SlideShare a Scribd company logo
1 of 17
Download to read offline
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 1
21 rue La Nouë Bras de Fer - 44200 Nantes - France
Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr
May 2013 - Version 1
Written by: Romain FRAUX
DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic
estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is
made of the contents of this report. The quoted trademarks are property of their owners.
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 2
Table of Contents
Glossary
1. Overview / Introduction……….……….…........…2
– Executive Summary
– What's Surprising in this Device?
– Reverse Costing Methodology
2. CMOS Image Sensor Market………….……....….7
– CIS Revenue – 2011 Market Share
– Sony Production Capacity and wafer fabs
3. Nokia Lumia 920 Teardown.………….…….......10
4. Physical Analysis………………………..............14
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Camera Module with flex
– Camera Module Views & Dimensions
– Camera Module X-Ray
– Camera Module Disassembly
– CIS Views & Dimensions
– CIS Resolutions
– CIS Pads
– CIS without Microlenses
– CIS Pixels
– CIS Technology node
– CIS Memory
– Camera Module Cross-sections
 Housings
 PCB
 Lenses
 Autofocus actuator/OIS
 IR FIlter
– CIS Cross-sections
5. Manufacturing Process Flow……………….….71
– Global Overview
– CIS Process Flow
– BSI Detailed Process Flow
– Description of the CIS Wafer Fabrication Unit
6. Cost Analysis…………….………….………..…..77
– Synthesis of the Cost Analysis
– Main Steps of Economic Analysis
– Supply Chain
– Yields Explanation
– Yields Hypotheses
– CIS Front-End : Hypotheses
– CIS FEOL + BEOL Cost
– CSI BSI Cost
– CIS BSI Cost per Process Steps
– CIS BSI : Equipment Cost per Family
– CIS BSI : Material Cost per Family
– CIS Front-End Cost
– CIS Back-End 0 : Test & Dicing
– CIS Wafer Cost (Front-End + Back-End 0)
– CIS Die Cost & Price
– Camera Module Assembly - Hypotheses
– Lens Module Cost
– Autofocus Actuator / OIS Cost
– Main ICs and IR Filter Cost
– Final Assembly Cost
– Camera Module Cost
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 3
Executive Summary
• This full reverse costing study has been conducted to provide insight on technology data and
manufacturing cost of the Nokia Lumia 920 camera module.
• It is the first smartphone's camera module integrating an autofocus actuator with optical image
stabilization (OIS).
• The camera module is equipped with a 5-elements "floating lens" module which moves in
synchronization with the camera movement.
• The camera module integrates a 8.7 megapixel CMOS Image Sensor (CIS) from Sony. The CIS
features a 1.4µm pixel size and uses a Back-Side Illuminated (BSI) technology.
• The camera module is provided in a 12.5mm x 12.5mm x 6.00mm package.
• We estimate that Nokia is the prime contractor.
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 4
What's Surprising in this Device?
• The gyroscope integrating in the camera module is used to measure the camera movement (on two
axes, pitch and yaw), but also handles user-motion recognition (on three axes, roll/pitch/yaw), allowing
cost and board space savings of the phone. This two-in-one feature is possible due to the integration of a
dual-core 3-axis MEMS gyroscope supplied by STMicroelectronics.
• Compared to other smartphones which use "off-the-shelf" CMOS Image Sensors for resolutions of 8
megapixel and beyond, the camera module of the Nokia Lumia 920 employs a custom oversized 8.7
megapixel CIS able to provide true 16:9 and 4:3 formatted aspect ratios.
• Most of Nokia previous camera modules used STMicroelectronics and Toshiba as CIS suppliers (ST for
low-end modules and Toshiba for high-end modules). This time, Nokia choose Sony for the CIS of the
Lumia 920.
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 5
Nokia Lumia 920 Teardown
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 6
Camera Module Views & Dimensions
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 7
Camera Module Disassembly
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 8
CIS View & Dimensions
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 9
CIS Pads
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 10
Camera Module Cross-Section 2
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 11
CIS Cross-Section
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 12
CIS Process Flow
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 13
CIS Wafer Cost (Front-End + Back-End 0)
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 14
Lens Module Cost
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 15
Autofocus Actuator / OIS Cost
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 16
Final Assembly Cost
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 17
Camera Module Cost

More Related Content

What's hot

LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module f...
LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module f...LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module f...
LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module f...Yole Developpement
 
2.5D / 3D TSV & Wafer-Level Stacking: Technology & Market Updates 2019 Report...
2.5D / 3D TSV & Wafer-Level Stacking: Technology & Market Updates 2019 Report...2.5D / 3D TSV & Wafer-Level Stacking: Technology & Market Updates 2019 Report...
2.5D / 3D TSV & Wafer-Level Stacking: Technology & Market Updates 2019 Report...Yole Developpement
 
STMicroelectronics LSM9DS0 9-Axis MEMS IMU teardown reverse costing report pu...
STMicroelectronics LSM9DS0 9-Axis MEMS IMU teardown reverse costing report pu...STMicroelectronics LSM9DS0 9-Axis MEMS IMU teardown reverse costing report pu...
STMicroelectronics LSM9DS0 9-Axis MEMS IMU teardown reverse costing report pu...Yole Developpement
 
Growth of advanced packaging - What make it so special? Presentation by Rozal...
Growth of advanced packaging - What make it so special? Presentation by Rozal...Growth of advanced packaging - What make it so special? Presentation by Rozal...
Growth of advanced packaging - What make it so special? Presentation by Rozal...Yole Developpement
 
