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7. High Performance
Computing Engines
for the CORE
Connectivity Platforms
to Build and Connect
the EDGE
Components and Pervasive
Devices for REAL WORLD
Applications
Eurotech Value Proposition
Products and Solutions for Core, Infrastructure, Edge
8. HPC division highlights
• HPC systems designer and manufacturer bottom up: from board to system
• More than 15 years of history in the industry designing, engineering and
deploying HPC systems and solutions
• R&D driven: leading the engineering efforts of many large scale EU projects
(DEEP, Qpace2, EuroEXA, Euroserver)
• First worldwide company to market a direct hot water cooled HPC
• Commitment to energy efficiency (June 2013 GREEN 500 1st and 2nd place)
• Funding member of ETP for HPC
10. High performance density. We want our customer to decrease time to
solution and footprint running their simulations and applications as fast as the
latest technology allows.
Energy efficiency and Green. We aspire to develop green, energy efficient
products that allow our customer to save energy and leverage sustainability.
RAS. We want enhance design, support readiness, preventive maintenance
and quality to to increase the serviceability, availability and reliability of our HPC
systems during their lifetime.
Scalability. We aim to propose solutions that scale as linearly as possible and
are set to modularly increase from giga to petaflops
Cost effectiveness. We concentrate a lot of our efforts to deliver advanced
technology at competitive prices together with a compelling total cost of
ownership.
Versatility. With our products and solutions, we want to help our customers to
solve a vast variety of computational problems in the most effective way
possible
Eurotech HPC Principles
13. The Aurora HPC systems Greenest
The Aurora
systems are top
#1 and #2 Green
500 with 3.2
GFlops/W
Densest
Best density for
x86 in the market
with > 400
TFlop/s per rack
Standard
Aurora systems
use standard off
the shelf
components
Hot liquid
cooled
All Aurora
systems are hot
liquid cooled
14. Key Features:
High Performance Density – 4096 processor
cores, up to 100 TFlops in just 1.5 m2
Energy efficiency– target datacenter PUE of
1.05, no need for air conditioning, up to 50% less
energy
Fast interconnects– Infiniband QDR/FDR, 3D
Torus, Latency ~ 1us
Hot Liquid Cooling– All components are cooled
by water, temperature from 18°C to 52°C and
variable flow rates
Reliability– 2 independent sensor networks,
soldered memory, uniform cooling, quality
controls
CPU only supercomputers
15. Key Features and value:
Performance – up to 430 Tflop/s per rack - 84%
Rmax/Rpeak
Save space – 2048 CPU processor cores, 256
accelerators, up to 430 Tflop/s in just 1.5 m2
Save energy– 3.2 Gflop/s per Watt – data center
PUE of 1.05, no need for air conditioning, up to
50% less energy consumed
No compatibility issues– Tigon architecture is
based on standard off the shelf components
Hot Liquid Cooling– All components are cooled
by water, temperature from 18°C to 52°C and
variable flow rates
Reliability– 3 independent sensor networks,
soldered memory, no moving parts
Accelerator based supercomputers
16. Eurotech workgroup HPC systems
Compact and powerful
Features and value
Powerful
• Dramatically accelerate application
Silent
• Water cooled (no fans) so NO noise
Save space
• Fit under a desk up to 16/32 Xeon processors
and up to 16 Nvidia Kepler GPUs/Intel Phi
Save energy
• Based on the most efficient architecture in the
world
No need for air conditioning
• Hot liquid cooled, all noise and heat are taken
outside
• No need for air conditioning or controlled
environments
Easy
• No complicated and messy cabling
• Installation similar to the one for a house air
conditioner
17. HPEC @ Eurotech
• The high performance embedded computing products leverage the HPC R&D
to design compact and energy efficient high performance computer to be
deployed in harsh environments and be used for special purposes
• The objective is to be able to offer the maximum performance possible within a
set power budget and to bring that performance into the field
From data center to the field
19. Standard components
Intel Xeon E5 v2
Nvidia Tesla K20-K20x-K40
The Aurora Architecture cheat sheet
Energy aware design
Power conversion optimization
No unused components
No fans
Soldered components
Integrated interconnectDirect hot water cooling
All parts of the system are water
cooled directly on the
components
Inlet water up to 55°C (131° F)
Interconnects
Infiniband
3D Torus
Modularity
Systems configurable from
building blocks of few Tflops to
Petaflop/s installations
21. Q-Pace, 2007-2009
Eurotech HPC R&D project examples
Janus, 2006-2008
Ape mille, Ape Next
1999-2005
Outcome:
• 40 racks in sites around Europe
• LQCD specific acceleration
• 3D Torus switchless technology
Outcome:
• A modular, massively parallel, and reconfigurable
