Passive Hybrid MEMS for High-Temperature Telemetric Measurements
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Passive Hybrid MEMS for High-Temperature Telemetric Measurements
- 9. Components of MEMS
- 11. Image of the hybrid telemetric MEMS.
- 13. Microscope image of interdigitated capacitor
- 15. Bent Beam structure .
- 17. Equivalent model of the interdigitated capacitor and an impedance diagram measured at 270 ◦C [(a) modulus and (b) phase].
- 18. Impedance module of the interdigitated capacitor measured at different Temperatures(100 ◦C to 330 ◦C.)
- 21. Microscope image of the inductor A1 realized by thick-film deposition on alumina.
- 22. Microscope image of the inductor B1 realized by photolithography
- 23. Equivalent model of the planar inductor and impedance diagrams at different temperatures.(23 ◦C to 340 ◦C)
- 28. BLOCK DIAGRAM OF INDUCTIVE TELEMETRY
- 31. Modulus and phase of the impedance measured from the terminals of the readout inductor.
- 35. Modules of hybrid sensor measured using impedance analyzer at different temperatures.
- 36. Phase of hybrid sensor measured using impedance analyzer at different temperatures
- 38. Capacitance sensor values directly measured and compared with the calculated ones.
- 39. Temperature values measured with the Pt100 and compared with the Min-Phase and 3-Resonances calculated values.