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...system_plus
 
Flipchip Technologies & Market Trends 2015 Report by Yole Developpement
Flipchip Technologies & Market Trends 2015 Report by Yole DeveloppementFlipchip Technologies & Market Trends 2015 Report by Yole Developpement
Flipchip Technologies & Market Trends 2015 Report by Yole DeveloppementYole Developpement
 
2D3D AOI在packaging substrate的運用及演變與對設備商之建議
2D3D AOI在packaging substrate的運用及演變與對設備商之建議2D3D AOI在packaging substrate的運用及演變與對設備商之建議
2D3D AOI在packaging substrate的運用及演變與對設備商之建議CHENHuiMei
 
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
 
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
 
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
 
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...Yole Developpement
 
從封測產業趨勢談設備需求與機會_ part2
從封測產業趨勢談設備需求與機會_ part2從封測產業趨勢談設備需求與機會_ part2
從封測產業趨勢談設備需求與機會_ part2CHENHuiMei
 
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
 
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
 
Mems and sensors packaging technology and trends presentation held by Amandin...
Mems and sensors packaging technology and trends presentation held by Amandin...Mems and sensors packaging technology and trends presentation held by Amandin...
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
 
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...Yole Developpement
 
BioMEMS Market and Technology 2020
BioMEMS Market and Technology 2020BioMEMS Market and Technology 2020
BioMEMS Market and Technology 2020Yole Developpement
 
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
 
STMicroelectronics LPS22HB Nano Pressure Sensor 2016 teardown reverse costin...
STMicroelectronics LPS22HB Nano Pressure Sensor 2016 teardown reverse costin...STMicroelectronics LPS22HB Nano Pressure Sensor 2016 teardown reverse costin...
STMicroelectronics LPS22HB Nano Pressure Sensor 2016 teardown reverse costin...Yole Developpement
 
Computing for Datacenter Servers 2021 - Sample
Computing for Datacenter Servers 2021 - SampleComputing for Datacenter Servers 2021 - Sample
Computing for Datacenter Servers 2021 - SampleYole Developpement
 

What's hot (20)

LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module f...
LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module f...LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module f...
LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module f...
 
2.5D / 3D TSV & Wafer-Level Stacking: Technology & Market Updates 2019 Report...
2.5D / 3D TSV & Wafer-Level Stacking: Technology & Market Updates 2019 Report...2.5D / 3D TSV & Wafer-Level Stacking: Technology & Market Updates 2019 Report...
2.5D / 3D TSV & Wafer-Level Stacking: Technology & Market Updates 2019 Report...
 
STMicroelectronics LSM9DS0 9-Axis MEMS IMU teardown reverse costing report pu...
STMicroelectronics LSM9DS0 9-Axis MEMS IMU teardown reverse costing report pu...STMicroelectronics LSM9DS0 9-Axis MEMS IMU teardown reverse costing report pu...
STMicroelectronics LSM9DS0 9-Axis MEMS IMU teardown reverse costing report pu...
 
Growth of advanced packaging - What make it so special? Presentation by Rozal...
Growth of advanced packaging - What make it so special? Presentation by Rozal...Growth of advanced packaging - What make it so special? Presentation by Rozal...
Growth of advanced packaging - What make it so special? Presentation by Rozal...
 
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...
 
Flipchip Technologies & Market Trends 2015 Report by Yole Developpement
Flipchip Technologies & Market Trends 2015 Report by Yole DeveloppementFlipchip Technologies & Market Trends 2015 Report by Yole Developpement
Flipchip Technologies & Market Trends 2015 Report by Yole Developpement
 
2D3D AOI在packaging substrate的運用及演變與對設備商之建議
2D3D AOI在packaging substrate的運用及演變與對設備商之建議2D3D AOI在packaging substrate的運用及演變與對設備商之建議
2D3D AOI在packaging substrate的運用及演變與對設備商之建議
 
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...
 
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...
 
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...
 
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...
 
從封測產業趨勢談設備需求與機會_ part2
從封測產業趨勢談設備需求與機會_ part2從封測產業趨勢談設備需求與機會_ part2
從封測產業趨勢談設備需求與機會_ part2
 
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...
 
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...
 
Mems and sensors packaging technology and trends presentation held by Amandin...
Mems and sensors packaging technology and trends presentation held by Amandin...Mems and sensors packaging technology and trends presentation held by Amandin...
Mems and sensors packaging technology and trends presentation held by Amandin...
 
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...
 
BioMEMS Market and Technology 2020
BioMEMS Market and Technology 2020BioMEMS Market and Technology 2020
BioMEMS Market and Technology 2020
 
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...
 
STMicroelectronics LPS22HB Nano Pressure Sensor 2016 teardown reverse costin...
STMicroelectronics LPS22HB Nano Pressure Sensor 2016 teardown reverse costin...STMicroelectronics LPS22HB Nano Pressure Sensor 2016 teardown reverse costin...
STMicroelectronics LPS22HB Nano Pressure Sensor 2016 teardown reverse costin...
 
