At eInfochips, our deep technology expertise in Board Design and Development, Prototype Development, Testing and Certification and Reengineering sets us apart from our competitors. With 9 Reference Designs, 10 Design IPs, 11 Evaluation Modules and 30 Verification IPs, we have a 132 step checklist for production on second spin.

1. eInfochips Board & System Software
Practice Overview
April 2014

2. 2
Product Engineering Services Company
Bangalore Chennai
Pune
Ahmedabad
Noida Tokyo
London
BostonChicago
Dallas
Austin
Cedar Rapids
Cincinnati
Raleigh
Sunnyvale
10 Design Centers
12 Sales Offices
1200
Professionals
19 Years
Solid Track Record
Stable & Secure
Cash Positive, Debt-free and Profitable

3. BOARD DESIGN & DEVELOPMENT
eInfochips Offerings
3

4. Product Level Capabilities
Vertex
Spartan
Kintex
Cyclone
Flex
Nios
A3P Series
High Speed
• USB 2.0
• DDR2 / DDR3
• HDMI
• PCIe
• SRIO
• XAUI / 10G Ethernet
• Serial ATA
Wireless
• GSM / CDMA
• GPS
• Wi-Fi a/b/g/n
• Zigbee
• Bluetooth
• RFID
Display
• LVDS
• DVI
• SDI
• HDMI
• LCD
• Component
• Composite
Others
• PoE
• NAND
• I2C
• SPI
• RS232 / RS485
• CAN
• Touch Screen
Design Tools
•Cadence OrCAD
•Mentor DxDesigner
•Allegro
•PADS
•Expedition
•Betasoft
•Hyperlinx
•Spectra-Quest

5. Board-Level Capabilities
•400+ Product Design
•150+ Hardware Design to Prototype/Production
•15+ CMs in 6 Countries
Summary
•Multi-core SoC design
•Multi-processor (8 dual-core on a single board) designs
•FPGA based designs
Processors
•Size: 1.5 to 140+ square inches
•Layers: Up to 16 Layer PCB
•Frequency: Few KHz to 3.0 Gbps
•Technology: HDI (2-level micro vias, Via on Pad)
Board
•4200 + with 25 BGAs
- 1031 pins with 0.65mm pitch
Components
5%
3%
0%
71%
21%
Layout density >1
0.5 to 0.9
0.1 to 0.49
0.05 to 0.09
<0.05
31%
28%
41%
PCB layer count
Up to 8 layers
8 to 10 layers
10 to 16 layers
38%
35%
27%
Board Frequencies
>1GHz
500MHz to 1GHz
<500MHz

6. Testing and Production Capabilities
•Assembly Inspection
•Power up
•Boot prompt
•Kernel Prompt
Bring-up
Testing
•Peripheral test
•Performance Optimization
•Diagnostics Code
Functional
Test
•Timing Analysis
•Waveform Shaping
•Performance Analysis
•Boundary Conditions
Testing
EDVT
•Reliability test
•Thermal
•Humidity
•Destructive Testing
Stress Testing
•Pre-Compliance Testing
•FCC, CE, IC (Class A/B)
•Environment testing
(Shock, Bump, Vibration)
•Safety test (UL294 etc)
Prototype
Testing
•DFM measures
•Test Jig/Fixture
•Penalization Requirements
•Pilot Production
•Ensure high first pass yields
Contract
Manufacturer

7. Design Phase
Detailed design
•Use case Analysis
•Component Selection
•Power tree & Clock tree
•Protection Circuits
•Circuit Simulations
Multi-pass reviews
•Requirement Traceability
Matrix
•Schematics Review Tracker
•Layout Guidelines Document
Tools
•DOORS (Requirements)
•PREP (Reviews)
•CLEARQUEST (CRN)
•ARENA (BOM)
•Others (Proprietary)
Component Selection Criteria
Reusability Lead Time Cost
Product Family Package Footprint
Special Properties Vendor Alternates
Manufacturer Temperature Value
Tolerance RoHS / REACH Part Life Status
Software Re-usability
Schematic Tools
Cadence
OrCAD
Mentor
DxDesigner

8. Development Phase
Layout
• Mixed Signal Designs
• PoE, Protections (ARINC), Cross Talk,
• GbE, PCIe, SRIO, SDI Video, DDR3, SATA etc
• Multi processor Designs
• Electro-Mechanical Integration
• Blind and Buried Vias
• Special high performance dielectric materials
Layout
Allegro
PADS
Expedition
Thermal
Analysis
Betasoft
Signal Integrity
Analysis
Hyperlinx
Spectra-
Quest

