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Materials Science and Engineering B93 (2002) 159 Á/162
                                                                                                               www.elsevier.com/locate/mseb




AlGaN ultraviolet photodetectors grown by molecular beam epitaxy
                      on Si(111) substrates
               J.L. Pau *, E. Monroy, M.A. Sanchez-Garcıa, E. Calleja, E. Munoz
                                            ´          ´                    ˜
 Departamento de Ingenierıa Electronica, ETSI Telecomunicacion, Universidad Politecnica de Madrid, Ciudad Universitaria 28040 Madrid, Spain
                         ´        ´                         ´                    ´




Abstract

   The performance of AlGaN metal Á/semiconductor Á/metal (MSM) photodetectors grown on Si(111) is presented in this article. It is
shown that the growth of an adequate AlN buffer layer is critical to achieve visible-blind devices, and that its role as an effective
electrical insulator of the conductive substrate was found to be more efficient for N-excess AlN growth. The increase of Al content
produced a transition from photoconductor to MSM photodiode behaviour, as determined from the detector responsivity, temporal
response, and UV/visible contrast. The effect of the contact metal on photoconductive gain and UV/visible contrast was also
studied. # 2002 Elsevier Science B.V. All rights reserved.

Keywords: Metal Á/semiconductor Á/metal; III-Nitrides; UV photodetectors; Molecular beam epitaxy




   Research and development of GaN-based materials                          usually been fabricated on sapphire substrates and
have been an important focus of attention during the                        grown by metalÁ/organic chemical vapour deposition
last decade, which has led to industrial devices such as                    (MOCVD) [1,2].
light-emitting diodes, laser diodes, UV photodetectors,                        Due to their simplicity and the unnecessary p-type
and heterojunction transistors. The possibility of tuning                   doping, metal Á/semiconductor Á/metal (MSM) structures
the semiconductor bandgap from 1.9 eV for InN and 3.4                       and photoconductors are very attractive devices for
eV for GaN, to 6.2 eV for AlN, makes these alloys very                      short wavelength photodetection. In GaN photocon-
attractive for a number of applications, such as flame                      ductors (ohmicÁ/metal Á/ohmic), responsivities as high as
sensing, missile warning, UV biological effects, UV                         1000 A W(1 have been reported, but they showed very
astronomy, water purification, pollution monitoring,                        long time decays, which reduces the detectivity drasti-
high-density optical storage, engine and nuclear reactor                    cally [3]. In contrast, ideal MSM (or back-to-back
monitoring, and space-to-space communication. The                           Schottky) photodiodes are devices specially adequate
lack of lattice-matched substrates has forced the use of                    for high-speed applications, and their maximum respon-
foreign substrates for III-nitride growth. Following the                    sivity is limited by an external quantum efficiency of
development of arsenides, Si(111) was one of the first                      100% (292 mA W(1 for GaN and 161 mA W(1 for
                                                                            AlN). The frontier between MSM photodiodes and
substrates used due to the availability of high-quality,
                                                                            photoconductors is still unclear, since many of the
large-area and low-cost wafers. However, its high
                                                                            devices presented in the literature as MSM photodiodes
lattice- and thermal-mismatch with III-nitrides and the
                                                                            show an obvious photoconductive gain contribution. If
high diffusion-coefficient of Si at growth temperatures
                                                                            these intermediate or hybrid devices are characterised
have delayed the progress in the fabrication of efficient
                                                                            under constant illumination (DC), persistent effects
optoelectronic devices on this substrate. The use of
                                                                            become evident.
proper buffer layers, which attenuate these inconve-                           In this work, we present the fabrication of AlGaN
niences, is required. Thus, AlGaN photodetectors have                       MSM photodetectors on Si(111) substrates. The optimal
                                                                            growth conditions of the buffer layer for the fabrication
  * Corresponding author. Tel.: '34-91-549-5700x420; fax: '34-91-
                                                                            of these photodetectors will be analysed. The hybrid
336-7323.                                                                   behaviour of these photodevices will be studied for
  E-mail address: jlpau@die.upm.es (J.L. Pau).                              different Al contents and different contact metals.
0921-5107/02/$ - see front matter # 2002 Elsevier Science B.V. All rights reserved.
PII: S 0 9 2 1 - 5 1 0 7 ( 0 2 ) 0 0 0 5 1 - X
160                                  J.L. Pau et al. / Materials Science and Engineering B93 (2002) 159 Á/162