Computing for Datacenter Servers 2021 - Sample
Computing for Datacenter Servers 2021 - SampleComputing for Datacenter Servers 2021 - Sample
Computing for Datacenter Servers 2021 - Sample
 

Viewers also liked

Apple iPhone 7 Plus: Rear-Facing Dual Camera Module 2016 teardown reverse cos...
Apple iPhone 7 Plus: Rear-Facing Dual Camera Module 2016 teardown reverse cos...Apple iPhone 7 Plus: Rear-Facing Dual Camera Module 2016 teardown reverse cos...
Apple iPhone 7 Plus: Rear-Facing Dual Camera Module 2016 teardown reverse cos...Yole Developpement
 
Iaetsd designing of cmos image sensor test-chip and its characterization
Iaetsd designing of cmos image sensor test-chip and its characterizationIaetsd designing of cmos image sensor test-chip and its characterization
Iaetsd designing of cmos image sensor test-chip and its characterizationIaetsd Iaetsd
 
Electrolytic processes in restorative dentisrty /certified fixed orthodontic...
Electrolytic processes in restorative dentisrty  /certified fixed orthodontic...Electrolytic processes in restorative dentisrty  /certified fixed orthodontic...
Electrolytic processes in restorative dentisrty /certified fixed orthodontic...Indian dental academy
 
Innovative surface coating technology
Innovative surface coating technologyInnovative surface coating technology
Innovative surface coating technologyPankaj Patil
 
Camera Module Industry August 2015 Report by Yole Developpement
Camera Module Industry August 2015 Report by Yole DeveloppementCamera Module Industry August 2015 Report by Yole Developpement
Camera Module Industry August 2015 Report by Yole DeveloppementYole Developpement
 
Electronics 2015 web
Electronics 2015 webElectronics 2015 web
Electronics 2015 webAlan Gardner
 
Status of the CMOS Image Sensor Industry 2016: New Dynamics in Market and Tec...
Status of the CMOS Image Sensor Industry 2016: New Dynamics in Market and Tec...Status of the CMOS Image Sensor Industry 2016: New Dynamics in Market and Tec...
Status of the CMOS Image Sensor Industry 2016: New Dynamics in Market and Tec...Yole Developpement
 

Viewers also liked (9)

Apple iPhone 7 Plus: Rear-Facing Dual Camera Module 2016 teardown reverse cos...
Apple iPhone 7 Plus: Rear-Facing Dual Camera Module 2016 teardown reverse cos...Apple iPhone 7 Plus: Rear-Facing Dual Camera Module 2016 teardown reverse cos...
Apple iPhone 7 Plus: Rear-Facing Dual Camera Module 2016 teardown reverse cos...
 
Iaetsd designing of cmos image sensor test-chip and its characterization
Iaetsd designing of cmos image sensor test-chip and its characterizationIaetsd designing of cmos image sensor test-chip and its characterization
Iaetsd designing of cmos image sensor test-chip and its characterization
 
Electrolytic processes in restorative dentisrty /certified fixed orthodontic...
Electrolytic processes in restorative dentisrty  /certified fixed orthodontic...Electrolytic processes in restorative dentisrty  /certified fixed orthodontic...
Electrolytic processes in restorative dentisrty /certified fixed orthodontic...
 
Innovative surface coating technology
Innovative surface coating technologyInnovative surface coating technology
Innovative surface coating technology
 
10 tipps-sicheres-dating
10 tipps-sicheres-dating10 tipps-sicheres-dating
10 tipps-sicheres-dating
 
Surface Finishes: Why do I need to know more?
Surface Finishes: Why do I need to know more?Surface Finishes: Why do I need to know more?
Surface Finishes: Why do I need to know more?
 
Camera Module Industry August 2015 Report by Yole Developpement
Camera Module Industry August 2015 Report by Yole DeveloppementCamera Module Industry August 2015 Report by Yole Developpement
Camera Module Industry August 2015 Report by Yole Developpement
 
Electronics 2015 web
Electronics 2015 webElectronics 2015 web
Electronics 2015 web
 
Status of the CMOS Image Sensor Industry 2016: New Dynamics in Market and Tec...
Status of the CMOS Image Sensor Industry 2016: New Dynamics in Market and Tec...Status of the CMOS Image Sensor Industry 2016: New Dynamics in Market and Tec...
Status of the CMOS Image Sensor Industry 2016: New Dynamics in Market and Tec...
 

Similar to Nokia Lumia 920 - Camera Module with OIS teardown Report by published Yole Developpement

Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...
Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...
Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...Yole Developpement
 
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...system_plus
 
Wasef al hakim visual cv
Wasef al hakim visual cvWasef al hakim visual cv
Wasef al hakim visual cvWasef Al-Hakim
 
FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...
FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...
FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...Yole Developpement
 
Capella Microsystems CM3512 Ultraviolet Light Sensor teardown reverse costing...
Capella Microsystems CM3512 Ultraviolet Light Sensor teardown reverse costing...Capella Microsystems CM3512 Ultraviolet Light Sensor teardown reverse costing...
Capella Microsystems CM3512 Ultraviolet Light Sensor teardown reverse costing...Yole Developpement
 
INTELLIGENT URBAN TRAFFIC CONTROL SYSTEM / VIDEO SENSOR / WAEL SAAD HAMEEDI /...
INTELLIGENT URBAN TRAFFIC CONTROL SYSTEM / VIDEO SENSOR / WAEL SAAD HAMEEDI /...INTELLIGENT URBAN TRAFFIC CONTROL SYSTEM / VIDEO SENSOR / WAEL SAAD HAMEEDI /...
INTELLIGENT URBAN TRAFFIC CONTROL SYSTEM / VIDEO SENSOR / WAEL SAAD HAMEEDI /...Wael Alawsey
 