9. Industrial Design
Tools
• Autovue
• eDrawings
• Solidworks
Design Experience
• IP65 Designs
• MIL-STD-810F
• Fan-Less Designs
• Power Hungry designs
• High level of modularity
• Aesthetics + Ergonomics
Research
•Scope
•Audit
•Interview
•Observations
•Personas
Product
Goals
•Concept
•Scenarios
•Elements
•Framework
•Performance
Specifications

10. SUCCESS STORIES
Board design & Development
10

11. Multiprocessor Dome Camera
Key Highlights
• Multi Processor, FPGA Design, Industrial Grade
Applications
• Surveillancee
Processor & Peripheral Highlights
• Multi-processors + FPGA based Complex Hardware Platform
• TI – DaVinci
• Freescale PowerPC
• Maxim – Video Encoder SoC
• Nethra Image Signal Processor
• Sony CMOS Imager and
• Altera Cyclone- III
• Gigabit Ethernet Support with POE Powered Option
• USB 2.0 Interface for Mass Storage application
• SATA Hard disc support (In-built Hard disc recording – DVR
functionality)
• IP66 rated design
Special Features
• FCC Class-B Certified Product
• Wide temperature range including sub zero temperatures

12. High-Resolution Surveillance Camera
• FPGA RTL design and integration with third party IPs
• Video Scaling from 4K x 3K to 320 x 240
• Video Compression (H264 and MJPEG), Audio Compression (AAC)
• Device driver development and porting for Linux v2.6.37
• Record and/or live play of up-to four 3M pixel MJPEG streams
• WebUI to configure camera parameters
• 12M Pixel surveillance camera product involving Software,
Hardware and FPGA based design
• Support for Auto/manual White Balance, Auto Focus, Auto
Exposure, Gain control, Flip, Tilt
• Contrast, Brightness, Sharpness support
• Image Enhancement Pipeline (Pixel correction, CFA Interpolation,
Color conversion, Gamma Correction, Noise reduction, Edge
enhancement etc.)
TI DM8168
TI AM3894 4 x 3MPix MJPEG
2 x 1080P HD
2 x SD
1 x QSD
FPGA
Image Sensor
12M Pixel OR 4 x 3M Pixel
RAW Data
2 x HD
Video Ports
PCI-ExpressImage
Enhancement
Pipeline

13. Product Design
Applications:
Surveillance, Video Processing
Special Features:
4x DDR3-800| 2DDR2-400| Gigabit Ethernet | Portable | SATA | HDMI |AV Encoding + Decoding |4-channel video|
13
Design before Processor was in the market!
•TI DM8168 based design
•One of the first few Netra Designs in the world
•Multi-pass Design reviews
•Reviews by Semiconductor vendors design team
•Back up Plan: Dual Processor Design
•Flexible architecture for 8 product variants
•Fan-less Design (14W)
•High Speed interconnects
•Dual Processor Design
•Scalable architecture

14. Mobile Network Video Recorder
Applications:
Video Surveillance | Driver behavior Analysis
Special Features:
12 IP camera recording | 3G Module with GPS | LCD connectivity | Temperature range -20°C to +60°C
14
• High Definition Recording
• Seamless Connectivity
• Vibration Proof (MIL-STD-810F method 514.5C)
• Modular design for multiple product variants
roadmap
• Scalable Architecture by cascading multiple units
• RS232, USB, MicroUSB, Dual Gigabit Ethernet
Interfaces
• 128GB SSD, 1TB HDD, 32GB SDHC Storage
• Power to 12 Cameras on PoE
• 3-axis accelerometer
• Redundant Power supply

15. Case Study - Handheld HD Live Video Streaming
Applications:
Live video broadcasting over GSM network for professional
applications like media coverage
Special Features:
Modular design to support various video interfaces | 4 different PCAs in a system| Wide operating temperature
-40°C to +85°C | Optimized power consumption | Wireless modem support
15
Processor & Peripheral Highlights:
• Multi-processors + FPGA based multi board
Complex Hardware Platform
• TI – DaVinci (DM6467T) , Sitara (AM3505)
and MSP430
• Xilinx – Spartan-6 FPGA
• DDR3-800, NAND, SD Card
• SDI, HDMI and Analog Audio/Video support
• Four 3G Modems
• Fast Ethernet
• 802.11 b/g/n WLAN (Wi-Fi)
• Bluetooth 2.1
• USB 2.0 OTG and SD CARD Interface for Mass
Storage application
• 4.3” LCD with Touch Screen
• Battery Operated

16. Thank you
For more information,
write us at marketing@einfochips.com
or visit www.einfochips.com