   The structures were grown in a MECA 2000 mole-
cular beam epitaxy system. Active nitrogen was pro-
duced by an Oxford HD25 radio-frequency plasma
source. After degassing the silicon substrate at 820 8C,
a few monolayers of Al were deposited at 800 8C,
followed by the growth of an AlN buffer layer. The role
of this layer is not only to improve the crystalline quality
of the latter AlGaN layer, but also to electrically
insulate the epitaxial film from the conductive substrate.
Growth rate and layer thickness were measured by in
situ optical interferometry using an IRCON infrared
pyrometer with a narrow-band filter centred at 0.94 mm.
The resolution of this technique is 95 nm, even for the
thinnest layers.
   Four types of AlN buffer layers were grown, by
changing the III Á/V ratio and the thickness of the layer.
The resulting effectiveness in avoiding the parallel                        Fig. 1. Nomarski views of samples (a) M564 and (b) M573, and SEM
conduction through the substrate is thus assessed for                       photographs of samples (c) M563 and (d) M590 are shown.
each type of buffer. Growth conditions are shown in
Table 1.                                                                    by 200 mm were measured. The leakage currents at 10 V
   The end of the sample M590 growth corresponds to a                       bias are also shown in Table 1. The high conductivity
change from two-dimensional to three-dimensional                            found for AlN layers grown under Al-rich conditions
growth mode (Stranski Á/Krastanov mode), as described                       could be due to leakage currents associated to threading
later. This transition is clearly identified by the appear-                 dislocations, as suggested by Hsu et al. for MBE-GaN
ance of a 2 ) 2 reconstruction in the RHEED monitor-                        samples grown under Ga-rich conditions [5]. Consider-
ing and corresponds to a thickness of 30 Á/40 nm, with                      ing both the insulating characteristics and the surface
high reproducibility [4].                                                   morphology, we decided to use the buffer structure
   Samples M564 and M573 showed surface features                            corresponding to sample M590.
related to Al-excess during the growth (Fig. 1a,b). In                         Undoped AlGaN layers with a thickness of 1 Á/2 mm
sample M564, which was grown under the highest III Á/V                      and Al mole fractions up to x 00.39 were deposited on
ratio, little droplets of 2 mm in average were observed,                    the AlN buffer layer. The growth temperature was in the
together with larger stains of about 10 mm diameter.                        730 Á/760 8C range, depending on the nominal Al
Sample M573 showed very small stains, with diameters                        composition. Two-dimensional growth was observed
lower than 2 mm, indicating that the III Á/V relative ratio                 by RHEED after 5 min in all the samples under study.
was very close to the stoichiometry point (IIIÁ/V Â 1), as                  Due to the lower deposition temperatures in comparison
indicated in Table 1. As seen in Fig. 1c for sample M563,                   to MOCVD, layer-cracking problems were not observed
surface roughness starts to degrade after the transition                    in any sample. For GaN, a residual n-type doping of
to the three-dimensional mode, the scenario becoming                        around 1) 1017 cm (3 is determined from C Á/V mea-
harsh for the subsequent growth of AlGaN. However,                          surements, whereas for AlGaN, the 1/C 2 dependence
under the same growth conditions, if we stop when the                       versus reverse voltage becomes non-linear. X-ray dif-
2 )2 reconstruction appears, a very smooth surface                          fraction (XRD) patterns were obtained from u /2u scans
results, as shown in sample M590 (Fig. 1d). No                              with a wide open detector, showing full-width at half
remnants of metal were detected in the surface of both                      maximum (FWHM) values of 8.5 and 15 arcmin for
samples. To compare the electrical insulation provided                      GaN and AlGaN (x 0 0.30) layers, respectively.
by the above AlN layers, the current Á/voltage character-                      Detectors consist of two interdigitated electrodes on a
istics between 400 mm diameter Ti/Al contacts separated                     planar structure, with finger widths and gap spacings of
                                                                            2, 4, and 7 mm, and active areas of 250 )250 mm2 and
Table 1                                                                     500 ) 500 mm2. Two different metal systems were used
AlN buffer layer characteristics                                                                  ˚           ˚               ˚
                                                                            for contacts: Ti (300 A)/Al (700 A) and Pt (400 A)/Ti (50
                                                                             ˚              ˚
                                                                            A)/Au (1000 A), corresponding to extreme values of
                            Sample
                                                                            their metal workfunction. All current Á/voltage charac-
                            M564         M573      M563      M590           teristics for AlGaN photodiodes presented a rectifying
Thickness (nm)              200          200       200       35
                                                                            behaviour, with a higher resistivity as the Al content
III Á/V                     1.2            1         0.85     0.85          increased.
Ileakage (mA) at 10 V       1.4) 104     160         5.0     54                Spectral responsivity studies were performed by using
                                                                            a 150 W xenon arc lamp. The photodetector responsiv-
J.L. Pau et al. / Materials Science and Engineering B93 (2002) 159 Á/162                        161