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...Yole Developpement
 
Sensonor STIM210 High-precision MEMS Gyro Module teardown reverse costing rep...
Sensonor STIM210 High-precision MEMS Gyro Module teardown reverse costing rep...Sensonor STIM210 High-precision MEMS Gyro Module teardown reverse costing rep...
Sensonor STIM210 High-precision MEMS Gyro Module teardown reverse costing rep...Yole Developpement
 
Video Surveillance Book, 2013
Video Surveillance Book, 2013Video Surveillance Book, 2013
Video Surveillance Book, 2013arms8586
 
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...Yole Developpement
 
Video Surveillance
Video SurveillanceVideo Surveillance
Video SurveillanceMihika Shah
 
glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...
glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...
glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...Yole Developpement
 
Considerations When Choosing A Smart Camera
Considerations When Choosing A Smart CameraConsiderations When Choosing A Smart Camera
Considerations When Choosing A Smart CameraImaging Diagnostics
 
Creating a smarter world with eSIM
Creating a smarter world with eSIMCreating a smarter world with eSIM
Creating a smarter world with eSIMJT IoT
 
Considerations When Choosing A Smart Camera
Considerations When Choosing A Smart CameraConsiderations When Choosing A Smart Camera
Considerations When Choosing A Smart Cameraguestb4aaef
 
Video Surveillance Report
Video Surveillance ReportVideo Surveillance Report
Video Surveillance ReportMihika Shah
 
Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...
Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...
Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...Yole Developpement
 
SAMSUNG IP 4CIF XDR 720 TVL 1280X720 720P D&N POE
SAMSUNG IP 4CIF XDR 720 TVL 1280X720 720P D&N POESAMSUNG IP 4CIF XDR 720 TVL 1280X720 720P D&N POE
SAMSUNG IP 4CIF XDR 720 TVL 1280X720 720P D&N POEDCI Securite
 

Similar to Nokia Lumia 920 - Camera Module with OIS teardown Report by published Yole Developpement (20)

Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...
Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...
Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...
 
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...
 
Wasef al hakim visual cv
Wasef al hakim visual cvWasef al hakim visual cv
Wasef al hakim visual cv
 
41640 smart cams
41640 smart cams41640 smart cams
41640 smart cams
 
FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...
FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...
FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...
 
Capella Microsystems CM3512 Ultraviolet Light Sensor teardown reverse costing...
Capella Microsystems CM3512 Ultraviolet Light Sensor teardown reverse costing...Capella Microsystems CM3512 Ultraviolet Light Sensor teardown reverse costing...
Capella Microsystems CM3512 Ultraviolet Light Sensor teardown reverse costing...
 
INTELLIGENT URBAN TRAFFIC CONTROL SYSTEM / VIDEO SENSOR / WAEL SAAD HAMEEDI /...
INTELLIGENT URBAN TRAFFIC CONTROL SYSTEM / VIDEO SENSOR / WAEL SAAD HAMEEDI /...INTELLIGENT URBAN TRAFFIC CONTROL SYSTEM / VIDEO SENSOR / WAEL SAAD HAMEEDI /...
INTELLIGENT URBAN TRAFFIC CONTROL SYSTEM / VIDEO SENSOR / WAEL SAAD HAMEEDI /...
 
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...
Murata SCC2000 Series X or Z-Axis Gyro & 3-Axis Accelerometer 2015 teardown r...
 
Sensonor STIM210 High-precision MEMS Gyro Module teardown reverse costing rep...
Sensonor STIM210 High-precision MEMS Gyro Module teardown reverse costing rep...Sensonor STIM210 High-precision MEMS Gyro Module teardown reverse costing rep...
Sensonor STIM210 High-precision MEMS Gyro Module teardown reverse costing rep...
 
Video Surveillance Book, 2013
Video Surveillance Book, 2013Video Surveillance Book, 2013
Video Surveillance Book, 2013
 
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...
 
Video Surveillance
Video SurveillanceVideo Surveillance
Video Surveillance
 
glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...
glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...
glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...
 
Considerations When Choosing A Smart Camera
Considerations When Choosing A Smart CameraConsiderations When Choosing A Smart Camera
Considerations When Choosing A Smart Camera
 
Creating a smarter world with eSIM
Creating a smarter world with eSIMCreating a smarter world with eSIM
Creating a smarter world with eSIM
 
Considerations When Choosing A Smart Camera
Considerations When Choosing A Smart CameraConsiderations When Choosing A Smart Camera
Considerations When Choosing A Smart Camera
 
Video Surveillance Report
Video Surveillance ReportVideo Surveillance Report
Video Surveillance Report
 
Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...
Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...
Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...
 
SAMSUNG IP 4CIF XDR 720 TVL 1280X720 720P D&N POE
SAMSUNG IP 4CIF XDR 720 TVL 1280X720 720P D&N POESAMSUNG IP 4CIF XDR 720 TVL 1280X720 720P D&N POE
SAMSUNG IP 4CIF XDR 720 TVL 1280X720 720P D&N POE
 
Gx3512131216
Gx3512131216Gx3512131216
Gx3512131216
 

More from Yole Developpement

Computing and AI technologies for mobile and consumer applications 2021 - Sample
Computing and AI technologies for mobile and consumer applications 2021 - SampleComputing and AI technologies for mobile and consumer applications 2021 - Sample
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
 
Processor Quarterly Market Monitor Q3 2021 - Sample
Processor Quarterly Market Monitor Q3 2021 - SampleProcessor Quarterly Market Monitor Q3 2021 - Sample
Processor Quarterly Market Monitor Q3 2021 - SampleYole Developpement
 
