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THE AMD EMBEDDED G-SERIES
                                                                   PLATFORM
                                                                   The World’s First APU for Embedded Systems

                                                                   Embargo until 12:01 a.m. EST 1/19/2011




1 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
Strong Commitment to x86 Embedded Systems




                                                                                             Ball Grid Array (BGA)
                                                                                             packaging introduced
                                                         Addition of graphics and              to meet customer
                                                           chipset options for                      demand
                                                             comprehensive                                                   The AMD
                       Introduction of AMD64               embedded solution
                           technology into                                                                                  Embedded G-
The AMD               embedded markets with                                                                                    Series
Geode™                     AMD Opteron™                                                                                       Platform
processor                     processor

  2003           2004              2005              2006             2007            2008           2009            2010      2011
                                AMD increases performance and features, while driving down
                                   power, area, and price barriers for x86 in embedded



   2 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
The Embedded Market is Key in AMD’s Strategy 



          Market is huge and growing
            10%+ per year growth in the CPU market for embedded applications¹

            The x86 CPU SAM² is more than 3B/year in 2010 alone²

             >350% growth for AMD’s 64-bit embedded CPU/chipset business in just 3
             years³




          This market wants innovative, complete platforms
             Systems are more compute intensive with high-performance graphics
             requirements



           ¹ As predicted by VDC research 2009 Global Embedded Market Analysis
           ² “Served Available Market”; as estimated by VDC research 2009 Global Embedded Market Analysis
           ³ Based on AMD internal data 2007-2010




3 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
The Next Step Forward for AMD in Embedded: AMD G-Series Platform




We live in an always-on environment
 that requires high performance.

There is an ongoing push for
 decreased power, smaller size, higher
 capability systems at lower prices.

There is a strong visual element and
                                                                                    Today, AMD is delivering the world’s first and 
 growing need for quality graphics in
                                                                                               only APU for embedded systems,
 many embedded markets                                                                incorporating the new, very low power x86
                                                                                   “Bobcat” core with a world-class DirectX® 11-
                                                                                        capable GPU on a single piece of silicon.



4 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
Traditional Vertical Markets


                         Thin-clients                                              Medical Imaging


                         Point-of-sale (POS)
                                                                                   Gaming Machines
                         & Kiosk Systems


                         Digital Signage                                           Single Board Computing (SBC)


                                                                                   Small/Home Office to Enterprise
                         Industrial Controls
                                                                                   Storage


                         Ruggedized, Field,                                        Telecommunications
                         & Military Systems                                        & Networking




5 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
The Future of Embedded Systems is Here




     More compelling designs in
     traditional markets

     Incredible user experiences in
     smaller form factors

     Enabling brand new markets and
     products in a world of connected
     devices

                                                                                   3.5” Single Board Computer




6 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
The AMD Fusion Family of Accelerated Processing Units


                                                                        APU                 External
                Multi-Core CPUs                                                          GPU sub-systems

                        CPU                                   Serial Data Processing               GPU

                                                                     Parallel Data         Video         Display
               General        General
               Program        Program                                Processing
                Task           Task
                                                                                          Graphics      ATI Stream


                                                       • General-purpose,
             Designed for:                               programmable scalar and        Designed for:
                                                         vector processor cores, form
             General purpose tasks                                                      Specialized tasks
                                                         heterogeneous capability       (e.g. graphics, video)
             Most common
             applications                              • High-speed bus                 Most visual applications
             Data processing serially                    architecture                   Data processing in
                                                       • Shared, low-latency            parallel
                                                         memory model
                                                       • All on the same die

7 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
The AMD Embedded G-Series Platform: APU + Fusion Controller Hub

         APU
         •   2 x86 CPU Cores (40nm “Bobcat” core – 1 MB L2, 64-bit
             FPU)
         •   C6 and power gating
         •   Array of SIMD Engines
                – DX11 graphics performance
                – Industry leading 3D and graphics processing
         •   3rd Generation Unified Video Decoder
                – H.264, VC1, DixX/Xvid format
         •   Two dedicated digital display interfaces
             – Configurable externally as HDMI, DVI, and/or Display Port
             – Also supports a single link LVDS for internal panels
         •   Integrated VGA DDR3 800-1066, 2 DIMMs, 64 bit channel
         •   BGA package