ity was measured by excitation with a non-focused He Á/                different alloy compositions. Room temperature PL
Cd laser (325 nm) for GaN devices, whereas the 514 nm                  measurements showed two emissions whose positions
Ar ' laser line coupled into a second harmonic gen-                    coincided with the cut-off wavelength and the shoulder
erator (257 nm) was used for AlGaN photodiodes.                        observed in the spectral response (see inset Fig. 2). The
These measurements were performed under constant                       lower energy transition does not follow Varshni’s law
(DC) illumination. Time response characterisation was                  for bandgap energy dependence on temperature, which
made using the fourth frequency of a Nd Á/YAG laser                    seems to indicate that the transition corresponds to a
(266 nm), with 10 ns Gaussian pulses.                                  DA emission [8].
   Typical spectral responses of AlGaN MSM photo-                         Detector peak responsivity and dark current values
detectors with Ti/Al contacts are shown in Fig. 2. The                 can be found in Table 2. As seen, the responsivity
optical response above the bandgap drops more mark-                    decreases with increasing Al mole fractions. On the
edly as the Al content increases. The buffer layer                     other hand, the increase of the Al produces a reduction
efficiently insulates the AlGaN, preventing any contri-                of the observed photoconductive gain, and persistent
bution from the silicon substrate to the detector optical              effects (see photocurrent decays in Fig. 3). These data,
response. The cut-off wavelength reached 290 nm for                    together with the increase of the UV/visible contrast,
x 00.39, demonstrating the capability of these photo-                  indicate that the increase of aluminium in the ternary
detectors for solar-blind applications. Below the band-                alloy provokes a transition from photoconductive to
gap, we fitted the quantum efficiency (h ) by the                      MSM photodiode behaviour.
expression                                                                In AlGaN (x0 0.39) MSM photodiodes with Ti/Al
                                                                     contacts, the time constant, tp, value for different load
            hn
h 8exp                                                (1)              resistances was obtained from transient photoresponse
           Eurb                                                        measurements. The photocurrent decays were exponen-
where Eurb is the Urbach parameter, which varied from                  tial, with the time constant corresponding to the RC
24 meV for GaN to 90 meV for AlGaN (x 00.39) [6].                      product of the measuring system. The dependence of
This parameter measures the cut-off abruptness and is                  photocurrent response time on load resistance has been
related to the presence of levels inside the bandgap or to             analysed in Fig. 4, and the extrapolation to zero-load
alloy disorder. As indicated in Fig. 2, the spectral                   allows to obtain a minimum tp value of 150 ns.
response of AlGaN devices presents a shoulder below                       Finally, a comparative spectral response of MSM
the bandgap, which might be related to regions with                    photodiodes for the two metal systems used can be
different compositions in the ternary alloy or to                      observed in Fig. 5. The UV/visible contrast is around a
absorption in defects. The rotation of the layer during                factor 10 higher in the case of Pt/Ti/Au due to the lower
the growth and the different positions of the III-element              value of the dark current. The value of the dark current
sources could produce alloy inhomogeneities, as already                is dominated by the quality of the Schottky contacts. Pt
reported [7]. However, in our sample, from XRD                         contacts are known to produce barrier heights of 1.0 Á/
measurements, we have not seen any evidence of                         1.1 eV on GaN [9], whereas barriers of 0.1 Á/0.5 eV have
                                                                       been reported for Ti contacts [10]. The I Á/V character-
                                                                       istics of both samples under constant illumination are
                                                                       shown in the inset of Fig. 5. The increase of the
                                                                       photocurrent with the applied bias is more pronounced
                                                                       in samples with Ti/Al contacts, indicating a higher
                                                                       photoconductive gain contribution. In addition, the
                                                                       responsivities for Ti/Al contacts are a factor 100 super-
                                                                       ior to those of Pt/Ti/Au.
                                                                          We have reported the fabrication and characterisation
                                                                       of AlGaN MSM photodetectors grown on Si(111), with
                                                                       Al mole fractions up to 0.39. By using a proper AlN
                                                                       buffer, the photoresponse contribution from the con-
                                                                       ductive substrate is avoided. The photoconductive gain

