2. May 4, 2011 2
Outline
• IC Power consumption – background
• MSC8157 brief overview
• State of the art power saving techniques description and their applications to
MSC8157.
– Architecture – enabled power saving techniques.
– Design– enabled power saving techniques.
– Manufacturing technology and assembly – enabled power saving techniques.
• Summary
3. May 4, 2011 3
Power consumption - general
• Integrated Circuit (IC) device power consumption is defined as amount of energy,
supplied by an external power supply to the device in pre-defined time period.
• We distinguish peak, maximum, typical application average and stand-by power
consumption.
– Peak power consumption defines external power supply capability including
bulk/decoupling capacitors influence.
– Maximum power consumption defines system thermal requirements and usually given for a
time period, equal to or bigger than the system thermal reactance.
– Average power consumption stands to define system requirement for typical application.
– Stand-by power consumption describes system power consumption in stand-by/idle mode.
• Power consumption reduction became important to Modern Ultra Large Scale
Integration (ULSI) products. Design teams fight for lower power consumption
during all design stages.
4. May 4, 2011 4
IC Power consumption partitioning
• Power consumption comprises dynamic and static parts.
• Static power consumption is defined by IC active devices leakage and short circuit currents:
– Leakage is mainly caused by MOSFET devices sub-threshold and gate current.
– Short circuit current is characteristic to biased circuits, pull-up or pull-down devices and some
terminated circuits.
– Static power consumption greatly depends on the power supply voltage VDD and temperature T.
• Dynamic power consumption is mainly set by active devises switching.
– Dynamic power consumption depends on the power supply voltage VDD and average
system/device clock frequency F.
P = f(VDD
2,F)
P = f(VDD
3,T)
6. May 4, 2011 6
Power saving techniques
• State of the art power saving techniques include the following:
– Low power modes;
– Power supply separation;
– Active Power Shut-off;
– Active Clock gating;
– Multi-Voltage approach;
– Multi-Frequency approach;
– Multi-threshold CMOS design;
• MSC8157 make use of various power saving techniques, including
architectural, design and manufacturing technology enabled – almost all
known state of the art solutions, mentioned above.
7. May 4, 2011 7
Low power modes (LPM)
• Low Power Mode (LPM) is a mean of purposeful and environmental operation of a
functional unit to achieve its lowest possible power consumption.
• LPM should be aligned with the purposeful utilization of the functional unit (block).
• Proper LPM definition allows best power consumption reduction.
• Improper LPM definition may cause opposite result and affects IC functionality and
performance.
Full utilization
High utilization
Low utilization
Not in
use
Block functioning profile
Power
consumption
8. May 4, 2011 8
Low power modes (cont’d)
• Full utilization of the functional unit requires all its resources available, so no LPM can be
applied.
• The functional unit design is usually targeted to this operating mode.
Full utilization
High utilization
Low utilization
Not in
use
Block functioning profile
Power
consumption
9. May 4, 2011 9
Low power modes (cont’d)
• High utilization allows some functional or environmental relaxation to save either dynamic
or static power or both:
– Some voltage reduction saves both dynamic and static power;
– Frequency decrease or stopping some clocking signals saves dynamic power.
Full utilization
High utilization
Low utilization
Not in
use
Block functioning profile
Power
consumption
10. May 4, 2011 10
Low power modes (cont’d)
• Low utilization allows variety of low power modes to be applied to the block.
– Voltage reduction saves both dynamic and static power;
– Frequency decrease or alternatively disabling part of the clock signals toggling saves dynamic
power;
– Power gating may be extensively used and greatly saves static power.
Full utilization
High utilization
Low utilization
Not in
use
Block functioning profile
Power
consumption
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Low power modes (cont’d)
• When the block is not in use its physical disconnection from the power supply provides
maximal leakage power saving.
– Physically disconnected blocks are not available for potential use.
• Alternatively on-die power gating also provides significant leakage power saving.
– This can allow the block usage in the future.
Full utilization
High utilization
Low utilization
Not in
use
Block functioning profile
Power
consumption
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Active Power Shut-off (PSO)
• On-die power gating (PG) or Power Shutoff (PSO) technique is used for leakage power reduction
in VLSI devices
– Characterized by disconnection of part(s) of a functional unit or the entire unit from the continuous
power supply network
– Used when the unit’s operation is not required.
• The disconnection is provided by a switch, placed in power supply current path and controlled
from another functional unit.
• PSO blocks when powered up, must start from the reset state.