         AMD Fusion Controller Hub for display and I/O
         • 4x1 PCIe®
         • “Hudson” Fusion Controller Hub



8 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
Developer Support



 Reference designs, development boards, and schematics


 Support for differentiated embedded products at every phase
         Design
                  Development
                           Go-to-market


 Commitment to an open ecosystem for embedded developers




9 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
Current Customer Systems




10 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
Select AMD Embedded G-Series Platform Customer and Partners




11 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
The AMD Embedded G-Series Platform In Summary

    AMD’s strong commitment to embedded is in a separate 
    league

             •The world’s first and only APU for embedded systems
             •Cutting-edge AMD Fusion technology
             •Immediately available for embedded
             •Driving down power consumption and board area
             •Leveraging open and industry standards
             •Improving time to market

    The premier solution for a new generation of
    differentiated, small form factor embedded systems
    that consume less power, yet deliver improved
    performance and features, including an outstanding
    visual experience

12 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
BACKUP




13 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
Features that “Shrink the Design, Not the Performance”

           Packaging                            Direct Connect                      Enterprise-class                 Scalability
                                                 Architecture                          Features

      BGA and lidless options                 Multi-core leadership                 ECC
                                                                                                                Socket-compatibility
                                                                                                                for easy design
                                                                                    Virtualization              upgrade
      Low-z-height for small,                 Low memory latency
      compact form factors
                                                                                    Multiple power
                                              DDR3 memory                           management/ reduction       Easy migration path to
      Small area footprint                                                          features                    higher performance

                                              High-performance I/O with
      Reliability                             HyperTransport™ 3.0                                               Chipset & graphics
                                                                                    Enhanced virus protection
                                              technology                                                        compatibility
      Low cost
                                                                                    No compromise on            Clear roadmap
                                              Consistent 64-bit capability          application performance     progression
      Fanless operation




14 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
With the AMD Embedded G-Series Platform: Further Shrink the Design, Improve the Experience


         Reduced Board                       Integrated Graphics                    Rich Display and I/O               Low Idle
             Space                               Performance                              Support                       Power

                                              World-class integrated AMD
                                              Radeon™ graphics core with 
                                                                                    Up to 6 digital display      Optimized display refresh
                                              DirectX® 11 support
      Brings together CPU and                                                       ports connect one            minimizes DRAM activity
      GPU into a single, smaller              Low Latency, high-bandwidth           HDMI™, multiple DP, or       during idle states, does
      package                                 memory access enables high            DVI displays and docks       not require external I/O or
                                              performance graphics                                               chipset activity

                                              DirectCompute 11
                                                                                                                 Easy migration path to
                                              Smooth playback of Blu-ray titles
                                                                                    PCIe®  general purpose       higher performance
                                                                                    ports provide low-latency,
      Enables small form factors              Up to 1080p video playback            high bandwidth I/O direct    UVD 3.0 offloads video
      with high levels of SoC                 supported (18W processors and
                                                                                    to memory to support         decode dramatically
      integration                             above only)
                                                                                    demanding peripherals        reducing CPU loading
                                              Up to 2560x1600 display                                            during video playback
                                              resolution




15 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
New Low-Power "Bobcat" x86 Core

     Advanced Micro-architecture
      Dual x86 Decode
      Advanced Branch Predictor                                                                      ICACHE
      Out-of-Order Instruction Execution                                            “Bobcat”                              L2
          – Full OOO Instruction Execution                                          Low-Power          Fetch
          – Full OOO Load/Store Engine
                                                                                       Core
        High Performance Floating Point
        AMD64 64-bit ISA                                                                              Decode              BU
        SSE1,2,3, SSSE3 ISA, SSE4A
        Secure Advanced Virtualization
        32KB L1s, 512KB L2

     Low Power Design
                                                                                       Integer         Address           FP
      Power Optimized Execution                                                      Scheduler       Scheduler       Scheduler
      Micro-architecture that minimizes data movement
       and unnecessary reads
      Clock Gating, Power Gating                                                     I        I    Load    Store    A           M
      System Low Power States                                                      Pipe     Pipe   Pipe    Pipe    Pipe        Pipe
      Sub 1W capable