                                                                       Table 2
                                                                       Responsivities and dark current of 3 V biased AlGaN MSM
                                                                       photodiodes

                                                                       %Al                                 2      15    39
Fig. 2. Spectral responses of MSM AlGaN photodiodes grown on           Rpeak (mA W(1)                      5400   58    12
Si(111). Inset: room temperature photoluminiscence of AlGaN            Id (nA) at 3 V                      4100   1.3   0.015
(x0 0.39).
162                                    J.L. Pau et al. / Materials Science and Engineering B93 (2002) 159 Á/162




                                                                              Fig. 5. Comparative spectral response for two different contact metals
                                                                              (Ti/Al and Pt/Ti/Au) at 5 V.

Fig. 3. Time decay measurements for MSM AlGaN photodiodes with                Acknowledgements
different Al contents (x 0 0, 0.15, and 0.39). Observe the different time
scales for GaN and AlGaN photodiodes.                                           Thanks are due to J. Sanchez Osorio and A. Fraile for
                                                                                                      ´
                                                                              their technical support and to Professor Jaque for his
                                                                              assistance in time response measurements. This work
                                                                              has been partially supported by Comunidad de Madrid,
                                                                              Project No. 07M/0008/1999 and PETRI No. 95-0466-
                                                                              OP.




                                                                              References

                                                                               [1] F. Omnes, N. Marenco, B. Beaumont, Ph. De Mierry, E. Monroy,
                                                                                           `
                                                                                   F. Calle, E. Munoz, J. Appl. Phys. 86 (1999) 1.
                                                                                                    ˜
                                                                               [2] J.C. Carrano, T. Li, D.L. Brown, P.A. Grudowski, C.J. Eiting,
                                                                                   R.D. Dupuis, J.C. Campbell, Appl. Phys. Lett. 73 (1998) 2405.
                                                                               [3] E. Monroy, F. Calle, E. Munoz, F. Omnes, Semicond. Sci.
                                                                                                                   ˜             `
                                                                                   Technol. 14 (1999) 685.
                                                                               [4] M.A. Sanchez-Garcıa, E. Calleja, E. Monroy, F.J. Sanchez, F.
                                                                                           ´           ´                                  ´
                                                                                   Calle, E. Munoz, A. Sanz-Hervas, C. Villar, M. Aguilar, Mater.
                                                                                                 ˜                 ´
                                                                                   Res. Soc. Internet J. Nitride Semicond. Res. 2 (1997) 33.
Fig. 4. Time response dependence of an AlGaN (x 0 0.39) photodiode             [5] J.W.P. Hsu, M.J. Manfra, D.V. Lang, S. Richter, S.N.G. Chu,
with load resistance.                                                              A.M. Sergent, R.N. Kleiman, L.N. Pfeiffer, Appl. Phys. Lett. 78
                                                                                   (2001) 1685.
                                                                               [6] J.I. Pankove, Optical Processes in Semiconductors, Dover, New
                                                                                   York, 1971, pp. 43 Á/46.
                                                                               [7] S. Fernandez, F.B. Naranjo, F. Calle, M.A. Sanchez-Garcıa, E.
                                                                                           ´                                       ´          ´
observed in these devices has been found to depend                                 Calleja, P. Vennegues, A. Trampert, K.H. Ploog, Appl. Phys.
strongly on the Al content. The effect of the contact                              Lett. 79 (2001) 2136.
                                                                               [8] F. Calle, F.J. Sanchez, J.M.G. Tijero, M.A. Sanchez-Garcıa, E.
                                                                                                   ´                               ´          ´
metal on the responsivity and UV/visible contrast has
                                                                                   Calleja, R. Beresford, Semicond. Sci. Technol. 12 (1997) 1396.
also been evaluated. The recombination time for the                            [9] Q.Z. Liu, S.S. Lau, Solid-State Electron. 42 (1998) 677.
photodetectors with the highest Al content (x 00.39)                          [10] S.N. Mohammad, Z.F. Fan, W. Kim, O. Atkas, A.E. Botchkarev,
has been extrapolated to 150 ns for zero-load resistance.                          A. Salvador, H. Morkoc, Electron. Lett. 32 (1996) 598.

