   S. P. Pacheco, D. Peroulis, L.P.B. Katehi,
      “MEMS single-pole double-throw (SPDT) X
      and K-band switching circuits,” Microwave
      Theory Tech -S Int. Microwave Symp., vol. 1,
      pp. 165–168, 2001.

12.   C. Goldsmith, J. Randall, S. Eshelman, T.H.
      Lin, D. Denniston, S. Clhen, B. Norvell,
      “Characteristics Of Micromachined Switches
      At Microwave Frequencies.” , 1996 IEEE
      MTT-S Digest.

13.   Dimitrios Peroulis, Sergio P. Pacheco, Kamal
      Sarabandi, Linda P.B Katehi,               “
      Electromechanical       Considerations    In
      Developing Low- Voltage          RF MEMS
      Switches”, IEEE, 2003.
14.   Gabriel M. Rebeiz, “RF-MEMS Switches:
      Status Of The Technology”, IEEE, 2003.

15.   Richard Chan, Robert Lesnick, David Becher,
      “Low- Actuation Voltage RF MEMS Shunt
      Switch With Cold Switching Lifetime Of
      Seven Billion Cycles”, IEEE, 2003.
16.   F.M Guo, Z.Q. Zhu, Y.F. Long, G.Q. Yang,
      “Study On Low Voltage Actuated RF MEMS
      Capacitive                        Switches”,
      www.sciencedirect.com,       sensors    and
      actuators A 108(2003).




