Keynote presentation, Powering the Next Generation Surround Computing Experience, by Mark Papermaster, AMD Senior VP, CTO, at the AMD Developer Summit November 11-13, 2013.

1. LET’S BRING SURROUND COMPUTING TO LIFE
MARK PAPERMASTER
NOVEMBER 13, 2013

2. APU13 – A WEEK OF HEADLINES
NEWS
AMD Drives
CPU/GPU Combo
Into the Data Center
With New Allies
-VentureBeat
AMD Charts a Path to Java On the GPU -SemiAccurate
AMD has been ramping up their tools effort of late to support GPU compute on the server-side
and today it is Java’s turn again. As SemiAccurate mentioned a while ago, AMD is not just making
slides about servers, they are really making tools.
Two years ago, AMD announced that the Aparapi API could target OpenCL so that one could
explicitly compile Java to a parallel environment that was GPU aware. Essentially Java in, OpenCL
bytecode out.
AMD Kaveri APU – Impressive
Graphics Power Detailed -My Gaming
AMD has revealed some detailed specifications of Kaveri. It’s AMD’s next APU on socket FM2+
and is the culmination of the work AMD has put into HSA (Heterogeneous System Architecture).
AMD announced that it is on track to ship Kaveri to its channel partners before the end of 2013.
More details on the APU will be available at CES 2014, with general availability to the public in
February 2014. Pricing and exact availability dates were not announced by the company.
Advanced Micro Devices is announcing new
support from hardware and software
companies today for a new kind of data
center computing, dubbed heterogeneous
system architecture (HSA).
The architecture makes it easy for a program
to use the available computing power in a
system, whether it comes in the form of a
traditional central processing unit, or CPU,
or a graphics processing unit (GPU), which
can be programmed to handle non-graphics
tasks. The idea is to help servers in data
centers to keep up with demands on the
cloud from mobile devices.
Unified Heterogeneous Computing
Arrives -Electronic Design
AMD’s 2013 Developer Summit is off to a bang with chips, SDKs and architectures. The Kaveri
(Fig. 1) Accelerated Processing Unit (APU) implements AMD’s Heterogeneous System
Architecture (HSA). HSA delivers heterogeneous unified memory access (hUMA)so CPUs and
GPUs share the same virtual address space. It means that data does not have to be copied
between CPU and GPU accessible memory as is required with most CPU/GPU environments.
The new APUs provide hQ (heterogeneous queuing) support (Fig. 2). The hQ allows CPU and GPU
applications to schedule new GPU jobs directly. Combined with hUMA, hQ delivers significant
efficiencies compared to isolated CPU/GPU architectures.
2 | AMD DEVELOPER SUMMIT | NOVEMBER 2013
AMD Kaveri APU
Showcased, Has
Double The
Performance Of Intel
4770K With A
GeForce GT630
-DSO Gaming
AMD’s Developer Summit is currently
underway and yesterday the company
showcased its new APU, the Kaveri. AMD’s
Kaveri – the A10-7850K – was put against an
Intel i7-4770K paired with an Nvidia GeForce
GT630. Without a discrete GPU – and
without taking advantage of the Mantle API
– the A10-7850K has double the
performance of the aforementioned combo
in Battlefield 4.

3. SURROUND COMPUTING – PROGRESS IN 2013
AUDIO, DISPLAY, IMMERSION, INTERACTION
Next-generation game consoles feature
voice, vision, and motion technology
Virtual Reality Headset
AMD optimizes gesture control and
facial recognition for PC/tablet APUs
UltraHD home theater and gaming
AMD Surround House: 3x UltraHD
surround resolution with
32.4 positional audio
A Fully Programmable Audio Engine
3 | AMD DEVELOPER SUMMIT | NOVEMBER 2013

4. TOO OFTEN WE VIEW
COMPUTING THROUGH
TINY WINDOWS.
4 | AMD DEVELOPER SUMMIT | NOVEMBER 2013

5. LET’S CREATE
DOORS TO
ACHIEVE
SURROUND
COMPUTING
EXPERIENCES.
5 | AMD DEVELOPER SUMMIT | NOVEMBER 2013

6. HOW DO WE CREATE THE DOORS TO SURROUND COMPUTING?
EYE-DEFINITION
VISUAL REALISM
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REAL-WORLD AUDIO
NATURAL AND SECURE
INTERACTION