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AlGaN UV photodetectors on Si

  • 1. Materials Science and Engineering B93 (2002) 159 Á/162 www.elsevier.com/locate/mseb AlGaN ultraviolet photodetectors grown by molecular beam epitaxy on Si(111) substrates J.L. Pau *, E. Monroy, M.A. Sanchez-Garcıa, E. Calleja, E. Munoz ´ ´ ˜ Departamento de Ingenierıa Electronica, ETSI Telecomunicacion, Universidad Politecnica de Madrid, Ciudad Universitaria 28040 Madrid, Spain ´ ´ ´ ´ Abstract The performance of AlGaN metal Á/semiconductor Á/metal (MSM) photodetectors grown on Si(111) is presented in this article. It is shown that the growth of an adequate AlN buffer layer is critical to achieve visible-blind devices, and that its role as an effective electrical insulator of the conductive substrate was found to be more efficient for N-excess AlN growth. The increase of Al content produced a transition from photoconductor to MSM photodiode behaviour, as determined from the detector responsivity, temporal response, and UV/visible contrast. The effect of the contact metal on photoconductive gain and UV/visible contrast was also studied. # 2002 Elsevier Science B.V. All rights reserved. Keywords: Metal Á/semiconductor Á/metal; III-Nitrides; UV photodetectors; Molecular beam epitaxy Research and development of GaN-based materials usually been fabricated on sapphire substrates and have been an important focus of attention during the grown by metalÁ/organic chemical vapour deposition last decade, which has led to industrial devices such as (MOCVD) [1,2]. light-emitting diodes, laser diodes, UV photodetectors, Due to their simplicity and the unnecessary p-type and heterojunction transistors. The possibility of tuning doping, metal Á/semiconductor Á/metal (MSM) structures the semiconductor bandgap from 1.9 eV for InN and 3.4 and photoconductors are very attractive devices for eV for GaN, to 6.2 eV for AlN, makes these alloys very short wavelength photodetection. In GaN photocon- attractive for a number of applications, such as flame ductors (ohmicÁ/metal Á/ohmic), responsivities as high as sensing, missile warning, UV biological effects, UV 1000 A W(1 have been reported, but they showed very astronomy, water purification, pollution monitoring, long time decays, which reduces the detectivity drasti- high-density optical storage, engine and nuclear reactor cally [3]. In contrast, ideal MSM (or back-to-back monitoring, and space-to-space communication. The Schottky) photodiodes are devices specially adequate lack of lattice-matched substrates has forced the use of for high-speed applications, and their maximum respon- foreign substrates for III-nitride growth. Following the sivity is limited by an external quantum efficiency of development of arsenides, Si(111) was one of the first 100% (292 mA W(1 for GaN and 161 mA W(1 for AlN). The frontier between MSM photodiodes and substrates used due to the availability of high-quality, photoconductors is still unclear, since many of the large-area and low-cost wafers. However, its high devices presented in the literature as MSM photodiodes lattice- and thermal-mismatch with III-nitrides and the show an obvious photoconductive gain contribution. If high diffusion-coefficient of Si at growth temperatures these intermediate or hybrid devices are characterised have delayed the progress in the fabrication of efficient under constant illumination (DC), persistent effects optoelectronic devices on this substrate. The use of become evident. proper buffer layers, which attenuate these inconve- In this work, we present the fabrication of AlGaN niences, is required. Thus, AlGaN photodetectors have MSM photodetectors on Si(111) substrates. The optimal growth conditions of the buffer layer for the fabrication * Corresponding author. Tel.: '34-91-549-5700x420; fax: '34-91- of these photodetectors will be analysed. The hybrid 336-7323. behaviour of these photodevices will be studied for E-mail address: jlpau@die.upm.es (J.L. Pau). different Al contents and different contact metals. 0921-5107/02/$ - see front matter # 2002 Elsevier Science B.V. All rights reserved. PII: S 0 9 2 1 - 5 1 0 7 ( 0 2 ) 0 0 0 5 1 - X