                                                                              394 | P a g e

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  • 1. Divya Verma, Ajay Kaushik / International Journal of Engineering Research and Applications (IJERA) ISSN: 2248-9622 www.ijera.com Vol. 2, Issue 5, September- October 2012, pp.391-394 Analysis of RF MEMS Capacitive Switch based on a Fixed-Fixed Beam Structure Divya Verma*, Ajay Kaushik** *,**MMEC, Maharishi Markandeshwar University, Mullana, Haryana(India), ABSTRACT RF MEMS has evolved over the past adjustment of a separate RF device or component, decade and it has emerged as a potential such as variable capacitors, switches, and technology for wireless, mobile and satellite filters.There has been great research effort on Radio communication and defence applications. RF Frequency Micro-Electro- Mechanical Systems (RF MEMS provides an opportunity to revolutionize MEMS) switches because they have many the wireless communication. This paper advantages over p-i-n diode or field effect transistor describes the Performance of low loss Fixed- (FET) switches [5]. RF MEMS switches show Fixed RF MEMS capacitive switch . The RF attractive electrical performance characteristics that MEMS capacitive Fixed-Fixed switch exhibit are critically needed in the next generation RF lower losses, better reliability, and good switches with high isolation, very low insertion loss, performance at higher frequencies. RF MEMS wide bandwidth operation and excellent linearity [6, switches can be classified based on their 7 and 8]. This makes it ideal to enable a plethora of actuation mechanisms into categories such as wireless appliances operating in the home/ground, electrostatic, electromagnetic and thermal. Most mobile, and space spheres such as handsets, base of the RF-MEMS switches reported to date have stations, and satellites. used electrostatic actuation , which normally requires high actuation voltages. In this paper a The main existing challenge in use of RF MEMS fixed-fixed RF MEMS capacitive switch is switches is high value of actuation voltage. As the designed to achieve low actuation voltage and to high actuation voltage requires high voltage drive analyse their performance parameters. circuits which degrades life time and induces malfunction by charge trapping problem. So, in this Keywords: Capacitive, electrostatic actuation, pull- paper we have focused in the reduction of actuation in voltage, RF MEMS switch. voltage by studying the various parameters which effect the actuation voltage. In this paper proposed I. INTRODUCTION RF MEMS capacitive switch based on fixed-fixed Wireless communication has made an beam structure which shows an improvement in explosive growth of emerging consumer markets, as characteristics at higher frequencies. Here, we well as in military applications of RF, microwave, propose a switch which uses fixed-fixed shape beam and millimetre-wave circuits and systems. These and its parameters are analyzed. It has wide include wireless personal communication systems, potential with multiband support for different wireless local area networks, satellite applications like K and Ka band which is to be sight communications, automotive electronics, etc. In for different satellite communication. It is also these systems, the RF switch is one of the essential supposed to support next generation mobile terminal components to handle RF signals [1,2]. RF MEMS applications. is an emerging technology that promises the potential of revolutionizing RF and microwave II. RF MEMS SWITCH system implementation for the next generation of Switch is the basic element that connect telecommunication applications [3]. Its low power, or disconnect the electrical connection. There are better RF performance, large tuning range, and two basic switches used in RF to millimeter-wave integration capability are the key characteristics circuit design: the shunt switch and the series enabling system implementation with potential switch. The series MEMS switch is excellent for improvements in size, cost, and increased RF-40 GHz applications with a typical isolation of functionality. 50 dB at 1 GHz, and 30 dB at 10 GHz [9]. The shunt design is excellent at 10-100 GHz applications, with The term RF MEMS refers to the design and a typical isolation of 17 dB at 10 GHz and 35-40 dB fabrication of MEMS for RF integratedcircuits. It at 30-40 GHz for a capacitance of 4 pF . From a should not be interpreted as the traditional MEMS mechanical point of view, MEMS switches can be a devices operating at RF frequencies [4].MEMS thin metal cantilever, air bridge, or diaphragm, from devices in RF MEMS are used for actuation or RF circuit configuration point of view, it can be series connected or parallel connected with an RF 391 | P a g e
  • 2. Divya Verma, Ajay Kaushik / International Journal of Engineering Research and Applications (IJERA) ISSN: 2248-9622 www.ijera.com Vol. 2, Issue 5, September- October 2012, pp.391-394 transmission line [4,10]. The contact condition can membrane. At (2/3g0), the increase in the be capacitive (metal–insulator–metal) or resistive electrostatic force is greater than the increase in the (metal-to-metal), polar ceramics such as restoring force, resulting in the beam position (Ba,Sr)TiO3 - BST and designed to open the line or becoming unstable and collapse of the beam to the shunt it to ground upon actuation of the MEMS down-state position. The pull-down (also called switch. Each type of switch has certain advantages pull-in) voltage is found to be in performance or manufacturability. Main 8𝑘 mechanical operations of RF MEMS switches 2𝑔 𝑜 𝑔𝑜 3 depends mainly on spring constant of material used 𝑉𝑝 𝑉 = 𝑉 = 27𝜖0 𝑊. 