7. PURSUING EYE-DEFINITION VISUAL REALISM
DRIVE MORE PIXELS
DISPLAY MORE PIXELS
ENABLE DEVELOPERS TO
POWER MORE PIXELS
MORE WITH MORE
Graphics Applications
Mantle API
Mantle Driver
GCN
GCN Architecture
7 | AMD DEVELOPER SUMMIT | NOVEMBER 2013
HSA, OpenCL™, C++AMP,
DirectX™ 11.2 and Mantle

8. THE TREND TO PUSH MORE PIXELS IS ACCELERATING
WHAT CAN YOU DO WITH 64 GPIXELS/SEC RENDER POWER IN A SINGLE GPU?
AMD Radeon™
HD 7970 GHz Edition
AMD Radeon™
R9 290X
Increase
Geometry Processing
2.1 billion primitives/sec
4 billion primitives/sec
1.9x
Compute
4.3 TFLOPS
5.6 TFLOPS
1.3x
Texture fill rate
134.4 Gtexels/sec
176 Gtexels/sec
1.3x
Pixel fill rate
33.6 Gpixels/sec
64 Gpixels/sec
1.9x
Peak Bandwidth
264 GB/sec
320 GB/sec
1.2x
THE POWER TO CREATE DIGITAL VISUAL REALMS AS REAL AS
THE HUMAN PERCEPTUAL SYSTEM IS WITHIN REACH
8 | AMD DEVELOPER SUMMIT | NOVEMBER 2013

9. ACHIEVING REAL WORLD AUDIO
REAL-TIME ACCELERATED SOUND PROCESSING: APPLYING PHYSICS TO AUDIO
SPATIALIZATION / 3D AUDIO
PHYSICS OF SOUND ENVIRONMENTS
AND ACOUSTICS
AUDIO/VOICE STREAMS
WITH HSA AND AN INHERENTLY OPEN COMPUTING PLATFORM,
AUDIO EVOLUTION WILL BE DISRUPTIVE
9 | AMD DEVELOPER SUMMIT | NOVEMBER 2013

10. TRUEAUDIO: AUDIO DONE RIGHT
DEVELOPING FOR AMD TRUEAUDIO
Game Engine
Middleware API
Middleware effects
& plugins
3rd Party Plugins
(ie. McDSP, GenAudio, etc.. )
Audio Middleware/Engine
 Developers of Audio Engines & Effects can access
AMD TrueAudio processing resources to deliver a
unique audio user experience
 Functionality exposed
through AMD TrueAudio API
AMD TrueAudio API
AMD TRUEAUDIO User-mode Services Library
Audio DSP
HSA WITH TRUEAUDIO MEANS ABUNDANT PROCESSING POWER
FOR YOUR ALGORITHM
10 | AMD DEVELOPER SUMMIT | NOVEMBER 2013

11. THE FOUR TENETS OF NATURAL AND SECURE INTERACTION
1. HEAR ME
2. SEE ME
3. KNOW ME
4. SHOW ME
AMD APU DESIGNS BLEND LOW-LATENCY PARALLEL AND FIXED FUNCTION
PROCESSING TO BEST POWER THESE WORKLOADS
11 | AMD DEVELOPER SUMMIT | NOVEMBER 2013

12. AMD IP: THE BEST BUILDING BLOCKS FOR SURROUND COMPUTING
CPU CORES
MULTIMEDIA
GRAPHICS
VIDEO
CODECS
SOFTWARE
AUDIO
ALGORITHMS
AND MORE
CPU and graphics cores, fixed function cores and DSPs are
raised to the next level of performance…THROUGH HSA
12 | AMD DEVELOPER SUMMIT | NOVEMBER 2013

