5. Technical investments Laser vias filling line Router with CCD camera and Z axis control Drilling (OIR & 300KT/MN) LDI (Paragon 8W) Laser plotter (LP5008) DES line AOI & AOR (Automatic Optical Repair) Electroless nickel-gold line 2009 2008 2007
14. Main technology in the case of âlargeâ BGAâs (number of balls from 800 to 1800) Main markets : Avionics, Military, Industriel, âbigâ computers Evolutions : high number of layers (+ 40% in 4 years) Base copper thickness of 35” (Low voltage ; âdifferentialâ signals) Controlled impedances â Sequentialâ boards
16. High Density PCBâs The packaging âorientationâ is mainly due to : - the market segment (âconsumerâ vs âprofessionalâ...) - the BGA pitch - the âmatrixâ size (number of balls) - the electrical constraints (impedance, signal quality ...) - the assembly constraints (thermal shocks, finishes ...)
19. High Density PCBâs Example Thru holes drilled at 0.25 mm Laser holes drilled at 0.1 mm 100 ” lines Thickness : 1 mm BGA pitch 0.5 mm External Layer Internal Layer
23. High Density PCBâs Main packaging when BGA pitch =< 0.5 mm Main markets : communication and/or handled Electronic devices (mobile phones, Bluetooth, PDA ...) Future : high packages matrix (more balls) stacked vias Less total plated thru holes thinner lines & spacing
24. High Density PCBâs Advanced technology for Specific Needs (close to silicon devices)
26. High Density PCBâs BGA at 0.5 mm pitch : one line between 2 pads sequential board Drilled holes at 150” 60 ” lines
27. High Density PCBâs Double sided board : - Flip-chip at 250 ” pitch - 165 ” pad - Drilling at 100 ” - Base material : Hitachi 679F 100” 200” Cuivre Nickel-Or chimique