2. Technology Roadmap
Parameters Standard Advanced R&D Comments
IL line and space 0.5 oz. copper 4/4 2/2.5 2/2
OL line and space 0.25 oz. copper 4/4 2.5/3 2/2.5
OL line and space 0.5 oz. base copper 5/5 4/4 3/3
Smallest drilled thru via - .062” brd. thickness .010” .006” .004”
Smallest drilled thru via - .093” brd. thickness .010” .008” .006”
Smallest drilled thru via - .115” brd. thickness .012 .010” .010”
Smallest drilled thru via - .250” brd. thickness .020” .016” .014”
.001” annular ring – Class 2 .010” .008” See Eng.
.002” annular ring – Class 3 .012” .010” See Eng.
Antipad over drill size .024” .016” .012”
Microvia laser drill size .006” .004” .003”
Pad over microvia drill size .006” .005” .004”
Maximum layers of microvia per side 2 3 See Eng.
Multi depth microvias Yes Yes Yes
Maximum aspect ratio – w/ .010” drilled hole 12:1 18:1 24:1
Not recommended to
Maximum aspect ratio - microvias 0.8:1 0.8:1 See Eng. go higher than1:1
MEI is proud to announce our submittal to PCQR² and listings as CAT Code “G16”, “F27”, “H34”, “I20”, “I45”, “J20” (Aug “09)
3. Technology Roadmap
Parameters Standard Advanced R&D Comments
Press fit hole tolerance +/- .002” +/- .002” +/- .002”
SMD soldermask web width - mils .004” .0035” .003
SMD soldermask clearance – mils (over pad) .005” .004” See Eng.
Soldermask registration tolerance .003” .002” See Eng.
Impedance control – single ended +/- % +/- 7% +/- 5% See Eng.
Impedance control – edge coupled diff. +/- % +/- 10% +/- 7% See Eng.
Impedance control – broad side differential +/-
+/ 10% +/- 7% See Eng.
%
Board thickness – Min./Max. .020” / .240” .016” / .300” .010” / .300”
Layer count is only
Maximum layer count 28 50 50+ limited by total
thickness
Average layer count 16
Maximum panel size 18”X 24” 20”X 26” See Eng.
Maximum bow and twist - %
<1% <0.75% <0.75%
(balanced construction)
Minimum copper to edge clearance .015” .012” .010”
Min. positional tol. – feature to feature +/- .005” +/- .003” +/- .003”
Layer to layer registration tolerance +/- .005” +/- .004 +/- .004”
Minimum core thickness .002” .002” .001”
4. Technology Roadmap
Parameters Standard Advanced R&D Comments
Surface finishes offered
Immersion Silver In House
ENIG (Electroless NI / Immersion Au) In House
ENEPIG (Electroless Nickel / Electroless
Outside
Palladium / Immersion Gold
OSP – Entek Plus HT In House
HASL (Tin / Lead) In House
Full body & Selective Electrolytic Ni / Au In House
Gold edge connector In House
Immersion Tin Outside
Other Capabilities
Sequential lamination 3 Sublams 5 Sublams See Eng.
