With NAND flash facing scaling challenges, 3D memory stacks are being explored as possible candidates to replace NAND flash. This report compares the technology, challenges and cost of various 3D memory options including stacked charge trapping technologies from Samsung and Toshiba, 3D memory from SanDisk, Samsung and others.
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How 3D Memory Stacks Up
Published on March 2009
Report Summary
With NAND flash facing scaling challenges, 3D memory stacks are being explored as possible candidates to replace NAND flash.
This report compares the technology, challenges and cost of various 3D memory options including stacked charge trapping
technologies from Samsung and Toshiba, 3D memory from SanDisk, Samsung and others.
Table of Content
Table of Contents
Executive Summary
Introductio
NAND Flash Memory
NAND Flash Memory Technology
Scaling Challenges
3D Memory Alternatives
Samsung Stacked TANOS
Concept
Advantages and Disadvantages
Challenges
Toshiba Bit-Cost Scalable NAND
Concept
Advantages and Disadvantag
Challenges
Cross-point Memory ArraysConcept
Storage Element
Comparison of 3D Memory Concepts
Key Parameters of stacked NAND
Process Complexity
Performance
Endurance
Power Consumption
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Scalability
Cost
Key Parameters of vertical NAND (BiCS)
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How 3D Memory Stacks Up
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