𝑤 3 i.e. k. We always require to have less k i.e. less stiff material because the deflection of beam depends on 8𝑘 spring constant k and we need more deflection with 𝑔𝑜 3 given force for an given RF MEMS Switch. In this = 27𝜖0 𝐴 (2) paper we have used Fixed-Fixed type beam shape with holes to lower the k value [10]. where V is the voltage applied between the beam Calculation for spring constant for Fixed-Fixed and electrode, A= Ww is the electrode area, g0 is the shaped beam is given below. zero-bias bridge height, ∈0 is the permittivity of air. Fixed-Fixed flexure As shown in Eq. (2), the pull down voltage depends 𝑡 3 on the spring constant of beam structure, and, beam 𝑘 = 4𝐸𝑤 (1) 𝑙 gap g0 and electrode area A [12]. There are two Where k is a spring constant, E is a Young’s approaches to reduce the actuation voltage: A first modulus, l is the length of the beam, t is the approach in lowering the actuation voltage is to thickness of the beam. In many MEMS switches, increase the actuation area. Increasing the area is not small diameter holes (3–8 mm) are defined in the a practical solution because the compactness is the beam to reduce the squeeze film damping and prevailing issue and adoption of MEMS technology increase the switching speed of the MEMS switch. is to achieve the miniaturization. The second The hole area can be up to 60% of the total surface alternative, which offers the maximum design area of the MEMS structure. The holes also result in flexibility for a low-to-moderate actuation voltage, a lower mass of the beam, which in turn yields a is to lower the switch spring constant, hence, higher mechanical resonant frequency[10]. designing a compliant switch. To reduce the actuation voltage, the key is beam structure of low spring constant k. III. RESULTS A. RF MEMS Design and Analysis Figure 2 shows the voltage and charge values on conductor calculated and measured for fixed-fixed based RF MEMS switch. Since Coventorware software could synthesize the multiply factors, such as electrostatic-forces, pull- down voltages, Young’s modulus, and other Figure1: Fixed-Fixed beam based RF-MEMS switch vector values could are obtained. Figure 3 shows capacitance matrix which shows self-capacitance 1) Electrostatic Actuation: terms (located on the diagonal of the capacitive When the voltage is applied between a matrix) should be positive and mutual-capacitance fixed-fixed beam and the pull down electrode, an terms (off-diagonal elements) should be negative electrostatic force is induced on the beam. The according to the ConventorWare’s convention. A electrostatic force applied to the beam is found by Capacitance Matrix dialog that deviates from this considering the power delivered to a time-dependent rule is an indication that the mesh needs to be capacitance. This electrostatic force is approximated refined. Figure 4 shows pull-in voltage ranges for as being distributed evenly across the beam section fixed-fixed beam based RF MEMS switch. The above the electrode. As this electrostatic force is graph in figure 5 shows charge produced on a applied to the beam, the beam membrane starts to beam with different values of voltages of a deflect downward, decreasing the gap g and capacitive MEMS switch. increasing the electrostatic pressure on the 392 | P a g e
  • 3. Divya Verma, Ajay Kaushik / International Journal of Engineering Research and Applications (IJERA) ISSN: 2248-9622 www.ijera.com Vol. 2, Issue 5, September- October 2012, pp.391-394 applied to many other devices, including tunable filters, other antenna geometries, signal splitters or military applications. REFERENCES 1. Il-Joo Cho, Taeksang Song, Sang-Hyun Baek, and Euisik Yoon, “Low-Voltage and Low-Power Figure 2: Voltage and Charge values for capacitive RF MEMS Series and Shunt Switches Actuated MEMS switch by Combination of Electromagnetic and Electrostatic Forces”, IEEE Transactions On Microwave Theory And Techniques, Vol. 53, No. 7, July 2005. 2. H. A. C. Tilmans, W. D. Raedt, and E. Beyne, “MEMS for wireless communications,” J. Micromech. Microeng., vol. 13, pp. 139–163, Jun. 2003. Figure 3: Capacitance matrix for capacitive MEMS switch 3. Hung-Pin Chang, Jiangyuan Qian, Bedri A. Cetiner, F. De Flaviis, Mark Bachman, and G. P. Li, “Low Cost RF MEMS Switches Fabricated on Microwave Laminate Printed Circuit Boards.” Department of Electrical and Computer Engineering, University of California at Irvine, USA. Figure 4: Pull-in voltage for capacitive MEMS 4. Vijay K. Varadan, K. J. Vinoy, K. A. Jose, “ RF switch MEMS and Their Applications” John Wiley & Sons, Inc., 2003. 5. Mingxin Song, Jinghua Yin, Xunjun He, Yue Wang, “Design and Analysis of a Novel Low Actuation Voltage of Capacitive RF MEMS Switches”, Proceedings of the 3rd IEEE Int. Conf. on Nano/Micro Engineered and Molecular Systems January 6-9, 2008, Sanya, China. 6. Reines I. C., Goldsmith C. L., Nordquist C. D., Dyck C. W., Kraus G. M., Plut T. A., Finnegan P. S., Austin F. and Sullivan C. T. A low loss RF MEMS Ku-band integrated switched filter bank [J]. IEEE Microwave & Wireless Components Letters, vol.15, No.2 (2005), pp.74-76. 7. Goldsmith C, Lin T H, Powers B. Micromechanical Membrane Switches for Figure 5: Voltage versus Charge graph for Microwave Applications [C]. In: IEEE MTT-S capacitive MEMS switch. Int. Microwave Symp. Dig, 1995, pp. 91-96. IV. CONCLUSIONS 8. C. L. Dai, H. J. Peng, M. C. Liu, C. C. Wu and In this paper, fixed-fixed based RF MEMS L.J. Yang. Design and Fabrication of RF MEMS switch is designed and simulated for a multiple- Switch by the CMOS Process [J]. Tamkang frequency antenna We have designed a fixed-fixed Journal of Science and Engineering, Vol. 8, No 3 beam switch with pull-in voltage ranges from (2005), pp. 197- 202. 3.18V to 3.5V with beam gap 1µm having a good RF characteristics with a lower actuation voltage. 9. Jeremy B. Muldavin, Gabriel M. Rebeiz, “High- As by using MEMS switches, the losses are kept to Isolation Inductively-Tuned X-Band MEMS a minimum which is very important factor to obtain Shunt Switches” , 2000 IEEE MTT-S Digest. high reconfigurability .This technology can be 393 | P a g e
  • 4. Divya Verma, Ajay Kaushik / International Journal of Engineering Research and Applications (IJERA) ISSN: 2248-9622 www.ijera.com Vol. 2, Issue 5, September- October 2012, pp.391-394 10. G. M. Rebeiz, RF MEMS Theory, design, and technology, New Jersey: John Wiley & Sons, Inc., 2003. 11. S. P. Pacheco, D. Peroulis, L.P.B. Katehi, “MEMS single-pole double-throw (SPDT) X and K-band switching circuits,” Microwave Theory Tech -S Int. Microwave Symp., vol. 1, pp. 165–168, 2001. 12. C. Goldsmith, J. Randall, S. Eshelman, T.H. Lin, D. Denniston, S. Clhen, B. Norvell, “Characteristics Of Micromachined Switches At Microwave Frequencies.” , 1996 IEEE MTT-S Digest. 13. Dimitrios Peroulis, Sergio P. Pacheco, Kamal Sarabandi, Linda P.B Katehi, “ Electromechanical Considerations In Developing Low- Voltage RF MEMS Switches”, IEEE, 2003. 14. Gabriel M. Rebeiz, “RF-MEMS Switches: Status Of The Technology”, IEEE, 2003. 15. Richard Chan, Robert Lesnick, David Becher, “Low- Actuation Voltage RF MEMS Shunt Switch With Cold Switching Lifetime Of Seven Billion Cycles”, IEEE, 2003. 16. F.M Guo, Z.Q. Zhu, Y.F. Long, G.Q. Yang, “Study On Low Voltage Actuated RF MEMS Capacitive Switches”, www.sciencedirect.com, sensors and actuators A 108(2003). 394 | P a g e