     Small Core                                                                                       DCACHE
      Mainstream performance in less
       than half of the silicon area of previous solutions
      40nm / 10 metal layer process


16 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
Better Footprint than Intel Atom Solutions
                                                                                                                                 To scale
                                                                                                  2.7W-4.7W      = 11.7W-22.7W
    AMD Embedded G-Series Platform                                                     9,18W

                                                                                                    Controller
                                                                           FT1             APU         Hub       = 890mm2
                                                                                      361mm2       529mm2
                                                                                      413 balls    605 balls
                                                                                                                 = 1018 balls

                                                                                  2.7-3.9W         1.55W         = 4.25W-5.45W
    Intel Atom E6xx Series
                                                                                   Intel            Intel
                                                                                                   EG20T
                                                          FCBGA559               Atom 600
                                                                                                  Controller     = 1013mm2
                                                                                  Series            Hub

                                                                                  484mm2           529mm2        = 1052 balls
  Source: http://download.intel.com/embedded/processors/prodbrief/324100.pdf
                                                                                  676 balls        376 balls
                                                                                                  2.5-4.3W       = 8W-17.3W
    Intel Atom 400 and 500 Series                                              5.5-13W

                                                                                 Intel              Intel
                                                   FCBGA559                     Atom              ICH9 I/O       = 1445mm2
                                                                               400-500            Controller

   Source: http://ark.intel.com/Product.aspx?id=29823&code=82801HM and         484mm2                            = 1235 balls
   http://download.intel.com/embedded/processors/prodbrief/323288.pdf          559 balls
                                                                                                   961mm2
                                                                                                   676 balls
17 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
Better Footprint : AMD Embedded G-Series Platform vs. Intel Core i5-520M
                                                                                                                                                            To scale
    AMD Embedded G-Series Platform
                                                                                              9,18W         2.7W-4.7W         = 11.7W-22.7W


                                                                              FT1               APU
                                                                                                              Controller
                                                                                                                              = 890mm2
                                                                                                                Hub


                                                                                              361mm2
                                                                                              413 balls      529mm2
                                                                                                                              = 1018 balls
                                                                                                             605 balls



    Intel Core i5-520M                                                             35W                                        =38.5W
                                                                                                              3.5W


                                                                                                              Intel
                                                                            Intel Core i5-
                                                                                                             QM57             = 1627mm2
                                                 BGA1288                                                    Controller
                                                                                520M
                                                                                                              Hub

                                                                                                                              = 2359 balls
                                                                                                             675mm2
                                                                                                             1071 balls
                                                                               952mm2
                                                                               1288 balls                                  82% larger footprint with more
                                                                                                                           than 2X balls to route
  Source: http://ark.intel.com/Product.aspx?id=47341 and http://ark.intel.com/chipset.aspx?familyID=43185


18 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
DISCLAIMER
The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors.
The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes,
  component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS
  flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to
  revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes.


AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY
 INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION.


AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL
 AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY
 INFORMATION CONTAINED HEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.


ATTRIBUTION
© 2011 Advanced Micro Devices, Inc. All rights reserved.


AMD, the AMD arrow logo, AMD Geode, AMD Sempron, AMD Turion, AMD Opteron, and combinations thereof, are trademarks of Advanced Micro Devices, Inc.
 All other products names and logos are for reference only and may be trademarks of their respective owners.




19 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

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AMD Embedded G-Series Press Presentation

