Brochure Electronics Cooling Products

MECHANICAL ENGINEERING CONSULTANTS
ELECTRONICS COOLING & TESTING SERVICES


The Benefits of Our Thermal Engineering Services

• Design functional and reliable electronic
equipment that will work in the intended
environmental conditions.

• Save money by understanding the thermal
issues early and correcting them before they
are too serious to fix in a cost-effective
manner.

• Use prototyping as a means to validate
designs rather than as a means to do design
iterations and save a significant amount of
hardware and test related costs.

• Ensure that marketing requirements are
satisfied before product specifications are
committed to potential customers.

TDMG Inc www.tdmginc.com


How We Can Help You Achieve These Benefits

Evaluation of concept design options for racks, shelves.

Quick modeling capability provides accurate information
about channel air flow, fan operating points, and system
pressure drop, even at the early conceptual stages of the
design.

CONCEPT LEVEL ANALYSIS OF
TELECOMMUNICATION SHELF

T (Deg C)
Component placement evaluation on PCBs 106.3
97.1
LAYOUT 1 LAYOUT 2
87.8
Board level analysis can assist in determining
78.6
the optimum component layout. 69.3
60.0
50.8
41.5
32.3

COMPONENT PLACEMENT ANALYSIS




Detailed component modeling

Detailed modeling allows us to accurately evaluate
the component heat loads and establish accurate
case and junction temperatures.

The level of detail can be as fine as necessary
depending on the actual situation. DETAILED COMPONENT ANALYSIS INCLUDES
CONNECTORS, PCB VIAS, AIR GAPS, AND COPPER SLUG

Two-resistor and Delphi models can be used to
simulate the components.

ICs and multi-component packages can be
modeled in detail and characterized at the early
stages of the design avoiding costly design
iterations.

DETAILED COMPONENT ANALYSIS INCLUDES DIE, DIE
ATTACH, BOND WIRES, SUBSTRATE VIAS, SOLDER
BALLS, ETC




Heatsink optimization

Heatsink optimization allows verification of
performance under various conditions.

The design of components or systems can be
optimized for one specific environment, or in
PEDESTAL HEATSINK OPTIMIZED FOR PLACEMENT
some cases optimization is required such that ELLIPTICALLY SHAPED FINS OF DEVICE IN ANY POSITION ON PCB

the heatsink can perform as well in various
positions or orientation.

THERMAL ANALYSIS FOR VGA FANSINK APPLICATION HEATSINK FINS OPTIMIZED FOR ORIENTATION IN VERTICAL OR 45º ORIENTATION




System level analysis for racks, shelves.

The system level modeling provides crucial
information about the operating temperatures of
boards and components.

With this type of analysis, we can investigate the
effects of fan-failed scenarios, establish fan-control
points, investigate transient operation, operations
at altitude conditions, impact of on-line replacement
of cooling unit, etc.

Our capabilities includes design of liquid cooled
systems.

New cards can easily be introduced into the
existing shelf model for investigation of new
hardware.




Results presentation 0.8

0.7

0.6

0.5

IN. H2O
0.4

With our analysis tools, results can be clearly 0.3

0.2

presented to allow our customers to make the right 0.1

0

engineering decisions early in the design phase. 0 100 200 300 400
CFM
500 600 700

Results can be presented in the following forms to
ensure that the data is properly communicated:

Velocity vector plots
Temperature plots
Surface plots
Flow animations
Fan operating points
Spreadsheet summary, etc



Results presentation

Spreadsheet format provides clear information regarding the status of all components of interest
for different operating conditions.

The sample spreadsheet below shows the pass/fail status for each component of interest for “all
fans operating” and 2 different “fan failed” scenarios.
Main Unit
Air Filter
Tamb(°C): 55 °C Tamb(°C): 40 °C Tamb(°C): 40 °C
All Fans Operating Front Center Fan Failed Front Right Fan Failed
Max Allowable Temp. Tj or Tc (deg Tj or Tc (deg Tj or Tc (deg Tj or Tc (deg Tj or Tc (deg Tj or Tc (deg
Compact Model Power (W) 2 Resistor Model Pass/ Fail? Pass/ Fail? Pass/ Fail?
(deg C) C) C) C) C) C) C)

Max Allowable Temp. Tj at 23°C Tj at 55°C Tj at 23°C Tj at 40°C Tj at 23°C Tj at 40°C
PD(W) (deg C) 2 Resistor Model Ambient Ambient Pass/ Fail? Ambient Ambient Pass/ Fail? Ambient Ambient Pass/ Fail?
Data Card
FPGA456
4 125 Theta JC = 8 120.00 152.00 FAIL 105.00 122.00 FAIL 120.00 137.00 FAIL
OEM Theta JB = 23 -27 >5C 3 >5C -12 >5C

Max Allowable Temp. Tj at 23°C Tj at 55°C Tj at 23°C Tj at 40°C Tj at 23°C Tj at 40°C
Data Card
FPBGA289 1 105 Theta JC = 6 65.00 97.00 Marginal 72.00 89.00 Pass 68.00 85.00 Pass
OEM Theta JB = 20 8 >5C 16 >5C 20 >5C

Max Allowable Temp. Tc at 23°C Tc at 55°C Tc at 23°C Tc at 40°C Tc at 23°C Tc at 40°C
Data Card
SFP 1 85 NA 45.00 77.00 Marginal 42.00 59.00 Pass 40.00 57.00 Pass
OEM (T-case) 8 >5C 26 >5C 28 >5C



Testing

TDMG has an 850 sq ft test facility with windtunnel in order to
perform validation testing of cooling solutions. It is often
necessary to characterize components (cards, heatsinks, fan
trays, ect) or to perform validation testing of the complete system.
Our facilities allow us to test systems from a few CFM up to 1000
CFM.



Custom Cooling Products

TDMG provides custom cooling products of many of its customers. Our supplier base is
international with access to both local and foreign manufacturing capabilities for prototype and
production level systems. A few of the cooling systems developed are shown here:



Capabilities

TDMG has been performing Electronics Cooling analysis since 1999. Electronics
cooling analysis represents a significant part of our work, however, TDMG has been
performing other types of analyses as well.

As an example, our capabilities have developed to include analysis of built systems
(such as clean-room and data center analysis), hydrogen out gassing in battery
cabinets, fire modeling and toxic gas concentrations, and other general CFD
applications.

In addition, over the last few years, we have been performing significantly more
stress and vibration analysis, a capability that was always available in-house, but
that we have been successfully expanding recently.

For more information regarding our full suite of capabilities, please visit our website
at www.tdmginc.com.



Contact Us

Please contact us for an informal review of your thermal issues. It will be our
pleasure to discuss these with you and give you our initial feedback, including
whether thermal and CFD simulation is even required.

Bruno Zoccali
TDMG Inc
100 Alexis Nihon, Suite 102
St Laurent, Quebec
H4M 2N6
Tel: 514-381-9115 x.200

www.tdmginc.com


Brochure Electronics Cooling Products

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