Automotive Semiconductor Trends 2021
Automotive Semiconductor Trends 2021Automotive Semiconductor Trends 2021
Automotive Semiconductor Trends 2021Yole Developpement
 
MicroLED Displays - Market, Industry and Technology Trends 2021
MicroLED Displays - Market, Industry and Technology Trends 2021MicroLED Displays - Market, Industry and Technology Trends 2021
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
 
Neuromorphic Computing and Sensing 2021 - Sample
Neuromorphic Computing and Sensing 2021 - SampleNeuromorphic Computing and Sensing 2021 - Sample
Neuromorphic Computing and Sensing 2021 - SampleYole Developpement
 
Future Soldier Technologies 2021
Future Soldier Technologies 2021Future Soldier Technologies 2021
Future Soldier Technologies 2021Yole Developpement
 
High-end Performance Packaging 2020
High-end Performance Packaging 2020High-end Performance Packaging 2020
High-end Performance Packaging 2020Yole Developpement
 
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020
5G’s Impact on RF Front-End and Connectivity for Cellphones 20205G’s Impact on RF Front-End and Connectivity for Cellphones 2020
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
 
Ultrasound Sensing Technologies 2020
Ultrasound Sensing Technologies 2020Ultrasound Sensing Technologies 2020
Ultrasound Sensing Technologies 2020Yole Developpement
 
Status of the Memory Industry 2020
Status of the Memory Industry 2020Status of the Memory Industry 2020
Status of the Memory Industry 2020Yole Developpement
 
Status of the Radar Industry: Players, Applications and Technology Trends 2020
Status of the Radar Industry: Players, Applications and Technology Trends 2020Status of the Radar Industry: Players, Applications and Technology Trends 2020
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
 
GaN RF Market: Applications, Players, Technology and Substrates 2020
GaN RF Market: Applications, Players, Technology and Substrates 2020GaN RF Market: Applications, Players, Technology and Substrates 2020
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
 
Optical Transceivers for Datacom & Telecom 2020
Optical Transceivers for Datacom & Telecom 2020Optical Transceivers for Datacom & Telecom 2020
Optical Transceivers for Datacom & Telecom 2020Yole Developpement
 
Point-of-Need 2020 – Including PCR-Based Testing
Point-of-Need 2020 – Including PCR-Based TestingPoint-of-Need 2020 – Including PCR-Based Testing
Point-of-Need 2020 – Including PCR-Based TestingYole Developpement
 
Silicon Photonics Market & Technology 2020
Silicon Photonics Market & Technology 2020Silicon Photonics Market & Technology 2020
Silicon Photonics Market & Technology 2020Yole Developpement
 
Sensors for Robotic Mobility 2020
Sensors for Robotic Mobility 2020Sensors for Robotic Mobility 2020
Sensors for Robotic Mobility 2020Yole Developpement
 
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
 
Emerging Non-Volatile Memory 2020 report by Yole Développement
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementEmerging Non-Volatile Memory 2020 report by Yole Développement
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
 
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
 

More from Yole Developpement (20)

Computing and AI technologies for mobile and consumer applications 2021 - Sample
Computing and AI technologies for mobile and consumer applications 2021 - SampleComputing and AI technologies for mobile and consumer applications 2021 - Sample
Computing and AI technologies for mobile and consumer applications 2021 - Sample
 
Processor Quarterly Market Monitor Q3 2021 - Sample
Processor Quarterly Market Monitor Q3 2021 - SampleProcessor Quarterly Market Monitor Q3 2021 - Sample
Processor Quarterly Market Monitor Q3 2021 - Sample
 
Automotive Semiconductor Trends 2021
Automotive Semiconductor Trends 2021Automotive Semiconductor Trends 2021
Automotive Semiconductor Trends 2021
 
MicroLED Displays - Market, Industry and Technology Trends 2021
MicroLED Displays - Market, Industry and Technology Trends 2021MicroLED Displays - Market, Industry and Technology Trends 2021
MicroLED Displays - Market, Industry and Technology Trends 2021
 
Neuromorphic Computing and Sensing 2021 - Sample
Neuromorphic Computing and Sensing 2021 - SampleNeuromorphic Computing and Sensing 2021 - Sample
Neuromorphic Computing and Sensing 2021 - Sample
 
Silicon Photonics 2021
Silicon Photonics 2021Silicon Photonics 2021
Silicon Photonics 2021
 
Future Soldier Technologies 2021
Future Soldier Technologies 2021Future Soldier Technologies 2021
Future Soldier Technologies 2021
 
High-end Performance Packaging 2020
High-end Performance Packaging 2020High-end Performance Packaging 2020
High-end Performance Packaging 2020
 
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020
5G’s Impact on RF Front-End and Connectivity for Cellphones 20205G’s Impact on RF Front-End and Connectivity for Cellphones 2020
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020
 
Ultrasound Sensing Technologies 2020
Ultrasound Sensing Technologies 2020Ultrasound Sensing Technologies 2020
Ultrasound Sensing Technologies 2020
 
Status of the Memory Industry 2020
Status of the Memory Industry 2020Status of the Memory Industry 2020
Status of the Memory Industry 2020
 
Status of the Radar Industry: Players, Applications and Technology Trends 2020
Status of the Radar Industry: Players, Applications and Technology Trends 2020Status of the Radar Industry: Players, Applications and Technology Trends 2020
Status of the Radar Industry: Players, Applications and Technology Trends 2020
 