Various
Stacked/Staggered Vias Yes Yes
materials
Copper Filled Vias Yes
MEI recommends Non
Epoxy filled vias Yes Conductive
Embedded Capacitance Yes ZBC200 & HK 04
Mixed dielectric construction Yes
Back-Drilling Tolerances +/- .015 .010 See Eng
5. Technology Roadmap
Parameters Standard Advanced R&D Comments
Other Capabilities
Pigmented Soldermask
Yes
(Red, Blue, Black, Purple, Clear)
Photo Imageable Legend Yes
Jump Scoring Yes
Edge Milling Yes
Counter Bores / Slot Milling Yes
Edge Plating Yes
Heat Sink Laminations Yes Yes Yes
Industry Certifications
UL 94V-0 Yes
ISO 9001:2000 Yes
IPC-6012 Class II & III Yes
IPC-9151 / PCQR² Benchmark Data CAT CODE F27, G16, H34, I20, I45, J20
ITAR Certified Yes Cert # M20467
JCP Certified Yes Cert # 47424
RoHS Compliant Yes
Telcordia Compliant Yes
8. Material Specifications
CTE (X-Y, CTE (Z axis,
ppm/℃) Post ppm/ºC) Post IPC 4101 Slash
Supplier Type Tg(℃) Td(ºC) Dk Df Tg Tg Lead Time Construction Sheet
Halogen-Free FR4
Nan Ya NPG-170TL 170 4.3-4.5 @ 1 MHz, 0.014-0.016 @ 1 MHz, 9-13 200-230 4 weeks Halogen, antimony and
3.9-4.1 @ 1 GHz 0.012-0.014 @ 1 GHz (avg) red phosphorous free
Hitachi MCL-E-679 FG( R ) 175 5.2-5.4 @ 1 MHz 0.008-0.010 @ 1 MHz 13-15 140-170 4 weeks Halogen, antimony and
(avg) red phosphorous free
CTE (X-Y, CTE (Z axis,
ppm/℃) Post ppm/ºC) Post T260 Deg T288 Deg IPC 4101B
Supplier Type Tg(℃) Td(ºC) Dk Df Tg Tg C (TMA) C (TMA) Construction Slash Sheet
Miscellaneous:
Isola FR406BC 170 300 3.51 @ 1 GHz 0.02 @ 1 GHz 14 140 10 min. >2 min. "Buried Capacitance" /24
3.48 @ 2 GHz 0.021 @ 2 GHz 2 mil dielectric
3.44 @ 5-10 GHZ 0.022 @ 5-10 GHz
Nelco N4000-x BC "Buried Capacitance" /24, /26
Each of the Nelco N4000
"Type" offers a 2 mil
dielectric. Material
properties are similar to
that "Type".
Dupont Interra HK 04 3.5 @ 1 MHz 0.003 @ 1 MHz 25 (Pre Tg) Embedded Capacitance.
Polyimide dielectric.
Dielectric thickness: 25
µm. Copper Thickness:
18 µm, 36 µm, 72 µm.
Ticer Technologies TCR Thin Film Resistor Foil "Embedded Resistors" - NiCr resistive material. Available in 0.5 oz. and 1 oz. copper tickness. Sheet resistance: 25, 50, 100 Ω/sq., Sheet resistivity tolerance ± 5%. Can be matched to most resin
systems listed above.
Notes: SPC = Split Post Cavity
Information listed is from manufacturer’s Data Sheet. Please contact laminate supplier directly to discuss your particular application.
Isola: http://www.isola-group.com
Nelco: http://www.parkelectro.com
Rogers: http://www.rogerscorp.com
DuPont: http://www2.dupont.com/Interra
Panasonic: http://panasonic-denko.cp.jp/em/pcbm/en/product
Ticer: http://www.ticertechnologies.com
9. File Transfer Instructions
Preferred data formats: Gerber (274 or 274X) or Valor ODB++, drill files should be in ASCII format, fabrication drawings as
Gerber, HPGL, HPGL2 or AutoCAD DXF / DWG files. An IPC D-356 netlist is highly recommended for crosscheck against
Gerber files and for electrical testing.
Data files and drawings should be compressed together into either ZIP (WinZip) or TGZ (UNIX) files to reduce file size
and speed up the file transfer process Alternative data types or compression schemes may be acceptable by agreement.
EMAIL
Attach your files to an email and send to data@mei4pcbs.com . Attached flies should be no larger than 15 MB (15,000 KB)
although we have the capacity to accept up to 50 MB files. Please keep in mind that your own email server may be a limiting
factor in your ability to send large file attachments.
FTP
Using FTP client software (such as WS-FTP) you can send files via FTP with no file size limits.
FTP hostname: ftp.mei4pcbs.com IP address is 65.170.125.60
username: mei/marcel <------all lower case exactly as shown, using forward slash ( / )
password: mei4qta <-------all lower case exactly as shown
Upload your files to INCOMING directory (directory name is not case sensitive). Also, be sure to use PASSIVE mode
for compatibility with our firewall. If using WS-FTP this setting is found on the “Properties” page under “Advanced” tab.
Please contact our Customer Service Department by phone (714) 974-8590 if you prefer to have your own FTP username,
password and directory or if you experience any problems with the transfer..