  • 2. 160 J.L. Pau et al. / Materials Science and Engineering B93 (2002) 159 Á/162 The structures were grown in a MECA 2000 mole- cular beam epitaxy system. Active nitrogen was pro- duced by an Oxford HD25 radio-frequency plasma source. After degassing the silicon substrate at 820 8C, a few monolayers of Al were deposited at 800 8C, followed by the growth of an AlN buffer layer. The role of this layer is not only to improve the crystalline quality of the latter AlGaN layer, but also to electrically insulate the epitaxial film from the conductive substrate. Growth rate and layer thickness were measured by in situ optical interferometry using an IRCON infrared pyrometer with a narrow-band filter centred at 0.94 mm. The resolution of this technique is 95 nm, even for the thinnest layers. Four types of AlN buffer layers were grown, by changing the III Á/V ratio and the thickness of the layer. The resulting effectiveness in avoiding the parallel Fig. 1. Nomarski views of samples (a) M564 and (b) M573, and SEM conduction through the substrate is thus assessed for photographs of samples (c) M563 and (d) M590 are shown. each type of buffer. Growth conditions are shown in Table 1. by 200 mm were measured. The leakage currents at 10 V The end of the sample M590 growth corresponds to a bias are also shown in Table 1. The high conductivity change from two-dimensional to three-dimensional found for AlN layers grown under Al-rich conditions growth mode (Stranski Á/Krastanov mode), as described could be due to leakage currents associated to threading later. This transition is clearly identified by the appear- dislocations, as suggested by Hsu et al. for MBE-GaN ance of a 2 ) 2 reconstruction in the RHEED monitor- samples grown under Ga-rich conditions [5]. Consider- ing and corresponds to a thickness of 30 Á/40 nm, with ing both the insulating characteristics and the surface high reproducibility [4]. morphology, we decided to use the buffer structure Samples M564 and M573 showed surface features corresponding to sample M590. related to Al-excess during the growth (Fig. 1a,b). In Undoped AlGaN layers with a thickness of 1 Á/2 mm sample M564, which was grown under the highest III Á/V and Al mole fractions up to x 00.39 were deposited on ratio, little droplets of 2 mm in average were observed, the AlN buffer layer. The growth temperature was in the together with larger stains of about 10 mm diameter. 730 Á/760 8C range, depending on the nominal Al Sample M573 showed very small stains, with diameters composition. Two-dimensional growth was observed lower than 2 mm, indicating that the III Á/V relative ratio by RHEED after 5 min in all the samples under study. was very close to the stoichiometry point (IIIÁ/V Â 1), as Due to the lower deposition temperatures in comparison indicated in Table 1. As seen in Fig. 1c for sample M563, to MOCVD, layer-cracking problems were not observed surface roughness starts to degrade after the transition in any sample. For GaN, a residual n-type doping of to the three-dimensional mode, the scenario becoming around 1) 1017 cm (3 is determined from C Á/V mea- harsh for the subsequent growth of AlGaN. However, surements, whereas for AlGaN, the 1/C 2 dependence under the same growth conditions, if we stop when the versus reverse voltage becomes non-linear. X-ray dif- 2 )2 reconstruction appears, a very smooth surface fraction (XRD) patterns were obtained from u /2u scans results, as shown in sample M590 (Fig. 1d). No with a wide open detector, showing full-width at half remnants of metal were detected in the surface of both maximum (FWHM) values