The document describes a new manufacturing process called the Occam Process as an alternative to traditional solder-based electronic assembly. The Occam Process involves placing components on a temporary substrate, encapsulating them, removing the substrate, and then using additive processes to interconnect the components without solder. The process aims to address challenges with lead-free solder and provide benefits like reduced costs, improved reliability, and new design possibilities. The document outlines the Occam Process steps, benefits over traditional assembly, and roadmap for further development and industry adoption of the new technology.

1. An Alternative Method for Manufacturing Robust Electronic Assemblies Without Solder Joseph Fjelstad President Verdant Electronics

9. The Occam Process

11. Sample Process Sequence Patents pending

12. CONVENTIONAL SMT ASSEMBLY SCHEMATIC BOM PWB DESIGN ASSEMBLY DESIGN SMT ASSEMBLY PARTS ENGINEERING PROCURE PARTS SOLDER, PASTE, FLUX INVENTORY, STORAGE RELIABILITY ASSURANCE PWB FAB, PROCURE Storage & Inventory VERDANT ELECTRONICS’ OCCAM PROCESS THE OCCAM PROCESS SCHEMATIC BOM ASSEMBLY DESIGN PARTS ENGINEERING PROCURE PARTS Storage & Inventory CIRCUIT DESIGN

13. Supply Chain Compression

15. Benefits Analysis

19. Overlapping Components Patents pending

21. Alternative Routing Offers Layer Reduction

22. QFP/QFN Routing Advantage

23. BGA Routing Advantage

24. Single Lead Pitch Potential

25. HDI - Price/Density Comparison RCI: Rel price to 8L DEN: Ave pins/sq.inch Source: Happy Holden

26. The Future of Electronics?

28. Connecting Assemblies Patents pending

29. Stacking and Interconnecting Occam Processed Assemblies Patents pending

31. Occam Process for Flex Circuits

32. Occam Process for Flex Circuits

33. Occam Process for Flex Circuits

34. Occam Process for Flex Circuits

35. Occam Process for Flex Circuits

36. Occam Process for Flex Circuits Patents Pending

38. Co-Design Compresses Time IC Design Package Design PCB Design IC Design Package Design PCB Design Time to Market Reduction

41. Cost Comparison Model

42. Conventional SMT Line Ionograph $15K X-ray $50K Equipment with ~capital cost Source: Richard Otte, Promex Industries Water Wash Machine $80K Solder Paste Measurement Station $15K Kitting, Feeder Setup Solder Printer $75K P&P Machine $200K Reflow Oven $55K

44. Occam Process Line Water Wash Machine Solder Paste Measurement Station Kitting, Feeder Setup Solder Printer P&P Machine $200K Reflow Oven Encapsulant Dispenser $75K Encapsulant Cure Station $5K X-ray Ionograph Interconnect deposition $? Source: Richard Otte, Promex Industries

46. Alternative Structures

47. Alternative Solderless Structures Patents Pending programmed

48. Occam and Direct Write Technology

49. Occam Process - Direct Write Ink jet printer Patents Pending

50. Occam Roadmap

54. The Learning Curve Cost Time Source BPA New Technology Incumbent Technology

56. “ Whatever you can do or dream you can, begin it. Boldness has genius, power and magic in it. Begin it now. ” ~Johann Goethe~ Thank You