VDDC
VDD gated
GND
Gated
Power
Domain
Switch
VDDC
GND
Continuous
Power
Domain
Control
Continuous supply
Gated supply
Continuous supply
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Recovery from a PSO state
• Supply voltage recovery at the PSO exit takes time (dozens to hundreds of system clock
periods). This is in order to keep low noise on the continuous or keep-alive power supply part
(which provides the power supply voltage to devices that should remain powered on, e.g. data
retaining devices, PSO controls etc).
• The consequence of that is the reduction in the PSO method efficiency, especially for short Low
Power Mode (LPM) periods (like periods ## 2, 6).
tpower-up
7
5
3
1
Time
Time
2 6
4
LPM
enable
V
gated
supply
up
power
off
leak
on
leak
saved P
P
P
P
Short LPM
period
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Clock disabling
• Clock disabling is an effective method of dynamic power saving.
• Clock network toggling provides more than 50% of the dynamic power consumption of a
typical VLSI circuit.
• Clock gating is a way of blocking the clock propagation, clock network toggling and
consequent clocking signal arrival to registers, when logic operation does not require that.
EN
CK
GCK
CK
EN
GCK
P=f(VDD
2,F)
Clock
gate
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Functional unit Clock disabling
EN_Z
CK
EN_A
Unit A
Unit Z
EN
Clock
source
CKG_A
CKG_Z
CKG
• Clock may be disabled either locally at the functional unit or globally for entire chip.
• Local disabling allows fine resolution of the blocks power management:
• Recovery from the local disabling is usually immediate or very short.
• Chip level clock distribution network and the clock source are still toggling even if all units are not in use.
Local clock gating
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Global Clock disabling
EN_Z
CK
EN_A
Unit A
Unit Z
EN
Clock
source
CKG_A
CKG_Z
CKG
• Global clock disabling allows saving of the chip clock distribution network power.
• All chip units are disabled.
• Reset is usually required to recover from the global clock gating.
• Global clock source disabling (e.g. PLL stop) is the most efficient power saving way not
employing power supply voltage manipulation.
• Reset is required to recover from the clock shut down.
• Recovery time is usually long.
Global clock
gating
Clock source
disabling
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Power distribution network partitioning
• Power distribution network partitioning or power supply separation is a technique, used
to provide different voltages to different parts of the IC.
• Static power saving for IC parts which are not in use for specific application.
• Power saving for IC parts which operation is possible at lower voltage.
• Power distribution network partitioning impacts global power distribution system quality.
It should be avoided if not required.
• Exaggerated power distribution network partitioning requirement and improper use may
bring to opposite results.
VDD1
Power
Domain
1
GND
VDD2
Power
Domain
2
GND
Die
P = f(VDD
2,F)
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Dynamic voltage scaling (DVS)
Ichip
Software control
function G(Ichip)
VDD
• Dynamic Voltage Scaling stands for varying the power supply voltage based on the
system needs and serves for dynamic and static power saving:
• Manufacturing technology and environmental conditions (like “Faster” manufacturing process
corner or lower temperature).
• Functional conditions (like LPM: “power down”, “deep sleep”, “doze” etc.)
• Functional constraints (application demand).
• The disadvantage of DVS is that transition between different voltages takes time:
• Functional unit operation during the voltage transition may be limited or blocked.
P=f(VDD
2,F)
GND
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Frequency scaling (FS)
Ichip
Software control
function G(f,Ichip)
VDD
• Frequency Scaling stands for selection of the system clock frequency, based on the
system needs:
• Running not extensive application that does not require full system bandwidth.
P=f(VDD
2,F)
GND
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Multi-Threshold CMOS (MTCMOS)
• With the continuous scaling of CMOS devices, the device leakage current is becoming a
major contributor to the IC power consumption and it is further expected to increase
with the technology scaling.
• The leakage current of MOSFET devices greatly influenced by its threshold voltage Vth.
P=f(1/Vth)
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MTCMOS (cont’d)
• For a VLSI circuit, some MOSFETs in non-critical logic signals electrical paths may be
manufactured having higher threshold voltage.
• the leakage current is reduced;
• the performance is maintained since low threshold transistors are used in the critical signal path(s).
• Both high performance and low power are achieved simultaneously.
• Multi-threshold technique is good for leakage power reduction during both standby and
active modes without performance and die area penalty.
28. May 4, 2011 28
Power Saving in VLSI - Summary
• Defined IC Power consumption, including its parts and its influencing operational and
environmental factors.
• Overviewed Architecture – enabled power saving techniques: Low power modes
definition, Active Power shut-off (PSO) and Active Clock disable function.
• Outlined Design– enabled power saving techniques: Multi-Voltage and Multi-Frequency
operation.
• Discussed Manufacturing technology – enabled power saving technique - Multi-
threshold CMOS approach.