of 8.5 and 15 arcmin for samples. To compare the electrical insulation provided GaN and AlGaN (x 0 0.30) layers, respectively. by the above AlN layers, the current Á/voltage character- Detectors consist of two interdigitated electrodes on a istics between 400 mm diameter Ti/Al contacts separated planar structure, with finger widths and gap spacings of 2, 4, and 7 mm, and active areas of 250 )250 mm2 and Table 1 500 ) 500 mm2. Two different metal systems were used AlN buffer layer characteristics ˚ ˚ ˚ for contacts: Ti (300 A)/Al (700 A) and Pt (400 A)/Ti (50 ˚ ˚ A)/Au (1000 A), corresponding to extreme values of Sample their metal workfunction. All current Á/voltage charac- M564 M573 M563 M590 teristics for AlGaN photodiodes presented a rectifying Thickness (nm) 200 200 200 35 behaviour, with a higher resistivity as the Al content III Á/V 1.2 1 0.85 0.85 increased. Ileakage (mA) at 10 V 1.4) 104 160 5.0 54 Spectral responsivity studies were performed by using a 150 W xenon arc lamp. The photodetector responsiv-
  • 3. J.L. Pau et al. / Materials Science and Engineering B93 (2002) 159 Á/162 161 ity was measured by excitation with a non-focused He Á/ different alloy compositions. Room temperature PL Cd laser (325 nm) for GaN devices, whereas the 514 nm measurements showed two emissions whose positions Ar ' laser line coupled into a second harmonic gen- coincided with the cut-off wavelength and the shoulder erator (257 nm) was used for AlGaN photodiodes. observed in the spectral response (see inset Fig. 2). The These measurements were performed under constant lower energy transition does not follow Varshni’s law (DC) illumination. Time response characterisation was for bandgap energy dependence on temperature, which made using the fourth frequency of a Nd Á/YAG laser seems to indicate that the transition corresponds to a (266 nm), with 10 ns Gaussian pulses. DA emission [8]. Typical spectral responses of AlGaN MSM photo- Detector peak responsivity and dark current values detectors with Ti/Al contacts are shown in Fig. 2. The can be found in Table 2. As seen, the responsivity optical response above the bandgap drops more mark- decreases with increasing Al mole fractions. On the edly as the Al content increases. The buffer layer other hand, the increase of the Al produces a reduction efficiently insulates the AlGaN, preventing any contri- of the observed photoconductive gain, and persistent bution from the silicon substrate to the detector optical effects (see photocurrent decays in Fig. 3). These data, response. The cut-off wavelength reached 290 nm for together with the increase of the UV/visible contrast, x 00.39, demonstrating the capability of these photo- indicate that the increase of aluminium in the ternary detectors for solar-blind applications. Below the band- alloy provokes a transition from photoconductive to gap, we fitted the quantum efficiency (h ) by the MSM photodiode behaviour. expression In AlGaN (x0 0.39) MSM photodiodes with Ti/Al contacts, the time constant, tp, value for different load hn h 8exp (1) resistances was obtained from transient photoresponse Eurb measurements. The photocurrent decays were exponen- where Eurb is the Urbach parameter, which varied from tial, with the time constant corresponding to the RC 24 meV for GaN to 90 meV for AlGaN (x 00.39) [6]. product of the measuring system. The dependence of This parameter measures the cut-off abruptness and is photocurrent response time on load resistance has been related to the presence of levels inside the bandgap or to analysed in Fig. 4, and the extrapolation to zero-load alloy disorder. As indicated in Fig. 2, the spectral allows to obtain a minimum tp value of 150 ns. response of AlGaN devices presents a shoulder below Finally, a comparative spectral response of MSM the bandgap, which might be related to regions with photodiodes for the two metal systems