GaN RF Market: Applications, Players, Technology and Substrates 2020
GaN RF Market: Applications, Players, Technology and Substrates 2020GaN RF Market: Applications, Players, Technology and Substrates 2020
GaN RF Market: Applications, Players, Technology and Substrates 2020
 
Optical Transceivers for Datacom & Telecom 2020
Optical Transceivers for Datacom & Telecom 2020Optical Transceivers for Datacom & Telecom 2020
Optical Transceivers for Datacom & Telecom 2020
 
Point-of-Need 2020 – Including PCR-Based Testing
Point-of-Need 2020 – Including PCR-Based TestingPoint-of-Need 2020 – Including PCR-Based Testing
Point-of-Need 2020 – Including PCR-Based Testing
 
Silicon Photonics Market & Technology 2020
Silicon Photonics Market & Technology 2020Silicon Photonics Market & Technology 2020
Silicon Photonics Market & Technology 2020
 
Sensors for Robotic Mobility 2020
Sensors for Robotic Mobility 2020Sensors for Robotic Mobility 2020
Sensors for Robotic Mobility 2020
 
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...
 
Emerging Non-Volatile Memory 2020 report by Yole Développement
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementEmerging Non-Volatile Memory 2020 report by Yole Développement
Emerging Non-Volatile Memory 2020 report by Yole Développement
 
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...
 

Recently uploaded

Apidays New York 2024 - Accelerating FinTech Innovation by Vasa Krishnan, Fin...
Apidays New York 2024 - Accelerating FinTech Innovation by Vasa Krishnan, Fin...Apidays New York 2024 - Accelerating FinTech Innovation by Vasa Krishnan, Fin...
Apidays New York 2024 - Accelerating FinTech Innovation by Vasa Krishnan, Fin...apidays
 
Cloud Frontiers: A Deep Dive into Serverless Spatial Data and FME
Cloud Frontiers:  A Deep Dive into Serverless Spatial Data and FMECloud Frontiers:  A Deep Dive into Serverless Spatial Data and FME
Cloud Frontiers: A Deep Dive into Serverless Spatial Data and FMESafe Software
 
CNIC Information System with Pakdata Cf In Pakistan
CNIC Information System with Pakdata Cf In PakistanCNIC Information System with Pakdata Cf In Pakistan
CNIC Information System with Pakdata Cf In Pakistandanishmna97
 
Emergent Methods: Multi-lingual narrative tracking in the news - real-time ex...
Emergent Methods: Multi-lingual narrative tracking in the news - real-time ex...Emergent Methods: Multi-lingual narrative tracking in the news - real-time ex...
Emergent Methods: Multi-lingual narrative tracking in the news - real-time ex...Zilliz
 
AXA XL - Insurer Innovation Award Americas 2024
AXA XL - Insurer Innovation Award Americas 2024AXA XL - Insurer Innovation Award Americas 2024
AXA XL - Insurer Innovation Award Americas 2024The Digital Insurer
 
Connector Corner: Accelerate revenue generation using UiPath API-centric busi...
Connector Corner: Accelerate revenue generation using UiPath API-centric busi...Connector Corner: Accelerate revenue generation using UiPath API-centric busi...
Connector Corner: Accelerate revenue generation using UiPath API-centric busi...DianaGray10
 
Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...
Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...
Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...Orbitshub
 
ICT role in 21st century education and its challenges
ICT role in 21st century education and its challengesICT role in 21st century education and its challenges
ICT role in 21st century education and its challengesrafiqahmad00786416
 
AWS Community Day CPH - Three problems of Terraform
AWS Community Day CPH - Three problems of TerraformAWS Community Day CPH - Three problems of Terraform
AWS Community Day CPH - Three problems of TerraformAndrey Devyatkin
 
EMPOWERMENT TECHNOLOGY GRADE 11 QUARTER 2 REVIEWER
EMPOWERMENT TECHNOLOGY GRADE 11 QUARTER 2 REVIEWEREMPOWERMENT TECHNOLOGY GRADE 11 QUARTER 2 REVIEWER
EMPOWERMENT TECHNOLOGY GRADE 11 QUARTER 2 REVIEWERMadyBayot
 
FWD Group - Insurer Innovation Award 2024
FWD Group - Insurer Innovation Award 2024FWD Group - Insurer Innovation Award 2024
FWD Group - Insurer Innovation Award 2024The Digital Insurer
 
Cyberprint. Dark Pink Apt Group [EN].pdf
Cyberprint. Dark Pink Apt Group [EN].pdfCyberprint. Dark Pink Apt Group [EN].pdf
Cyberprint. Dark Pink Apt Group [EN].pdfOverkill Security
 
Corporate and higher education May webinar.pptx
Corporate and higher education May webinar.pptxCorporate and higher education May webinar.pptx
Corporate and higher education May webinar.pptxRustici Software
 
Apidays New York 2024 - The value of a flexible API Management solution for O...
Apidays New York 2024 - The value of a flexible API Management solution for O...Apidays New York 2024 - The value of a flexible API Management solution for O...
Apidays New York 2024 - The value of a flexible API Management solution for O...apidays
 
[BuildWithAI] Introduction to Gemini.pdf
[BuildWithAI] Introduction to Gemini.pdf[BuildWithAI] Introduction to Gemini.pdf
[BuildWithAI] Introduction to Gemini.pdfSandro Moreira
 
Artificial Intelligence Chap.5 : Uncertainty
Artificial Intelligence Chap.5 : UncertaintyArtificial Intelligence Chap.5 : Uncertainty
Artificial Intelligence Chap.5 : UncertaintyKhushali Kathiriya
 
presentation ICT roal in 21st century education
presentation ICT roal in 21st century educationpresentation ICT roal in 21st century education
presentation ICT roal in 21st century educationjfdjdjcjdnsjd
 
