13. TFT Process Flow
Glass GATE Electrode Insulator & a-Si DATA Electrode Passivation Pixel Electrode
Deposition & Patterning Process in Detail
Deposition Cleaning PR Coating Exposure Develop Etch PR Strip Inspection
PECVD
RF Wet Etch
H H
H Si H H
N H
H H
H
H
Si N Si N Si N
SPUTTER Dry Etch
Ar+ Gas RF
Al
Al Al
DC Al
Al Al PLASMA
FO
Si Si
Ar+
SiF4
TARGET
SUBSTRATE
44. BLM Architecture using LED
LED BLU with Conventi onal LGP LED BLU with High Brightness LGP
LED LGP LGP
a. V-cut b. Fly-cut
Etch pattern
> 20 % Brightness enhancement
46. The Issues of LED Backlight
Thermal Solution Module Brightness Efficiency
LED Package Improvement
LED Cost
LED Backlight Structure
LED Back light TFT LCD Panel
Heat Sink LED Structure Improvement
Optical
Thermal Fan (RGB or White) Design
RGB
Sensor
LED Color Display
Driving Processing Signal
LED Control IC
Color Stability
management
47. Barriers/Obstacles for w ide adoption of LED BLU
LED Cost
LED Array + Driving circuit
CCFL + Inverter
LED BLU Ultra light and thin product
Ultra light and thin product
ü Required 0.3t glass, new mounting method, etc.
Uniformity
ü Hot spot happens between neighboring LEDs.
Hot Spot
Increase panel Y-dim.
Set design change
48. Barriers/Obstacles for w ide adoption of LED BLU
LED Lifetime
ü No field data in contrast with CCFL.
ü No lifetime data from LED suppliers. ( Just 1,000hrs guarantee)
- By temperature and operating current
Tolerance
LED CCFL
Color Coordin ate Larger than CCFL s +/- 0.02 (SPEC)
Luminance Rank1, 2, 3
+/- 10%
Intensity (10% difference)
WLED for NB BL, the color shift after 5,000 hr is 0.02.
x, y within 0.005 per bin; and 50 % life deca y time exceeds 15,00 0 hr.