FPGA-based architecture
Outcome:
• Innovative hot direct liquid cooling technology
22. Q-Pace 2, 2012-2013
Eurotech HPC R&D project examples
Aurora Science, 2008-
2010
Outcome:
• Hot and direct liquid cooling technology
• FPGA driven 3D Torus switchless technology
• Energy efficient design
Expected outcome:
• The Booster architecture enabling 3D torus
connected cluster of accelerators with offloading
technology
Expected outcome:
• Innovative HPC architecture based on Aurora
bricks modular approach and CPU-less
supercomputing
Deep project 2012 -
2015
24. Liquid cooling for Eurotech
Liquid cooling for us is:
• Hot. So, using hot water wherever possible
• Direct. Taken inside the rack in direct contact with the
components
• Green. Able to use free cooling in any climate zone
• Comprehensive. Cools any source of heat in the server
(including power supply)
• Serviceable and safe. Allows ease of maintenance and
doesn’t represent a risk for the electronics in the server
What liquid cooling is for us
25. Aurora liquid cooling
• The main components of the Aurora cooling system are:
• Cooling circuit, that is the pipe work which bring the water to the heat
exchanger and back to the rack
• The heat exchanger for free cooling
• Distribution pipes which are mounted in the rack
• The back plane, which collects the liquid from the distribution pipes and
distributes it to the cold plates
• Cold plates: aluminum boards which are intimately coupled with the electronic
boards of compute nodes, PCUs and switches
• Quick disconnects that are mounted on the cold plates for inflow and outflow
of liquid in the plates. The quick disconnects are fine pieces of engineering that
seal immediately when the boards is extracted from the back plane. No
leakage is possible
High level description
28. Why Aurora solutions?
Scalability
Offer linear scalability to
users from Gigaflops to
Petaflops
Compatibility and
flexibility
Use of standard components
Choice of interconnects
X86 based systems
Intel Cluster Ready
Green
Energy bill savings
Maximize performance within
a power budget
Leverage green and
sustainability strategies
Competence
HPC expertise
Liquid cooling expertise
End to end solution
deployment
RAS
Limit downtime
Save on maintenance
High performance
density
The most “dense” x86 HPC
systems in the market
Save space
Postpone real estate
investments
29. Data center TCO drivers
Driver Cost components
IT CAPEX Initial SW and HW capital expenditures
Space occupancy
(footprint)
Cost of the occupied space and auxiliary infrastructure: rent,
opportunity cost, civil, structural and engineering, permits and
taxes
Data center infrastructure Electrical (UPS, generator, cables…)
Cooling (Chillers, AHUs, heat exchangers, pumps…)
Facilities (fire prevention, plants, security, building mng systems)
Installation Delivery, installation, test and tuning of IT, electrical and cooling
equipment
Energy Cost of energy: IT, cooling, lighting and waste
Maintenance and additional
operation costs
Warranty extensions, support, software licenses, IT maintenance,
electrical and cooling maintenance, facilities maintenance, costs
of outages, heating, security
Other: disposal, green… Costs of end of life, carbon footprint (missed) incentives, fines…
30. Unbeatable TCO for sustainable solutions
Energy savings
Lower cost due to
less energy
consumed
Space savings
Savings in real
estate, racks,
electrical, cooling
and network
Reliability
Savings in downtime
indirect cost and
maintenance
Sustainability impact
High
Sustainability impact
High
Sustainability impact
Medium
31. Comparison - investment
Investment (K US dollars) Datacenter A Datacenter B Datacenter C
Servers $6,200 $6,200 $6,200
Network and other IT $440 $440 $440
Building $1,260 $540 $360
Racks $280 $120 $60
Cooling $2,670 $3,060 $660
Electrical $3,570 $3,570 $2,420
TOTAL INVESTMENT $14,420 $13,930 $10,140
Data center A – PUE 2.2
Data center B – PUE 1.6
Data center C – PUE 1.05
Medium density (20 kW per rack) – air cooled
High density (50 kW per rack) – optimized air
cooling, rear door liquid cooling
High density (87 kW per rack) – direct hot liquid
cooling, floating Tamb
32. Comparison – annualized TCO
Annual cost (K US dollars) Datacenter A Datacenter B Datacenter C
Cost of energy $1,970 $1,430 $640
Retuning and additional CFD $6 $3 $0
Total outage cost $270 $270 $230
Preventive maintenance $150 $150 $150
Annual facility and infrastructure
maintenance. $310 $290 $140
Lighting $5 $3 $2
Annualized 3 years capital costs $2,040 $2,000 $1,980
Annualized 10 years capital costs $880 $940 $440
Annualized 15 years capital costs $130 $60 $40
ANNUALIZED TCO $5,761 $5,146 $3,622
Data center A – PUE 2.2
Data center B – PUE 1.6
Data center C – PUE 1.05
Medium density (20 kW per rack) – air cooled
High density (50 kW per rack) – optimized air cooling, rear door
liquid cooling
High density (87 kW per rack) – direct hot liquid cooling, floating
Tamb