  • 1. THE AMD EMBEDDED G-SERIES PLATFORM The World’s First APU for Embedded Systems Embargo until 12:01 a.m. EST 1/19/2011 1 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 2. Strong Commitment to x86 Embedded Systems Ball Grid Array (BGA) packaging introduced Addition of graphics and to meet customer chipset options for demand comprehensive The AMD Introduction of AMD64 embedded solution technology into Embedded G- The AMD embedded markets with Series Geode™ AMD Opteron™  Platform processor processor 2003 2004 2005 2006 2007 2008 2009 2010 2011 AMD increases performance and features, while driving down power, area, and price barriers for x86 in embedded 2 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 3. The Embedded Market is Key in AMD’s Strategy  Market is huge and growing 10%+ per year growth in the CPU market for embedded applications¹ The x86 CPU SAM² is more than 3B/year in 2010 alone² >350% growth for AMD’s 64-bit embedded CPU/chipset business in just 3 years³ This market wants innovative, complete platforms Systems are more compute intensive with high-performance graphics requirements ¹ As predicted by VDC research 2009 Global Embedded Market Analysis ² “Served Available Market”; as estimated by VDC research 2009 Global Embedded Market Analysis ³ Based on AMD internal data 2007-2010 3 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 4. The Next Step Forward for AMD in Embedded: AMD G-Series Platform We live in an always-on environment that requires high performance. There is an ongoing push for decreased power, smaller size, higher capability systems at lower prices. There is a strong visual element and Today, AMD is delivering the world’s first and  growing need for quality graphics in only APU for embedded systems, many embedded markets incorporating the new, very low power x86 “Bobcat” core with a world-class DirectX® 11- capable GPU on a single piece of silicon. 4 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 5. Traditional Vertical Markets Thin-clients Medical Imaging Point-of-sale (POS) Gaming Machines & Kiosk Systems Digital Signage Single Board Computing (SBC) Small/Home Office to Enterprise Industrial Controls Storage Ruggedized, Field, Telecommunications & Military Systems & Networking 5 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 6. The Future of Embedded Systems is Here More compelling designs in traditional markets Incredible user experiences in smaller form factors Enabling brand new markets and products in a world of connected devices 3.5” Single Board Computer 6 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 7. The AMD Fusion Family of Accelerated Processing Units APU External Multi-Core CPUs GPU sub-systems CPU Serial Data Processing GPU Parallel Data Video Display General General Program Program Processing Task Task Graphics ATI Stream • General-purpose, Designed for: programmable scalar and Designed for: vector processor cores, form General purpose tasks Specialized tasks heterogeneous capability (e.g. graphics, video) Most common applications • High-speed bus Most visual applications Data processing serially architecture Data processing in • Shared, low-latency parallel memory model • All on the same die 7 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 8. The AMD Embedded G-Series Platform: APU + Fusion Controller Hub APU • 2 x86 CPU Cores (40nm “Bobcat” core – 1 MB L2, 64-bit FPU) • C6 and power gating • Array of SIMD Engines – DX11 graphics performance – Industry leading 3D and graphics processing • 3rd Generation Unified Video Decoder – H.264, VC1, DixX/Xvid format • Two dedicated digital display interfaces – Configurable externally as HDMI, DVI, and/or Display Port – Also supports a single link LVDS for internal panels • Integrated VGA DDR3 800-1066, 2 DIMMs, 64 bit channel • BGA package AMD Fusion Controller Hub for display and I/O • 4x1 PCIe® • “Hudson” Fusion Controller Hub 8 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 9. Developer Support Reference designs, development boards, and schematics Support for differentiated embedded products at every phase Design Development Go-to-market Commitment to an open ecosystem for embedded developers 9 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 10. Current Customer Systems 10 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 11. Select AMD Embedded G-Series Platform Customer and Partners 11 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 12. The AMD Embedded G-Series Platform In Summary AMD’s strong commitment to embedded is in a separate  league •The world’s first and only APU for embedded systems •Cutting-edge AMD Fusion technology •Immediately available for embedded •Driving down power consumption and board area •Leveraging open and industry standards •Improving time to market The premier solution for a new generation of differentiated, small form factor embedded systems that