13. PUTTING IT ALL TOGETHER: THE BEST SoCs IN 2014
2013
“Kaveri” APU
“Richland” APU
Performance
2nd
Mainstream
2014
2-4 “Steamroller” CPU Cores
GCN Graphics Compute Units
HSA Features
AMD TrueAudio
15W-35W
2-4 “Piledriver” CPU Cores
Generation DX®11 GPU Cores
17W-35W
28nm
32nm
“Kabini” APU
Low-Power
Essential
28nm
SoC
2-4 “Jaguar” CPU Cores
GCN Graphics Compute Units
15W-25W
“Beema ” APU
28nm
SoC
“Temash” APU
Ultra-Low Power
28nm
SoC
13 | AMD DEVELOPER SUMMIT | NOVEMBER 2013
2-4 “Jaguar” CPU Cores
GCN Graphics Compute Units
3W-4W SDP
2-4 “Puma” CPU Cores
GCN Graphics Compute Units
AMD Security Processor
10W-25W
“Mullins ” APU
28nm
SoC
2-4 “Puma” CPU Cores
GCN Graphics Compute Units
AMD Security Processor
~2W SDP
AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended
to represent first year of production shipments.

14. THE WORLD’S BEST NEW CLIENT APU: “MULLINS”
ULTRA-LOW POWER SOC FOR TABLET AND 2-IN-1 FORM FACTORS
 More Performance, Lower Power
‒
2X the performance-per-watt of the
previous AMD generation1,2
‒
Quad-Core x86 APU for fanless designs
‒
GCN Graphics: PC gaming in a tablet
 New Features, Real Benefits
‒
‒
14 | AMD DEVELOPER SUMMIT | NOVEMBER 2013
Microsoft InstantGo
AMD Security Processor with support for
ARM TrustZone

15. LET’S CREATE
SOME DOORS!
15 | AMD DEVELOPER SUMMIT | NOVEMBER 2013

16. FORWARD LOOKING STATEMENTS
Today’s presentations contain forward-looking statements concerning Advanced Micro Devices, Inc. (“AMD” or the “Company”) including, among other things,
AMD’s strategic initiatives and growth opportunities; AMD product roadmaps and future products, including the features, architecture and performance of these
new products; the benefits of Heterogeneous System Architecture; and industry trends, which are made pursuant to the safe harbor provisions of the Private
Securities Litigation Reform Act. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends,"
"projects," and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this presentation are based on current beliefs,
assumptions and expectations, speak only as of the date of this presentation and involve risks and uncertainties that could cause actual results to differ materially
from current expectations. Risks include the possibility that that Intel Corporation’s pricing, marketing and rebating programs, product bundling, standard setting,
new product introductions or other activities may negatively impact the Company’s plans; that the Company will require additional funding and may be unable to
raise sufficient capital on favorable terms, or at all; that customers stop buying the Company’s products or materially reduce their operations or demand for its
products; that the Company may be unable to develop, launch and ramp new products and technologies in the volumes that are required by the market at mature
yields on a timely basis; that the company’s third-party foundry suppliers will be unable to transition the Company’s products to advanced manufacturing process
technologies in a timely and effective way or to manufacture the Company’s products on a timely basis in sufficient quantities and using competitive process
technologies; that the Company will be unable to obtain sufficient manufacturing capacity or components to meet demand for its products or will not fully utilize
the Company’s projected manufacturing capacity needs at GLOBALFOUNDRIES Inc. (GF) microprocessor manufacturing facilities; that the Company’s requirements
for wafers will be less than the fixed number of wafers that we agreed to purchase from GF or GF encounters problems that significantly reduce the number of
functional die the Company receives from each wafer; that the Company is unable to successfully implement its long-term business strategy; that the Company
inaccurately estimates the quantity or type of products that its customers will want in the future or will ultimately end up purchasing, resulting in excess or
obsolete inventory; that the Company is unable to manage the risks related to the use of its third-party distributors and add-in-board (AIB) partners or offer the
appropriate incentives to focus them on the sale of the Company’s products; that the Company may be unable to maintain the level of investment in research and
development that is required to remain competitive; that there may be unexpected variations in market growth and demand for the Company’s products and
technologies in light of the product mix that it may have available at any particular time; that global business and economic conditions, including consumer PC
market conditions, will not improve or will worsen; and the effect of political or economic instability, domestically or internationally, on our sales or supply
chain. Investors are urged to review in detail the risks and uncertainties in the Company's Securities and Exchange Commission filings, including but not limited to
the Quarterly Report on Form 10-Q for the quarter ended September 28, 2013.
18 | AMD DEVELOPER SUMMIT | NOVEMBER 2013