Repurposing LNG terminals for Hydrogen Ammonia: Feasibility and Cost Saving
Repurposing LNG terminals for Hydrogen Ammonia: Feasibility and Cost SavingRepurposing LNG terminals for Hydrogen Ammonia: Feasibility and Cost Saving
Repurposing LNG terminals for Hydrogen Ammonia: Feasibility and Cost SavingEdi Saputra
 
Biography Of Angeliki Cooney | Senior Vice President Life Sciences | Albany, ...
Biography Of Angeliki Cooney | Senior Vice President Life Sciences | Albany, ...Biography Of Angeliki Cooney | Senior Vice President Life Sciences | Albany, ...
Biography Of Angeliki Cooney | Senior Vice President Life Sciences | Albany, ...Angeliki Cooney
 
Polkadot JAM Slides - Token2049 - By Dr. Gavin Wood
Polkadot JAM Slides - Token2049 - By Dr. Gavin WoodPolkadot JAM Slides - Token2049 - By Dr. Gavin Wood
Polkadot JAM Slides - Token2049 - By Dr. Gavin WoodJuan lago vázquez
 

Recently uploaded (20)

Apidays New York 2024 - Accelerating FinTech Innovation by Vasa Krishnan, Fin...
Apidays New York 2024 - Accelerating FinTech Innovation by Vasa Krishnan, Fin...Apidays New York 2024 - Accelerating FinTech Innovation by Vasa Krishnan, Fin...
Apidays New York 2024 - Accelerating FinTech Innovation by Vasa Krishnan, Fin...
 
Cloud Frontiers: A Deep Dive into Serverless Spatial Data and FME
Cloud Frontiers:  A Deep Dive into Serverless Spatial Data and FMECloud Frontiers:  A Deep Dive into Serverless Spatial Data and FME
Cloud Frontiers: A Deep Dive into Serverless Spatial Data and FME
 
CNIC Information System with Pakdata Cf In Pakistan
CNIC Information System with Pakdata Cf In PakistanCNIC Information System with Pakdata Cf In Pakistan
CNIC Information System with Pakdata Cf In Pakistan
 
Emergent Methods: Multi-lingual narrative tracking in the news - real-time ex...
Emergent Methods: Multi-lingual narrative tracking in the news - real-time ex...Emergent Methods: Multi-lingual narrative tracking in the news - real-time ex...
Emergent Methods: Multi-lingual narrative tracking in the news - real-time ex...
 
AXA XL - Insurer Innovation Award Americas 2024
AXA XL - Insurer Innovation Award Americas 2024AXA XL - Insurer Innovation Award Americas 2024
AXA XL - Insurer Innovation Award Americas 2024
 
Connector Corner: Accelerate revenue generation using UiPath API-centric busi...
Connector Corner: Accelerate revenue generation using UiPath API-centric busi...Connector Corner: Accelerate revenue generation using UiPath API-centric busi...
Connector Corner: Accelerate revenue generation using UiPath API-centric busi...
 
Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...
Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...
Navigating the Deluge_ Dubai Floods and the Resilience of Dubai International...
 
ICT role in 21st century education and its challenges
ICT role in 21st century education and its challengesICT role in 21st century education and its challenges
ICT role in 21st century education and its challenges
 
AWS Community Day CPH - Three problems of Terraform
AWS Community Day CPH - Three problems of TerraformAWS Community Day CPH - Three problems of Terraform
AWS Community Day CPH - Three problems of Terraform
 
EMPOWERMENT TECHNOLOGY GRADE 11 QUARTER 2 REVIEWER
EMPOWERMENT TECHNOLOGY GRADE 11 QUARTER 2 REVIEWEREMPOWERMENT TECHNOLOGY GRADE 11 QUARTER 2 REVIEWER
EMPOWERMENT TECHNOLOGY GRADE 11 QUARTER 2 REVIEWER
 
FWD Group - Insurer Innovation Award 2024
FWD Group - Insurer Innovation Award 2024FWD Group - Insurer Innovation Award 2024
FWD Group - Insurer Innovation Award 2024
 
Cyberprint. Dark Pink Apt Group [EN].pdf
Cyberprint. Dark Pink Apt Group [EN].pdfCyberprint. Dark Pink Apt Group [EN].pdf
Cyberprint. Dark Pink Apt Group [EN].pdf
 
Corporate and higher education May webinar.pptx
Corporate and higher education May webinar.pptxCorporate and higher education May webinar.pptx
Corporate and higher education May webinar.pptx
 
Apidays New York 2024 - The value of a flexible API Management solution for O...
Apidays New York 2024 - The value of a flexible API Management solution for O...Apidays New York 2024 - The value of a flexible API Management solution for O...
Apidays New York 2024 - The value of a flexible API Management solution for O...
 
