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IBM Systems and Technology Group                                                                                            System x
Data Sheet




                                                           IBM System x iDataPlex
                                                           dx360 M3
                                                           Leading the industry in energy, cooling and space
                                                           efficiencies for data centers


                                                           Designed for data centers that require high performance, yet are
               Highlights                                  constrained on ïŹ‚oor space, power and cooling infrastructure, the
                                                           IBM System x¼ iDataPlexℱ dx360 M3 provides an innovative, half-
           ●   Award-winning design optimizing             depth solution optimized for maximum density and incredible effi-
               efficiencies in energy, cooling and
               density for data centers                    ciency. Featuring the latest IntelÂź XeonÂź Processor 5600 series and
                                                           DDR-3 memory, the dx360 M3 is easy to manage and delivers
           ●   Operational costs drastically reduced
                                                           outstanding performance in a ïŹ‚exible platform that can be tailored to
               based on innovative shallow depth
               server form factor                          your data center’s processing, storage or I/O needs.

           ●   High performance computing embrac-
               ing broad, ïŹ‚exible portfolio of offerings
                                                           For high performance computing, the dx360 M3 allows you to pack
               with simpliïŹed system management            accelerated processing into the same power and cooling envelope as
               and tools.                                  traditional servers, better utilizing ïŹ‚oor space and optimizing the data
                                                           center. The ïŹ‚exible design of the dx360 M3 integrates the right com-
                                                           pute, storage or I/O capabilities required in your data center while
                                                           optimizing density.

                                                           The innovative, shallow-depth form factor of the dx360 M3 reduces
                                                           the airïŹ‚ow required across the components, lowering the power
                                                           needed for cooling. High-efficiency power supplies, larger, better-
                                                           optimized fans in the 2U chassis, and power management capabilities
                                                           provide further efficiencies to minimize the dx360 M3’s power
                                                           requirements.

                                                           The dx360 M3 is simple to manage on a server level or at a rack level
                                                           as part of an iDataPlex rack. IBM ToolsCenter provides common
                                                           management across all System x servers, making the dx360 M3 easy
                                                           to incorporate into your data center.
IBM System x iDataPlex dx360 M3 at a glance

Form factor/height   Half-depth, 2U Flex chassis or 3U storage chassis

Processor (max)      Intel Xeon 5600 series up to 3.06 GHz (6-core)

Number of proces-    2 CPU, 2 GPU adapters (optional)                         © Copyright IBM Corporation 2010
sors (std/max)
                                                                              IBM Systems and Technology Group
Cache (max)          4 MB to 12 MB                                            Route 100
                                                                              Somers, NY 10589
Memory (max)         Up to 128 GB DDR-3 1333 MHz via 16 DIMM slots
                                                                              Produced in the United States of America
Expansion slots      Up to 2 slots PCIe x16 electrical/x16 mech (Gen 2),      May 2010
                     1 x8 PCle                                                All Rights Reserved

Disk bays (total)    Up to 8 2.5" (2U) or 12 3.5" (3U storage density)        IBM, the IBM logo, ibm.com, iDataPlex and System x are
                                                                              trademarks or registered trademarks of International
Maximum internal     24.0 TB (3U storage chassis)                             Business Machines Corporation in the United States, other
storage                                                                       countries, or both. If these and other IBM trademarked
                                                                              terms are marked on their ïŹrst occurrence in this
Interconnect         Ethernet—Integrated 1 Gb dual-port Ethernet,             information with a trademark symbol (¼ or ℱ), these
Fabric Adapters      10 Gb (optional); Fibre Channel—8 GB dual-port           symbols indicate U.S. registered or common
                     HBA (optional); InïŹniBand—QDR or DDR single-             law trademarks owned by IBM at the time this information
                     or dual-port HCA (optional); solid-state drives—160 or   was published. Such trademarks may also be registered or
                     320 GB High IOPS PCIe (optional)                         common law trademarks in other countries. A current list of
                                                                              IBM trademarks is available on the Web at “Copyright and
Power supply         900 W high efficiency nonredundant (per two servers)     trademark information” at ibm.com/legal/copytrade.shtml
(std/max)            550 W high efficiency nonredundant (per two servers)
                     750 W N+N redundant (per two servers)                    Intel and Intel Xeon are registered trademarks of Intel
                                                                              Corporation or its subsidiaries in the United States, other
Hot-swap             Hot-swap HDDs in 3U storage dense conïŹguration           countries or both.
components
                                                                              Linux is a registered trademark of Linus Torvalds in the
RAID support         RAID-0, -1, -5, -6, -10 via optional I/O controller      United States, other countries or both.