consume less power, yet deliver improved performance and features, including an outstanding visual experience 12 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 13. BACKUP 13 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 14. Features that “Shrink the Design, Not the Performance” Packaging Direct Connect Enterprise-class Scalability Architecture Features BGA and lidless options Multi-core leadership ECC Socket-compatibility for easy design Virtualization upgrade Low-z-height for small, Low memory latency compact form factors Multiple power DDR3 memory management/ reduction Easy migration path to Small area footprint features higher performance High-performance I/O with Reliability HyperTransport™ 3.0  Chipset & graphics Enhanced virus protection technology compatibility Low cost No compromise on Clear roadmap Consistent 64-bit capability application performance progression Fanless operation 14 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 15. With the AMD Embedded G-Series Platform: Further Shrink the Design, Improve the Experience Reduced Board Integrated Graphics Rich Display and I/O Low Idle Space Performance Support Power World-class integrated AMD Radeon™ graphics core with  Up to 6 digital display Optimized display refresh DirectX® 11 support Brings together CPU and ports connect one minimizes DRAM activity GPU into a single, smaller Low Latency, high-bandwidth HDMI™, multiple DP, or  during idle states, does package memory access enables high DVI displays and docks not require external I/O or performance graphics chipset activity DirectCompute 11 Easy migration path to Smooth playback of Blu-ray titles PCIe® general purpose higher performance ports provide low-latency, Enables small form factors Up to 1080p video playback high bandwidth I/O direct UVD 3.0 offloads video with high levels of SoC supported (18W processors and to memory to support decode dramatically integration above only) demanding peripherals reducing CPU loading Up to 2560x1600 display during video playback resolution 15 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 16. New Low-Power "Bobcat" x86 Core Advanced Micro-architecture  Dual x86 Decode  Advanced Branch Predictor ICACHE  Out-of-Order Instruction Execution “Bobcat”  L2 – Full OOO Instruction Execution Low-Power Fetch – Full OOO Load/Store Engine Core  High Performance Floating Point  AMD64 64-bit ISA Decode BU  SSE1,2,3, SSSE3 ISA, SSE4A  Secure Advanced Virtualization  32KB L1s, 512KB L2 Low Power Design Integer Address FP  Power Optimized Execution Scheduler Scheduler Scheduler  Micro-architecture that minimizes data movement and unnecessary reads  Clock Gating, Power Gating I I Load Store A M  System Low Power States Pipe Pipe Pipe Pipe Pipe Pipe  Sub 1W capable Small Core DCACHE  Mainstream performance in less than half of the silicon area of previous solutions  40nm / 10 metal layer process 16 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 17. Better Footprint than Intel Atom Solutions To scale 2.7W-4.7W = 11.7W-22.7W AMD Embedded G-Series Platform 9,18W Controller FT1 APU Hub = 890mm2 361mm2 529mm2 413 balls 605 balls = 1018 balls 2.7-3.9W 1.55W = 4.25W-5.45W Intel Atom E6xx Series Intel Intel EG20T FCBGA559 Atom 600 Controller = 1013mm2 Series Hub 484mm2 529mm2 = 1052 balls Source: http://download.intel.com/embedded/processors/prodbrief/324100.pdf 676 balls 376 balls 2.5-4.3W = 8W-17.3W Intel Atom 400 and 500 Series 5.5-13W Intel Intel FCBGA559 Atom ICH9 I/O = 1445mm2 400-500 Controller Source: http://ark.intel.com/Product.aspx?id=29823&code=82801HM and 484mm2 = 1235 balls http://download.intel.com/embedded/processors/prodbrief/323288.pdf 559 balls 961mm2 676 balls 17 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 18. Better Footprint : AMD Embedded G-Series Platform vs. Intel Core i5-520M To scale AMD Embedded G-Series Platform 9,18W 2.7W-4.7W = 11.7W-22.7W FT1 APU Controller = 890mm2 Hub 361mm2 413 balls 529mm2 = 1018 balls 605 balls Intel Core i5-520M 35W =38.5W 3.5W Intel Intel Core i5- QM57 = 1627mm2 BGA1288 Controller 520M Hub = 2359 balls 675mm2 1071 balls 952mm2 1288 balls 82% larger footprint with more than 2X balls to route Source: http://ark.intel.com/Product.aspx?id=47341 and http://ark.intel.com/chipset.aspx?familyID=43185 18 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11
  • 19. DISCLAIMER The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors. The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes. AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. ATTRIBUTION © 2011 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD arrow logo, AMD Geode, AMD Sempron, AMD Turion, AMD Opteron, and combinations thereof, are trademarks of Advanced Micro Devices, Inc. All other products names and logos are for reference only and may be trademarks of their respective owners. 19 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11