[BuildWithAI] Introduction to Gemini.pdf
[BuildWithAI] Introduction to Gemini.pdf[BuildWithAI] Introduction to Gemini.pdf
[BuildWithAI] Introduction to Gemini.pdf
 
Artificial Intelligence Chap.5 : Uncertainty
Artificial Intelligence Chap.5 : UncertaintyArtificial Intelligence Chap.5 : Uncertainty
Artificial Intelligence Chap.5 : Uncertainty
 
presentation ICT roal in 21st century education
presentation ICT roal in 21st century educationpresentation ICT roal in 21st century education
presentation ICT roal in 21st century education
 
Repurposing LNG terminals for Hydrogen Ammonia: Feasibility and Cost Saving
Repurposing LNG terminals for Hydrogen Ammonia: Feasibility and Cost SavingRepurposing LNG terminals for Hydrogen Ammonia: Feasibility and Cost Saving
Repurposing LNG terminals for Hydrogen Ammonia: Feasibility and Cost Saving
 
Biography Of Angeliki Cooney | Senior Vice President Life Sciences | Albany, ...
Biography Of Angeliki Cooney | Senior Vice President Life Sciences | Albany, ...Biography Of Angeliki Cooney | Senior Vice President Life Sciences | Albany, ...
Biography Of Angeliki Cooney | Senior Vice President Life Sciences | Albany, ...
 
Polkadot JAM Slides - Token2049 - By Dr. Gavin Wood
Polkadot JAM Slides - Token2049 - By Dr. Gavin WoodPolkadot JAM Slides - Token2049 - By Dr. Gavin Wood
Polkadot JAM Slides - Token2049 - By Dr. Gavin Wood
 

Nokia Lumia 920 - Camera Module with OIS teardown Report by published Yole Developpement

  • 1. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 1 21 rue La Nouë Bras de Fer - 44200 Nantes - France Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr May 2013 - Version 1 Written by: Romain FRAUX DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.
  • 2. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 2 Table of Contents Glossary 1. Overview / Introduction……….……….…........…2 – Executive Summary – What's Surprising in this Device? – Reverse Costing Methodology 2. CMOS Image Sensor Market………….……....….7 – CIS Revenue – 2011 Market Share – Sony Production Capacity and wafer fabs 3. Nokia Lumia 920 Teardown.………….…….......10 4. Physical Analysis………………………..............14 – Synthesis of the Physical Analysis – Physical Analysis Methodology – Camera Module with flex – Camera Module Views & Dimensions – Camera Module X-Ray – Camera Module Disassembly – CIS Views & Dimensions – CIS Resolutions – CIS Pads – CIS without Microlenses – CIS Pixels – CIS Technology node – CIS Memory – Camera Module Cross-sections  Housings  PCB  Lenses  Autofocus actuator/OIS  IR FIlter – CIS Cross-sections 5. Manufacturing Process Flow……………….….71 – Global Overview – CIS Process Flow – BSI Detailed Process Flow – Description of the CIS Wafer Fabrication Unit 6. Cost Analysis…………….………….………..…..77 – Synthesis of the Cost Analysis – Main Steps of Economic Analysis – Supply Chain – Yields Explanation – Yields Hypotheses – CIS Front-End : Hypotheses – CIS FEOL + BEOL Cost – CSI BSI Cost – CIS BSI Cost per Process Steps – CIS BSI : Equipment Cost per Family – CIS BSI : Material Cost per Family – CIS Front-End Cost – CIS Back-End 0 : Test & Dicing – CIS Wafer Cost (Front-End + Back-End 0) – CIS Die Cost & Price – Camera Module Assembly - Hypotheses – Lens Module Cost – Autofocus Actuator / OIS Cost – Main ICs and IR Filter Cost – Final Assembly Cost – Camera Module Cost
  • 3. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 3 Executive Summary • This full reverse costing study has been conducted to provide insight on technology data and manufacturing cost of the Nokia Lumia 920 camera module. • It is the first smartphone's camera module integrating an autofocus actuator with optical image stabilization (OIS). • The camera module is equipped with a 5-elements "floating lens" module which moves in synchronization with the camera movement. • The camera module integrates a 8.7 megapixel CMOS Image Sensor (CIS) from Sony. The CIS features a 1.4µm pixel size and uses a Back-Side Illuminated (BSI) technology. • The camera module is provided in a 12.5mm x 12.5mm x 6.00mm package. • We estimate that Nokia is the prime contractor.
  • 4. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 4 What's Surprising in this Device? • The gyroscope integrating in the camera module is used to measure the camera movement (on two axes, pitch and yaw), but also handles user-motion recognition (on three axes, roll/pitch/yaw), allowing cost and board space savings of the phone. This two-in-one feature is possible due to the integration of a dual-core 3-axis MEMS gyroscope supplied by STMicroelectronics. • Compared to other smartphones which use "off-the-shelf" CMOS Image Sensors for resolutions of 8 megapixel and beyond, the camera module of the Nokia Lumia 920 employs a custom oversized 8.7 megapixel CIS able to provide true 16:9 and 4:3 formatted aspect ratios. • Most of Nokia previous camera modules used STMicroelectronics and Toshiba as CIS suppliers (ST for low-end modules and Toshiba for high-end modules). This time, Nokia choose Sony for the CIS of the Lumia 920.
  • 5. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 5 Nokia Lumia 920 Teardown
  • 6. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 6 Camera Module Views & Dimensions
  • 7. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 7 Camera Module Disassembly
  • 8. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 8 CIS View & Dimensions
  • 9. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 9 CIS Pads
  • 10. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 10 Camera Module Cross-Section 2
  • 11. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 11 CIS Cross-Section
  • 12. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 12 CIS Process Flow
  • 13. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 13 CIS Wafer Cost (Front-End + Back-End 0)
  • 14. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 14 Lens Module Cost
  • 15. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 15 Autofocus Actuator / OIS Cost
  • 16. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 16 Final Assembly Cost
  • 17. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. Nokia Lumia 920 – Camera Module with OIS 17 Camera Module Cost