Systems              IBM Systems Director including IBM Systems Director      Microsoft is a trademark of Microsoft Corporation in the
management           Active Energy Managerℱ, Integrated Management            United States, other countries or both.
                     Module (IMM) with optional remote KVM support,           Other product, company or service names may be
                     integrated 10/100 conïŹgurable management port            trademarks or service marks of others.
Operating systems    Red Hat Enterprise LinuxÂź versions 5 and 4,
                     SUSE Linux Enterprise Server versions 11 and 10,
                                                                                       Please Recycle
                     MicrosoftÂź Windows Server 2008 R2,
                     2008 (Datacenter, HPC, Enterprise and Web),
                     VMware Infrastructure 3.5 and VMware vSphere 4.1

Limited warranty     3-year customer replaceable unit and onsite limited
                     warranty



For more information
Contact your IBM representative or IBM Business Partner or visit:
ibm.com/systems/x/hardware/idataplex.html




                                                                                                                     XSD03058-USEN-01

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iDataPlex DataSheet

  • 1. IBM Systems and Technology Group System x Data Sheet IBM System x iDataPlex dx360 M3 Leading the industry in energy, cooling and space efficiencies for data centers Designed for data centers that require high performance, yet are Highlights constrained on ïŹ‚oor space, power and cooling infrastructure, the IBM System xÂź iDataPlexℱ dx360 M3 provides an innovative, half- ● Award-winning design optimizing depth solution optimized for maximum density and incredible effi- efficiencies in energy, cooling and density for data centers ciency. Featuring the latest IntelÂź XeonÂź Processor 5600 series and DDR-3 memory, the dx360 M3 is easy to manage and delivers ● Operational costs drastically reduced outstanding performance in a ïŹ‚exible platform that can be tailored to based on innovative shallow depth server form factor your data center’s processing, storage or I/O needs. ● High performance computing embrac- ing broad, ïŹ‚exible portfolio of offerings For high performance computing, the dx360 M3 allows you to pack with simpliïŹed system management accelerated processing into the same power and cooling envelope as and tools. traditional servers, better utilizing ïŹ‚oor space and optimizing the data center. The ïŹ‚exible design of the dx360 M3 integrates the right com- pute, storage or I/O capabilities required in your data center while optimizing density. The innovative, shallow-depth form factor of the dx360 M3 reduces the airïŹ‚ow required across the components, lowering the power needed for cooling. High-efficiency power supplies, larger, better- optimized fans in the 2U chassis, and power management capabilities provide further efficiencies to minimize the dx360 M3’s power requirements. The dx360 M3 is simple to manage on a server level or at a rack level as part of an iDataPlex rack. IBM ToolsCenter provides common management across all System x servers, making the dx360 M3 easy to incorporate into your data center.
  • 2. IBM System x iDataPlex dx360 M3 at a glance Form factor/height Half-depth, 2U Flex chassis or 3U storage chassis Processor (max) Intel Xeon 5600 series up to 3.06 GHz (6-core) Number of proces- 2 CPU, 2 GPU adapters (optional) © Copyright IBM Corporation 2010 sors (std/max) IBM Systems and Technology Group Cache (max) 4 MB to 12 MB Route 100 Somers, NY 10589 Memory (max) Up to 128 GB DDR-3 1333 MHz via 16 DIMM slots Produced in the United States of America Expansion slots Up to 2 slots PCIe x16 electrical/x16 mech (Gen 2), May 2010 1 x8 PCle All Rights Reserved Disk bays (total) Up to 8 2.5" (2U) or 12 3.5" (3U storage density) IBM, the IBM logo, ibm.com, iDataPlex and System x are trademarks or registered trademarks of International Maximum internal 24.0 TB (3U storage chassis) Business Machines Corporation in the United States, other storage countries, or both. If these and other IBM trademarked terms are marked on their ïŹrst occurrence in this Interconnect Ethernet—Integrated 1 Gb dual-port Ethernet, information with a trademark symbol (Âź or ℱ), these Fabric Adapters 10 Gb (optional); Fibre Channel—8 GB dual-port symbols indicate U.S. registered or common HBA (optional); InïŹniBand—QDR or DDR single- law trademarks owned by IBM at the time this information or dual-port HCA (optional); solid-state drives—160 or was published. Such trademarks may also be registered or 320 GB High IOPS PCIe (optional) common law trademarks in other countries. A current list of IBM trademarks is available on the Web at “Copyright and Power supply 900 W high efficiency nonredundant (per two servers) trademark information” at ibm.com/legal/copytrade.shtml (std/max) 550 W high efficiency nonredundant (per two servers) 750 W N+N redundant (per two servers) Intel and Intel Xeon are registered trademarks of Intel Corporation or its subsidiaries in the United States, other Hot-swap Hot-swap HDDs in 3U storage dense conïŹguration countries or both. components Linux is a registered trademark of Linus Torvalds in the RAID support RAID-0, -1, -5, -6, -10 via optional I/O controller United States, other countries or both. Systems IBM Systems Director including IBM Systems Director Microsoft is a trademark of Microsoft Corporation in the management Active Energy Managerℱ, Integrated Management United States, other countries or both. Module (IMM) with optional remote KVM support, Other product, company or service names may be integrated 10/100 conïŹgurable management port trademarks or service marks of others. Operating systems Red Hat Enterprise LinuxÂź versions 5 and 4, SUSE Linux Enterprise Server versions 11 and 10, Please Recycle MicrosoftÂź Windows Server 2008 R2, 2008 (Datacenter, HPC, Enterprise and Web), VMware Infrastructure 3.5 and VMware vSphere 4.1 Limited warranty 3-year customer replaceable unit and onsite limited warranty For more information Contact your IBM representative or IBM Business Partner or visit: ibm.com/systems/x/hardware/idataplex.html XSD03058-USEN-01