used can be different compositions in the ternary alloy or to observed in Fig. 5. The UV/visible contrast is around a absorption in defects. The rotation of the layer during factor 10 higher in the case of Pt/Ti/Au due to the lower the growth and the different positions of the III-element value of the dark current. The value of the dark current sources could produce alloy inhomogeneities, as already is dominated by the quality of the Schottky contacts. Pt reported [7]. However, in our sample, from XRD contacts are known to produce barrier heights of 1.0 Á/ measurements, we have not seen any evidence of 1.1 eV on GaN [9], whereas barriers of 0.1 Á/0.5 eV have been reported for Ti contacts [10]. The I Á/V character- istics of both samples under constant illumination are shown in the inset of Fig. 5. The increase of the photocurrent with the applied bias is more pronounced in samples with Ti/Al contacts, indicating a higher photoconductive gain contribution. In addition, the responsivities for Ti/Al contacts are a factor 100 super- ior to those of Pt/Ti/Au. We have reported the fabrication and characterisation of AlGaN MSM photodetectors grown on Si(111), with Al mole fractions up to 0.39. By using a proper AlN buffer, the photoresponse contribution from the con- ductive substrate is avoided. The photoconductive gain Table 2 Responsivities and dark current of 3 V biased AlGaN MSM photodiodes %Al 2 15 39 Fig. 2. Spectral responses of MSM AlGaN photodiodes grown on Rpeak (mA W(1) 5400 58 12 Si(111). Inset: room temperature photoluminiscence of AlGaN Id (nA) at 3 V 4100 1.3 0.015 (x0 0.39).
  • 4. 162 J.L. Pau et al. / Materials Science and Engineering B93 (2002) 159 Á/162 Fig. 5. Comparative spectral response for two different contact metals (Ti/Al and Pt/Ti/Au) at 5 V. Fig. 3. Time decay measurements for MSM AlGaN photodiodes with Acknowledgements different Al contents (x 0 0, 0.15, and 0.39). Observe the different time scales for GaN and AlGaN photodiodes. Thanks are due to J. Sanchez Osorio and A. Fraile for ´ their technical support and to Professor Jaque for his assistance in time response measurements. This work has been partially supported by Comunidad de Madrid, Project No. 07M/0008/1999 and PETRI No. 95-0466- OP. References [1] F. Omnes, N. Marenco, B. Beaumont, Ph. De Mierry, E. Monroy, ` F. Calle, E. Munoz, J. Appl. Phys. 86 (1999) 1. ˜ [2] J.C. Carrano, T. Li, D.L. Brown, P.A. Grudowski, C.J. Eiting, R.D. Dupuis, J.C. Campbell, Appl. Phys. Lett. 73 (1998) 2405. [3] E. Monroy, F. Calle, E. Munoz, F. Omnes, Semicond. Sci. ˜ ` Technol. 14 (1999) 685. [4] M.A. Sanchez-Garcıa, E. Calleja, E. Monroy, F.J. Sanchez, F. ´ ´ ´ Calle, E. Munoz, A. Sanz-Hervas, C. Villar, M. Aguilar, Mater. ˜ ´ Res. Soc. Internet J. Nitride Semicond. Res. 2 (1997) 33. Fig. 4. Time response dependence of an AlGaN (x 0 0.39) photodiode [5] J.W.P. Hsu, M.J. Manfra, D.V. Lang, S. Richter, S.N.G. Chu, with load resistance. A.M. Sergent, R.N. Kleiman, L.N. Pfeiffer, Appl. Phys. Lett. 78 (2001) 1685. [6] J.I. Pankove, Optical Processes in Semiconductors, Dover, New York, 1971, pp. 43 Á/46. [7] S. Fernandez, F.B. Naranjo, F. Calle, M.A. Sanchez-Garcıa, E. ´ ´ ´ observed in these devices has been found to depend Calleja, P. Vennegues, A. Trampert, K.H. Ploog, Appl. Phys. strongly on the Al content. The effect of the contact Lett. 79 (2001) 2136. [8] F. Calle, F.J. Sanchez, J.M.G. Tijero, M.A. Sanchez-Garcıa, E. ´ ´ ´ metal on the responsivity and UV/visible contrast has Calleja, R. Beresford, Semicond. Sci. Technol. 12 (1997) 1396. also been evaluated. The recombination time for the [9] Q.Z. Liu, S.S. Lau, Solid-State Electron. 42 (1998) 677. photodetectors with the highest Al content (x 00.39) [10] S.N. Mohammad, Z.F. Fan, W. Kim, O. Atkas, A.E. Botchkarev, has been extrapolated to 150 ns for zero-load resistance. A. Salvador, H. Morkoc, Electron. Lett. 32 (1996) 598.